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Study on Coolant Passage for Improving Temperature Uniformity of the Electrostatic Chuck Surface  

Kim, Dae-Hyeon (Department of Mechatronics Engineering, Korea University of Technology and Education)
Kim, Kwang-Sun (Department of Mechatronics Engineering, Korea University of Technology and Education)
Publication Information
Journal of the Semiconductor & Display Technology / v.15, no.3, 2016 , pp. 72-77 More about this Journal
Abstract
As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.
Keywords
Coolant; electrostatic chuck; CFD; Temperature Uniformity; Heat transfer;
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  • Reference
1 K. Asano, F. Hatakeyama, K. Yatsuzuka, "Fundamental Study of an electrostatic chuck for silicon wafer handling", IEEE TRANSACTION ON INDUSTRY APPLICATION, Vol. 38, No. 3, 2002.
2 L.D. Hartsough, "Electrostatic Wafer Holding", Solid state tech. 35, No. 1, pp. 87-90, 1993.
3 S. A. Khomyakov, "Attraction and Accuracy Characteristic of Electrostatic Chucks", Machines and Tooling 50, No. 3, pp.24-24, 1979.
4 Tretheway, D. and Aydil, E.S., "Modeling of Heat Transport and Wafer Healing Effects during Plasma Etching", J. Electrochem. Soc., Vol. 143, pp.3674-3680, 1996.   DOI
5 Daviet. J., Peccoud L., "Heat Transfer in a Micro Electronics Plasma Reactor", J. Appl. Phys, Vol. 73, pp.1471-1479, 1993.   DOI
6 Suhas V. Patankar(1980), Numerical Heat Transfer and Fluid Flow, McGrow-Hill Book Company.
7 CD-adapco(2016), STAR-CCM+ UserGuide ver. 11.02.