• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2717-2719
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• 2001

In this paper The embedded Web or Hypertext Transfer Protocol (HTTP) server allows embedded systems developers to take advantage of a network infrastructure that is already in place to enhance their designs and provide new features for their customers. It has gained acceptance as a protocol for gleaning information from a wide variety of sources and its open extensible nature makes it suitable for the full range of networked embedded systems. Many companies are already building Web browser support into smart-phones and network computers, but the other end of the connection also has great potential for many more classes of embedded system. Once fitted with an embedded Web server, a device can report its status to any client on the network and can even be reprogrammed remotely to perform new tasks.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.7
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• pp.1111-1117
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• 1999

In order to measure the temperature of bridge wire, the explosive material is removed from EED and a fiber optic temperature sensor is installed near the bridge wire. Using the heat transfer theory, the optimum position of the fiber optic sensor in the EED is determined and the temperature-distance equation is derived from test result. The measuring technique can be utilized to the real electromagnetic radiation hazard test.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.6
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• pp.271-277
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• 2002

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

• Proceedings of the KIPE Conference
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• 2001.07a
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• pp.634-637
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• 2001

The proposed contactless charger employs a pair of neighboring printed circuit board windings as a contactless energy transfer device, thereby making it amenable to low-profile designs and suitable for applications to the portable telecommunication/computing electronics in which stringent requirements for height, space, and reliability have to be met. The performance of the proposed charger is confirmed with experiments on a prototype charger developed for cellular phones.

• Journal of Korean Institute of Industrial Engineers
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• v.42 no.3
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• pp.165-172
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• 2016

The purpose of this study is to investigate the ergonomic verification of suitability of the 4-wheeled hand cart to prevent musculoskeletal problems in the firing test range. Because of the increasing amount of firing test, the needs to develop a projectile transferring device such as 4-wheeled hand cart has been increased. For the 4-wheeled hand cart, the lifting and carrying activity in the manual handling method were transformed to pushing activity. The risk of low back pain for lifting and carrying the projectile by manual was estimated by NLE and 3D SSPP. On the other hand, the risk for pushing the 4-wheeled hand cart was estimated by psychophysical and biomechanical method such as Mital's equation, Snook's table and 3D SSPP. It was shown that the 4-wheeled hand cart reduced the risk of low back pain drastically with higher efficiency and design compatibility.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.34-37
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• 2010

0.25 mm thickness super thin surface mounted device LED Lamp is developed with PCB type lead frame in which BT (Bismaleimide Triazine) resin is used. BT resin is removed by a laser beam in order to reduce the thermal resistance below $1\;^{\circ}C/W$ and transfer molding is used with silicone. Compared to conventional 0.4 mm thickness LED lamp, the developed LED lamp can be derived in high current and the luminance of the LED lamp is increased up to 240 mA.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.648-652
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• 2014

We have investigated the effect of electrical properties of amorphous InGaZnO thin film transistors (a-IGZO TFTs) by post thermal annealing in $O_2$ ambient. The post-annealed in $O_2$ ambient a-IGZOTFT is found to be more stable to be used for oxide-based TFT devices, and has better performance, such as the on/off current ratios, sub-threshold voltage gate swing, and, as well as reasonable threshold voltage, than others do. The interface trap density is controlled to achieve the optimum value of TFT transfer and output characteristics. The device performance is significantly affected by adjusting the annealing condition. This effect is closely related with the modulation annealing method by reducing the localized trapping carriers and defect centers at the interface or in the channel layer.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.65-70
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• 2006

This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.11a
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• pp.1062-1066
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• 2004

In this study, refrigerant noise at connection of capillary tube and evaporator is investigated. Mechanism of refrigerant noise generation is examined in side-by-side type home refrigerator with two evaporators. It is found that the refrigerant noise is generated during refrigeration room fan-off (R-fan of) for that type refrigerator. The reason is that mass flow rate gets down during R-fan of and flow pattern is changed at outlet of capillary tube. We suggest designs for reduction of refrigerant noise with horizontal double expansion device, muffler, and accumulator. To evaluate those improved designs, sound quality index is used.

• Journal of Institute of Convergence Technology
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• v.7 no.2
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• pp.1-5
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• 2017

The rotating electrodynamic wheel over a conductive plate produces thrust force as well as normal force. Specially, separating the conductive plate and spacing apart each part, the lateral stability of the rotating wheel is guaranteed due to the restoring force into neutral position. In this paper, the force characteristics of the electrodynamic wheel rotating over the conductive plate is analyzed using the finite element tool. First, the dominant parameters are identified considering the geometric configuration and the operating condition. And the sensitivity for the parameter deviation is quantified for the high force density. The above topology can be applied as an actuating principle for inter-city train as well as contact-free transfer device.