• Title/Summary/Keyword: Uniformity factor

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Improvement of the Weldability of Ni base Superalloy by using a New Powder Supply System (새로운 개념의 분말공급장치를 이용한 Ni기 초합금의 용접성 향상기술)

  • Chang, Yong Sung;Kim, Min Tae;Won, Jong Bum
    • Korean Journal of Metals and Materials
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    • v.46 no.4
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    • pp.241-248
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    • 2008
  • Gas turbine blades serviced for a period are usually repaired for reuse via "rejuvenation processes" including fluoride ion cleaning, brazing or welding, and recoating. Among these processes, the welding process is applied to rebuilt damaged parts of the blade in which welding materials being mostly Ni base superalloy are supplied in the form of powder or wire. When powder is used in the welding process, the uniform supply of powder is a very important factor for the uniformity of welding. According to our experience, the uniformity was very poor with the powder supply system only utilizing pressurized air flow. A new powder supply system was developed in which powder is supplied via air flow and simultaneously mechanically. The welding uniformity was much improved with this new system. In this study, the microstructure and mechanical properties of welded parts obtained from several kinds of powder using the new powder supply system were characterized.

The Prediction of Etching Characteristics Using Spray Characteristics in Etching Process of Lead-Frame (Lead-Frame 에칭공정에서 분무특성을 이용한 에칭특성의 예측)

  • Jeong Heung-Cheol;Choi Gyung-Min;Kim Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.4 s.247
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    • pp.381-388
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    • 2006
  • The objective of this study is to predict the etching characteristics using spray characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, uniformity were investigated on the actual operating conditions. The correlation between the etching characteristics and the spray ones obtained by measurement were analyzed to simulate the etching characteristics according to actual conditions of lead-frame etching process. These conditions of lead-frame process were spray pressure, distance from nozzle tip to substrate, pipe pitch, and nozzle pitch. To improve the etching characteristics in the lead-frame process, effects of the various operating conditions should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo method. The etching process model was coded by Java language. It was found that simulation results generally agreed well with the measured results of etching characteristics in lead-frame etching process. The optimal operating parameters were successfully found under variable conditions.

Improvement of Underground Parking Garages Lighting in Residential Areas (아파트의 지하주차장의 조명 운영개선)

  • Chang, Soo-Jung;Choi, An-Seop;Choi, Sung-Youl
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2004.11a
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    • pp.163-168
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    • 2004
  • The improvement of perspectives on dark and limited underground space could be an important factor in successful underground space development. Current trend in the apartment underground parking lot requires not only quantitatively energy efficient design and operation, but also qualitative improvement of the space. For this, we need to consider two factors: Firstly, to understand the characteristics of the fluorescent lamp. Secondly, to improve the uniformity ratio of illuminance. In winter season, a way to keep the uniformity and a method not to lower the indoor illuminance level by cold ambient air. Therefore, a change in interval and arrangement of the lighting fixtures is required. Also, in their operation, current time-fixed control method needs to be changed into the control that method considers the use pattern.

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A Study on the Experiment of Luminous Environment in Classroom of An Elementary School (초등학교 교실의 빛 환경 실측에 관한 연구)

  • Park, Kyung-Eun;Kim, Jun-Tae
    • Journal of the Korean Institute of Educational Facilities
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    • v.9 no.5
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    • pp.13-21
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    • 2002
  • Daylighting in educational environment is very important as it has an effect on students' performance as well as in their visual health. It is regarded as a good energy conservation method in saving energy used for lighting. This study conducted initial daylight measurements to analyze luminous environment in classrooms of Korean elementary school. The results indicated that the typical classroom had a reasonable level of daylight. However, it also found that the classroom had some problems of the uniformity of illuminance and the contrast of brightness of surfaces in the classroom. It is argued that daylighting design for school classroom should consider these aspects to make daylit classrooms ideal so as to provide comfortable visual environment.

