• Title/Summary/Keyword: UV etching

Search Result 143, Processing Time 0.027 seconds

A Study on the Characteristics of the Functional Groups of the Alkanethiol Molecules in UV Laser Photochemical Patterning and Wet Etching Process (UV Laser를 이용한 광화학적 패터닝과 습식에칭에 따른 알칸티올 분자 작용기의 특성 연구)

  • Huh, Kab-Soo;Chang, Won-Seok
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.24 no.5
    • /
    • pp.104-109
    • /
    • 2007
  • Photochemical patterning of self-assembled mono layers (SAMs) has been performed by diode pumped solid state (DPSS) 3rd harmonic Nd:$YVO_4$ laser with wavelength of 355 nm. SAMs patternings of parallel lines have subsequently been used either to generate compositional chemical patterns or fabricate microstructures by a wet etching. This paper describes a selective etching process with patterned SAMs of alkanetiolate molecules on the surface of gold. SAMs formed by the adsorption of alkanethiols onto gold substrate employs as very thin photoresists. In this paper, the influence of the interaction between the functional group of SAMs and the etching solution is studied with optimal laser irradiation conditions. The results show that hydrophobic functional groups of SAMs are more effective for selective chemical etching than the hydrophilic ones.

High density plasma etching of novel dielectric thin films: $Ta_{2}O_{5}$ and $(Ba,Sr)TiO_{3}$

  • Cho, Hyun
    • Journal of the Korean Crystal Growth and Crystal Technology
    • /
    • v.11 no.5
    • /
    • pp.231-237
    • /
    • 2001
  • Etch rates up to 120 nm/min for $Ta_{2}O_{5}$ were achieved in both $SF_{6}/Ar$ and $Cl_{2}/Ar$ discharges. The effect of ultraviolet (UV) light illumination during ICP etching on $Ta_{2}O_{5}$ etch rate in those plasma chemistries was examined and UV illumination was found to produce significant enhancements in $Ta_{2}O_{5}$ etch rates most likely due to photoassisted desorption of the etch products. The effects of ion flux, ion energy, and plasma composition on (Ba, Sr)$TiO_3$ etch rate were examined and maximum etch rate ~90 nm/min was achieved in $Cl_{2}/Ar$ ICP discharges while $CH_{4}/H_{2}/Ar$ chemistry produced extremely low etch rates (${\leq}10\;nm/min$) under all conditions.

  • PDF

Micromachining for plastic mold steel using DPSS UV laser and wet etching (DPSS UV Laser와 습식 식각을 이용한 금형강 미세 가공)

  • Min, Kyoung-Ik;Kim, Jae-Gu;Cho, Sung-Hak;Choi, Doo-Sun;Whang, Kyung-Hyun
    • Laser Solutions
    • /
    • v.12 no.3
    • /
    • pp.1-6
    • /
    • 2009
  • This paper describes the method for the fabrication of micro dot array on a plastic mold steel using DPSS (diode pumped solid-states) UV laser and wet etching process. We suggest the process of the ablation of a photoresist (PR) coated on plastic mold steel and wet etching process using solutions of various concentrations of $FeCl_3$, $HNO_3$ in water as etchant. This method makes it possible to fabricate metallic roller mold because the microstructures are directly fabricated on the metal surface. In the range of operating conditions studied, $17\;{\mu}J$ laser pulse energy and 50 ms laser exposure time, an etchant containing 40wt% $FeCl_3$, 5wt% $HNO_3$ and etch time for 45 s gave the $10\;{\mu}m$ of micro dot pattern on plastic mold steel.

  • PDF

Effect of Process Parameters of UV Enhanced Gas Phase Cleaning on the Removal of PMMA (Polymethylmethacrylate) from a Si Substrate

  • Kwon, Sung Ku;Kim, Do Hyun
    • Transactions on Electrical and Electronic Materials
    • /
    • v.17 no.4
    • /
    • pp.204-207
    • /
    • 2016
  • Experimental study of UV-irradiated O2/H2 gas phase cleaning for PMMA (Polymethylmethacrylate) removal is carried out in a load-locked reactor equipped with a UV lamp and PBN heater. UV enhanced O2/H2 gas phase cleaning removes polymethylmethacrylate (PMMA) better at lower process pressure with higher content of H2. O2 gas compete for UV (184.9 nm) absorption with PMMA producing O3, O(1D) and lower dissociation of PMMA. In our experimental conditions, etching reaction of PMMA at the substrate temperature between 75℃ and 125℃ had activation energy of about 5.86 kcal/mol indicating etching was controlled by surface reaction. Above the 180℃, PMMA removal was governed by a supply of reaction gas rather than by substrate temperature.

