• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.10
• /
• pp.916-922
• /
• 2008

AC PDP with MgO protective layer coated with the optimum evaporation rate of $5{\AA}/s$ can generate more enhanced efficiency through the vacuum in-line sealing process. However, the optimized process conditions still require the optimum driving scheme on the ramp-up and ramp-down slope of the reset waveform for enhancing the efficiency. In this paper, for the in-situ vacuum sealed PDP with the optimum evaporation rate of MgO protective layer, the address delay time was investigated with various slopes of ramp waveform during a reset ramp-up and ramp-down period. In this study, the minimum statistical delay time was obtained at the ramp-up rate of $6.0 V/{\mu}s$ and the ramp-down rate of $0.7 V/{\mu}s$ of the reset waveform.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2000.01a
• /
• pp.147-148
• /
• 2000

Sealing of two glass plates composing of FED panel was done in a vacuum chamber. Several factors related with a heating process of a frit glass were investigated, including comparisons with a conventional method.

• Journal of Sensor Science and Technology
• /
• v.29 no.5
• /
• pp.354-359
• /
• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.

• 제어로봇시스템학회:학술대회논문집
• /
• 2000.10a
• /
• pp.337-337
• /
• 2000

This paper describes a Chuck System developed for scaling PDP gas hole on PDP panel glass. There are lots of constraints for designing Chuck System: high temperature, high vacuum, precious motor control etc. A such constraints was considered by design of structure and by selecting of parts and material for Chuck System. The Chuck System was manufactured and assembled after the design process. It was applied on the PDP process unit. For sealing POP hole, precious control of a step motor was important in this system. For this experiment, a step motor, motor driver and micro controller(80196KC) were used.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.11
• /
• pp.976-980
• /
• 2002

This paper repors on low temperature sealing process of PDP using binder and capping glass. The exhausting hole on rear glass of PDP was sealed by capping glass using screen-printed binder without exhausting glass tube. Based on the tubeless packaging process, out gassing problem could be reduced and vacuum conductance could be improved by eliminating exhaust tube.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.95-96
• /
• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2009.06a
• /
• pp.169-170
• /
• 2009

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.23 no.5
• /
• pp.29-35
• /
• 2009

Field emission displays(FED) are currently being study as a potential flat technology. The purpose of this project shows the research result of vacuum packaging technology for the development of FED. For FED vacuum packaging, the bonding of glass/glass, the exhaust of vacuum and getter technology have been studied for vacuum packaging technology The simulation and vacuum sealing, and glass/glass bonding are also extensively studied. The glass/glass bonding is formed by using the frit glass and the Inside pressure of complete panel showed of $2{\times}10^{-5}$[Torr]. As a getter result, the increase of pressure has been showed the decrease of outgassing effect by using thin film getter.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.1
• /
• pp.31-38
• /
• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Korean Journal of Materials Research
• /
• v.28 no.12
• /
• pp.732-737
• /
• 2018

We develop a purification process of $Hg_2Br_2$ raw powders using a physical vapor transport(PVT) process, which is essential for the fabrication of a high performance acousto-optic tunable filter(AOTF) module. Specifically, we characterize and compare three $Hg_2Br_2$ powders: $Hg_2Br_2$ raw powder, $Hg_2Br_2$ powder purified under pumping conditions, and $Hg_2Br_2$ powder purified under vacuum sealing. Before and after purification, we characterize the powder samples through X-ray diffraction and X-ray photoelectron spectroscopy. The corresponding results indicate that physical properties of the $Hg_2Br_2$ compound are not damaged even after the purification process. The impurities and concentration in the purified $Hg_2Br_2$ powder are evaluated by inductively coupled plasma-mass spectroscopy. Notably, compared to the sample purified under pumping conditions, the purification process under vacuum sealing results in a higher purity $Hg_2Br_2$ (99.999 %). In addition, when the second vacuum sealing purification process is performed, the remaining impurities are almost removed, giving rise to $Hg_2Br_2$ with ultra-high purity. This high purification process might be possible due to independent control of impurities and $Hg_2Br_2$ materials under the optimized vacuum sealing. Preparation of such a highly purified $Hg_2Br_2$ materials will pave a promising way toward a high-quality $Hg_2Br_2$ single crystal and then high performance AOTF modules.