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Ultrafast Laser Micro-machining Technology  

Lee, Jae-Hoon (Korea Institute of Machinery & Materials)
Sohn, Hyon-Kee (Korea Institute of Machinery & Materials)
Publication Information
Journal of the Korean Society for Precision Engineering / v.27, no.2, 2010 , pp. 7-12 More about this Journal
Abstract
Due to the extremely short interaction time (< $10\times10^{-12}$sec) between laser pulse and material, which enables the minimization of heat affection, ultrafast laser micro-machining has rapidly widened its applications. In this paper, the characteristics of ultrafast laser micro-machining have been reviewed and experimentally demonstrated in laser drilling of silicon wafer and in laser cutting of rigid PCB.
Keywords
Ultrafast Lasers; Laser Micro-drilling; Laser Micro-cutting;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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