Evaluation Method for Graphene Grain Boundary by UV/ozone-oxidation Chemical-etching Process (UV/ozone 산화처리 및 화학적 식각공정을 적용한 그래핀 Grain Boundary 평가 방법)

  • Kang, Jaewoon;Park, Hongsik
    • Journal of Sensor Science and Technology
    • /
    • v.25 no.4
    • /
    • pp.275-279
    • /
    • 2016
  • Chemical vapor deposited (CVD) polycrystalline graphene is widely used for various sensor application because of its extremely large surface-to-volume ratio. The electrical properties of CVD-graphene is significantly affected by the grain size and boundaries (GGBs), but evaluation of GGB of continuous monolayer graphene is difficult. Although several evaluation methods such as tunneling electron microscopy, confocal Raman, UV/ozone-oxidation are typically used, they still have issues in evaluation efficiency and accuracy. In this paper, we suggest an improved evaluation method for precise and simple GGB evaluation which is based on UV/ozone-oxidation and chemical etching process. Using this method, we could observe clear GGBs of CVD-graphene layers grown by different process conditions and statistically evaluate average grain sizes varying from $1.69{\sim}4.43{\mu}m$. This evaluation method can be used for analyzing the correlation between the electrical properties and grain size of CVD-graphene, which is essential for the development of graphene-based sensor devices.

Photothermal and Photochemical Investigation on Laser Ablation of the Polyimide by 355nm UV Laser Processing (355nm UV 레이저 가공에 의한 폴리이미드의 광화학적 및 광열적 어블레이션에 관한 연구)

  • Oh, Jae-Yong;Shin, Bo-Sung
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.24 no.4 s.193
    • /
    • pp.147-152
    • /
    • 2007
  • UV laser ablation of polyimide is a combination of photochemical and photothermal mechanism. Photochemical mechanism is that molecular bonds are broken by photon energy and photothermal is evaporation and melt expulsion. When the laser processing, the etching depth needs to be calculated for prediction of processing result. In this paper, in order to predict the laser etching depth of polyimide by UV laser with the wavelength of 355nm, the theoretical model which includes both the photothermal and the photochemical effect was introduced. The model parameters were obtained by comparing with experimental results. The 3rd harmonic $Nd:YVO_4$ laser system was used in the experiment. From these experimental and theoretical results, the laser ablation of a polyimide was verified to achieve the highest quality microstructure.

Fabrication of Metallic Nano-filter Using UV-Imprinting Process (UV 임프린팅 공정을 이용한 금속막 필터제작)

  • Noh Cheol Yong;Lee Namseok;Lim Jiseok;Kim Seok-min;Kang Shinill
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2005.05a
    • /
    • pp.237-240
    • /
    • 2005
  • The demand of micro electrical mechanical system (MEMS) bio/chemical sensor is rapidly increasing. To prevent the contamination of sensing area, a filtration system is required in on-chip total analyzing MEMS bio/chemical sensor. A nano-filter was mainly applied in some application detecting submicron feature size bio/chemical products such as bacteria, fungi and so on. We suggested a simple nano-filter fabrication process based on replication process. The mother pattern was fabricated by holographic lithography and reactive ion etching process, and the replication process was carried out using polymer mold and UV-imprinting process. Finally the nano-filter is obtained after removing the replicated part of metal deposited replica. In this study, as a practical example of the suggested process, a nano-dot array was replicated to fabricate nano-filter fur bacteria sensor application.

  • PDF

Fabrication of Metallic Nano-Filter Using UV-Imprinting Process (UV 임프린팅 공정을 이용한 금속막 필터제작)

  • Noh Cheol Yong;Lee Namseok;Lim Jiseok;Kim Seok-min;Kang Shinill
    • Transactions of Materials Processing
    • /
    • v.14 no.5 s.77
    • /
    • pp.473-476
    • /
    • 2005
  • The demand of on-chip total analyzing system with MEMS (micro electro mechanical system) bio/chemical sensor is rapidly increasing. In on-chip total analyzing system, to detect the bio/chemical products with submicron feature size, a filtration system with nano-filter is required. One of the conventional methods to fabricate nano-filter is to use direct patterning or RIE (reactive ion etching). However, those procedures are very costly and are not suitable fur mass production. In this study, we suggested new fabrication method for a nano-filter based on replication process, which is simple and low cost process. After the Si master was fabricated by laser interference lithography and reactive ion etching process, the polymeric mold was replicated by UV-imprint process. Metallic nano-filter was fabricated after removing the polymeric part of metal deposited polymeric mold. Finally, our fabrication method was applied to metallic nano-filter with $1{\mu}m$ pitch size and $0.4{\mu}m$ hole size for bacteria sensor application.

Blind via Hole manufacturing technology using UV Laser (UV 레이저에 의한 블라인드 비아홀 가공)

  • 장정원;김재구;신보성;장원석;황경현
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2002.10a
    • /
    • pp.160-163
    • /
    • 2002
  • Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

  • PDF