Design and simulation of small size high-Tc superconducting magnet (소형 고온 초전도 마그넷 설계 및 시뮬레이션)

  • 김민기;강형곤;정동철;한병성
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1994.11a
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    • pp.192-197
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    • 1994
  • High-Tc superconducting magnet properties were dependent upon design conditions such as its radius, length, critical current and notch size. In order to study, design and the simulation for small size magnet were implemented. We know that intensity of magnetic fields controled by critical current and factor ${\alpha}$( R$_2$/R$_1$) and uniformity controled by notch size. The optimal condition of intensity and uniformity magnetic field in this experiments are R$_1$=3[cm], R$_2$=12[cm], Z=10[cm], ${\alpha}$=4, notch=6[cm], critical current=12[A].

Study on Coolant Passage for Improving Temperature Uniformity of the Electrostatic Chuck Surface (정전척 표면의 온도 균일도 향상을 위한 냉매 유로 형상에 관한 연구)

  • Kim, Dae-Hyeon;Kim, Kwang-Sun
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.3
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    • pp.72-77
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    • 2016
  • As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

A Study on the Effect of Roadside Trees' Layout Affecting Lighting Quality on Roadways by Simulation Approach (야간 도로조명에서 가로수의 배치가 조명품질에 미치는 영향에 관한 시뮬레이션 연구)

  • Lee, Jong-Sung;Lee, Seok-Jun
    • Journal of the Korea Safety Management & Science
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    • v.13 no.1
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    • pp.51-58
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    • 2011
  • The uniformity of lighting distribution on the roadway is essential factor for drivers and pedestrians's safety during nighttime in urban streets. Also, the importance of roadside trees is one of the growing concern for better citizens' health and mitigating environmental impact on the urban street. But roadway lightings and roadside trees have different design or planting standards and they are not integrated in the systemic viewpoint for better safety of users during nighttime. The purpose of this study is to propose a simulation approach which assesses lighting quality in the view of illumination uniformity distribution of roadway lighting from design step and consider the layout of roadside trees. For improving lighting quality of roadway, simulation approach is needed for assessing the impact of diverse planting situation of trees and encouraged from beginning of design step for roadway construction.

Numerical Analysis for the Flow Uniformity in the LP-SCR Reactor (LP SCR 반응기 내 유동 균일도 개선을 위한 해석적 연구)

  • Um, Hyung Sik;Kim, Gun Ho;Kim, Dae Hee;Kim, Kyu Jong;Kim, Jung Rae
    • 한국연소학회:학술대회논문집
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    • 2015.12a
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    • pp.61-63
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    • 2015
  • In the low pressure selective catalytic reduction (LP SCR) system, the uniformity of both ammonia concentration and exhaust gas flow at the SCR catalyst layer are important design factor for the efficient SCR-deNOx performance. According to the shape of the guide vane and static mixer, numerical simulations were conducted to analyze flow patterns and finally to find out the appropriate alternative for uniform flow at the front of catalyst in the real scale LP SCR reactor. The variations of gas velocity and ammonia concentration were quantitatively evaluated. Based on the present results, the shape was devised to satisfy the design criteria.

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A Study on Temperature Characteristics according to Ceramic Material Stacking Sequence of Electrostatic Chuck Surface (정전척 표면의 세라믹물질 적층 순서에 따른 온도 특성에 관한 연구)

  • Jang, Kyungmin;kim, Kwangsun
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.3
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    • pp.116-120
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    • 2017
  • Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

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A Study on Electrostatic Chuck Cooling by Ceramic Dielectric Material and Coolant path (세라믹 유전체 물질과 냉매 유로 형상에 따른 정전척 냉각에 관한 연구)

  • Kim, Daehyeon;Kim, Kwangsun
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.3
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    • pp.85-89
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    • 2018
  • Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials and inner coolant path on the chuck surface. Finally this study suggests the best cooling condition of electrostatic chuck.