• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.7-12
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• 2010

Due to the extremely short interaction time (< $10\times10^{-12}$sec) between laser pulse and material, which enables the minimization of heat affection, ultrafast laser micro-machining has rapidly widened its applications. In this paper, the characteristics of ultrafast laser micro-machining have been reviewed and experimentally demonstrated in laser drilling of silicon wafer and in laser cutting of rigid PCB.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.6
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• pp.7-16
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• 2010

Physical fundamentals of ultrashort femtosecond lasers are addressed along with emerging applications for precision manufacturing and metrology. Femtosecond lasers emit short pulses whose temporal width is in the range of less than a picosecond to a few femtoseconds, thereby enabling extremely high peak-power machining with less thermal damages. Besides, the broad spectral bandwidth of femtosecond lasers constructed in the form of frequency comb permits absolute distance measurements leading to ultraprecision positioning control and dimensional metrology.

• Journal of Mechanical Science and Technology
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• v.19 no.6
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• pp.1378-1389
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• 2005

This work provides the fundamental knowledge of energy transport characteristics during very short-pulse laser heating of semiconductors from a microscopic viewpoint. Based on the self-consistent hydrodynamic equations, in-situ interactions between carriers, optical phonons, and acoustic phonons are simulated to figure out energy transport mechanism during ultrafast pulse laser heating of a silicon substrate through the detailed information on the time and spatial evolutions of each temperature for carriers, longitudinal optical (LO) phonons, acoustic phonons. It is found that nonequilibrium between LO phonons and acoustic phonons should be considered for ultrafast pulse laser heating problem, two-peak structures become apparently present for the subpicosecond pulses because of the Auger heating. A substantial increase in carrier temperature is observed for lasers with a few picosecond pulse duration, whereas the temperature rise of acoustic and phonon temperatures is relatively small with decreasing laser pulse widths. A slight lagging behavior is observed due to the differences in relaxation times and heat capacities between two different phonons. Moreover, the laser fluence has a significant effect on the decaying rate of the Auger recombination.

• Vacuum Magazine
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• v.2 no.1
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• pp.17-20
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• 2015

In this article, a historical and scientific review on the development of an ultrafast electron microscope is supplied, and the challenges in further improvement of time resolution under sub-picosecond or even sub-femtosecond scale is reviewed. By combining conventional scanning electron microscope and femtosecond laser technique, an ultrafast electron microscope was invented. To overcome its temporal resolution limit which originates from chromatic aberration and Coulomb repulsion between individual electrons, a generation of electron pulse via strong-field photoemission has been investigated thoroughly. Recent studies reveal that the field enhancement and field accumulation associated with the near-field formation at sharply etched metal nanoprobe enabled such field emission by ordinary femtosecond laser irradiation. Moreover, a considerable acceleration reaching 20 eV with near-infrared laser and up to 300 eV acceleration with mid-infrared laser was observed, and the possibility to control the amount of acceleration by varying the incident laser pulse intensity and wavelength. Such findings are noteworthy because of the possibility of realizing a sub-femtosecond, few nanometer imaging of nanostructured sample.in silicon as thermoelectric materials.

• Proceedings of the Optical Society of Korea Conference
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• 2005.02a
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• pp.10-11
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• 2005

• Journal of the Korean Society for Precision Engineering
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• v.29 no.6
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• pp.640-647
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• 2012

Current electronic products are dominated by the laser processing and the application will be extended this time. Especially, demands for high precision laser processing with a large area has been increasing for a number of applications such as in solar cell battery, display parts, electronic component and automobile industry. In this paper we designed an on-the-fly system for ultrafast/high precision/large area laser processing. In addition, we have developed the path algorithm for large area. Expansion of the area in which laser processing is an important factor to handle the ultrafast/wide area processing, it will require a processing path. Processing path is path of 2- axis stage and stage of change in velocity can be smooth as possible. We proposed a path of the user concept using NURBS(Non-Uniform Rational B-Spline)method. Through our experiment with the chopper, was to prove the continuity of edge parts. Through basic shape experiments, we proved that large area can be processed using laser. We developed a simulation tool using Visual C++.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.4
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• pp.155-160
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• 2019

Diamond Like Carbon (DLC) is a metastable form of amorphous carbon that have superior material properties such as high mechanical hardness, chemical inertness, abrasion resistance, and biocompatibility. Furthermore, its material properties can be tuned by additional doping such as nitrogen or boron. However, either pure DLC or doped DLC show poor adhesion property that makes it difficult to apply contact processing technique. Therefore we propose ultrafast laser micromachining which is non-contact precision process without mechanical degradation. In this study, we developed precision machining process of DLC thin film using an ultrafast laser by investigating the process window in terms of laser fluence and laser wavelength. We have also demonstrated various patterns on the film without generating any microcracks and debris.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.1
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• pp.24-30
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• 2011

PC-TEMs (Polycarbonate Track-Etched membranes) were micro-drilled for biomedical applications by ultrafast pulsed laser. The ablation and damage characteristics were studied on PE-TEMs by assuming porous thin membranes. The experiments were conducted in the range of 2.02 $J/cm^2$ and 8.07$J/cm^2$. The ablation threshold and damage threshold were found to be 2.56$J/cm^2$ and 1.14$J/cm^2$, respectively. While a conical shaped drilled holes was made in lower fluence region, straight shaped holes were drilled in higher fluence region. Nanoholes made the membrane as porous material and ablation characteristics for both bulk and thin film membranes were compared.

• Journal of the Korean Vacuum Society
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• v.16 no.1
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• pp.74-78
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• 2007

Much interests has been drawn for noble micro-engineering processes for the continuous size reduction on bulk materials from the field of micro-electronics with much downsized IC chips. A traditional microprocessing based on mechanical blade as well as a relatively long pulsed laser usually influence the physico-chemical properties of intact materials when the techniques are applied to process materials with a spatial resolution less than 10 microns. Meanwhile, ultrafast laser pulses are known to exhibit a very small heat-affect zone(HAE) compared to the traditional laser processing and to be applicable for the new functional materials with high performance in optical and electrical properties. In this report, we will review in brief the recent research works on the enhancement of micro-cutting speed of thin silicon wafer as well as the formation of Ge nanostructures based on ultrafast laser pulses.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.34-39
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• 2010

We developed a path algorithm for ultrafast/wide area laser processing. Demands for high precision laser processing with a wide area has been increasing for a number of applications such as in solar cell battery, display parts, electronic component and automobile industry. Expansion of the area in which laser processing is an important factor to handle the ultrafast/wide area processing, it will require a processing path. Processing path is path of 2- axis stage and stage of change in velocity can be smooth as possible. In this paper, we proposed a smoothingnurbs method of improved speed profile. This method creates soft path from edge part, it is main purpose that scan area ($50mm{\times}50mm$) inside processing path makes path of topology of possible straight line. We developed a simulation tool using Visual C++.