• 제목/요약/키워드: Transfer device

검색결과 1,124건 처리시간 0.023초

임베디드 웹서버를 기반으로 한 분산제어 시스템 (Distributed Control System based on Embedded Webserver)

  • 남병근;한경호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 D
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    • pp.2717-2719
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    • 2001
  • In this paper The embedded Web or Hypertext Transfer Protocol (HTTP) server allows embedded systems developers to take advantage of a network infrastructure that is already in place to enhance their designs and provide new features for their customers. It has gained acceptance as a protocol for gleaning information from a wide variety of sources and its open extensible nature makes it suitable for the full range of networked embedded systems. Many companies are already building Web browser support into smart-phones and network computers, but the other end of the connection also has great potential for many more classes of embedded system. Once fitted with an embedded Web server, a device can report its status to any client on the network and can even be reprogrammed remotely to perform new tasks.

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전기기폭장치의 발열선에 설치되는 광섬유 센서의 최적위치 분석 (An Analysis of Optimized Position of the Fiber Optic Sensor Istalled near the Bridge Wire of Electro-explosive Device)

  • 김응조;윤기은;최태인;윤태훈;김재창
    • 한국전자파학회논문지
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    • 제10권7호
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    • pp.1111-1117
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    • 1999
  • EED 내부의 화약을 제거하고 광섬유센서를 발열선에 근접 설치하면 EED의 발열선 온도를 정확하게 측정 할 수 있다 .. EED의 발열 선과 광섬유 센서간의 이격할 수 있는 최적거리 계산을 열전달 이론에 근거하여 구 하였고. 발열선의 온도-이격거리 관계식을 도출하였다. 연구결과는 외부 전자파환경에 의해서 유기된 전류로 인해 발생되는 발열선의 온도를 측정하는 전자파방사 위해도 시험에 활용할 수 있다.

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초고추파 집적 회로를 위한 새로운 실리콘 MEMS 패키지 (THe Novel Silicon MEMS Package for MMICS)

  • 권영수;이해영;박재영;김성아
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권6호
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    • pp.271-277
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    • 2002
  • In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

자기적으로 결합된 PCB 권선을 이용한 무접점 배터리 충전기 (A New Contactless Battery Charger Using Planner Printed Circuit Board Windings)

  • 노재현;강용한;최병조;안태영
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2001년도 전력전자학술대회 논문집
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    • pp.634-637
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    • 2001
  • The proposed contactless charger employs a pair of neighboring printed circuit board windings as a contactless energy transfer device, thereby making it amenable to low-profile designs and suitable for applications to the portable telecommunication/computing electronics in which stringent requirements for height, space, and reliability have to be met. The performance of the proposed charger is confirmed with experiments on a prototype charger developed for cellular phones.

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견인곡사포용 이동대차형 포탄 이송장치의 인간공학적 적합성 검증 (Ergonomic Verification of Suitability of the 4-Wheeled Hand Cart to Transfer a Projectile for Towed Howitzer)

  • 박성호
    • 대한산업공학회지
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    • 제42권3호
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    • pp.165-172
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    • 2016
  • The purpose of this study is to investigate the ergonomic verification of suitability of the 4-wheeled hand cart to prevent musculoskeletal problems in the firing test range. Because of the increasing amount of firing test, the needs to develop a projectile transferring device such as 4-wheeled hand cart has been increased. For the 4-wheeled hand cart, the lifting and carrying activity in the manual handling method were transformed to pushing activity. The risk of low back pain for lifting and carrying the projectile by manual was estimated by NLE and 3D SSPP. On the other hand, the risk for pushing the 4-wheeled hand cart was estimated by psychophysical and biomechanical method such as Mital's equation, Snook's table and 3D SSPP. It was shown that the 4-wheeled hand cart reduced the risk of low back pain drastically with higher efficiency and design compatibility.

0.25 mm 초박형 두께를 가지는 회로기판형 리드프레임 백색 LED 램프 (Super Thin 0.25 mm Thickness White LED Lamp with PCB Type Lead Frame)

  • 유순재;김도형
    • 한국전기전자재료학회논문지
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    • 제23권1호
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    • pp.34-37
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    • 2010
  • 0.25 mm thickness super thin surface mounted device LED Lamp is developed with PCB type lead frame in which BT (Bismaleimide Triazine) resin is used. BT resin is removed by a laser beam in order to reduce the thermal resistance below $1\;^{\circ}C/W$ and transfer molding is used with silicone. Compared to conventional 0.4 mm thickness LED lamp, the developed LED lamp can be derived in high current and the luminance of the LED lamp is increased up to 240 mA.

Effect of Post Annealing in Oxygen Ambient on the Characteristics of Indium Gallium Zinc Oxide Thin Film Transistors

  • Jeong, Seok Won
    • 한국전기전자재료학회논문지
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    • 제27권10호
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    • pp.648-652
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    • 2014
  • We have investigated the effect of electrical properties of amorphous InGaZnO thin film transistors (a-IGZO TFTs) by post thermal annealing in $O_2$ ambient. The post-annealed in $O_2$ ambient a-IGZOTFT is found to be more stable to be used for oxide-based TFT devices, and has better performance, such as the on/off current ratios, sub-threshold voltage gate swing, and, as well as reasonable threshold voltage, than others do. The interface trap density is controlled to achieve the optimum value of TFT transfer and output characteristics. The device performance is significantly affected by adjusting the annealing condition. This effect is closely related with the modulation annealing method by reducing the localized trapping carriers and defect centers at the interface or in the channel layer.

펠티에 소자 및 히트싱크를 이용한 최적 냉각성능에 관한 연구 (Investigation of the Optimal Cooling Performance Using Peltier Module and Heat Sink)

  • 이동렬
    • 동력기계공학회지
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    • 제10권4호
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    • pp.65-70
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    • 2006
  • This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

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냉장고 냉매 소음의 저감에 관한 연구 (A Study on Reduction of Refirigerant Noise in Household Refrigerator)

  • 최성원;황원걸;설승윤;임형은;김상수
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2004년도 추계학술대회논문집
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    • pp.1062-1066
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    • 2004
  • In this study, refrigerant noise at connection of capillary tube and evaporator is investigated. Mechanism of refrigerant noise generation is examined in side-by-side type home refrigerator with two evaporators. It is found that the refrigerant noise is generated during refrigeration room fan-off (R-fan of) for that type refrigerator. The reason is that mass flow rate gets down during R-fan of and flow pattern is changed at outlet of capillary tube. We suggest designs for reduction of refrigerant noise with horizontal double expansion device, muffler, and accumulator. To evaluate those improved designs, sound quality index is used.

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래디알 동전기 휠의 다축력 특성 (Multi-axial Force Characteristics of Radial Electrodynamic Wheel)

  • 정광석
    • 융복합기술연구소 논문집
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    • 제7권2호
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    • pp.1-5
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    • 2017
  • The rotating electrodynamic wheel over a conductive plate produces thrust force as well as normal force. Specially, separating the conductive plate and spacing apart each part, the lateral stability of the rotating wheel is guaranteed due to the restoring force into neutral position. In this paper, the force characteristics of the electrodynamic wheel rotating over the conductive plate is analyzed using the finite element tool. First, the dominant parameters are identified considering the geometric configuration and the operating condition. And the sensitivity for the parameter deviation is quantified for the high force density. The above topology can be applied as an actuating principle for inter-city train as well as contact-free transfer device.