• 제목/요약/키워드: TiAl intermetallic

검색결과 102건 처리시간 0.019초

Na$_2$B$_4$O$_7$-KCl-LiCl 혼합용융욕에서 TiAl계 금속간 화합물의 전해붕화처리 (Electrolytic Boronzing on TiAl-based Intermetallic Compounds in Fused Salt of Borax, Potassium Chloride and Lithium Chloride Mixture)

  • 이두환;김익범;이주호;김수식
    • 한국표면공학회지
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    • 제31권6호
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    • pp.359-370
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    • 1998
  • TiAl-based intermetallic compounds were electro-bornizel in the mixture of $Na_2B_4O_7$, KCL and LiCl in the termetature rage between 850 and $1000^{\circ}C$for various times (1-5 hours)under the fixed current density of 0.5 A/$cm^2$. The optimized composition of electrolyte in this work was decided to be 76.9 wt% $Na_2B_4O_7$-19.2 wt.%(0.7KCl-0.3LiCl) -3.9 wt.% al. The samples with boronized layer were investigated by SEM, XRD and EDS. The surface micro-hardness of boronized TiAl was also evaluated using Micro Vickers Hardness Tester. The sample, boronized at $900^{\circ}C$ for 4 hours in the above composition of electrolyte under the current density of 0.5 A/$\textrm{cm}^2$, has about 36$\mu\textrm{m}$ think layer on the surface, and its surface micro-hardness was measured to be 1263 Hv. From the results of SEM, XRD and EDS, the layer consisted of $TiB_2$ sublayer and Al-oxide sub layer. Al-depleted layer below the Al-oxide sudlayer was also detected. The activation energy for formation of boronized layer in this study was calculated as 178 Kcal/moleK.

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친환경 자동차산업의 용사(Thermal spray)에 대한 최신 연구동향 (Recent Study of Thermal Spray for Green Automotive Industry)

  • 유호천
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.43-52
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    • 2014
  • Recent developing tendency of thermal spray for green automotive industry are studied by searching of NDSL, KIPRIS, ScienceDirect and so on. Spraying techniques such as plasma spray, microwave treatment, dry-ice blasting, HVOF thermal spray, cold spraying, aerosol deposition are introduced, further more spraying materials such as nano particles, intermetallic compound, TiAlN, TiC, Si-Al alloys are investigated.

FeRAM 소자 제작 중에 발생하는 Pt/Al 반응 기구 (Pt/Al Reaction Mechanism in the FeRAM Device Integration)

  • 조경원;홍태환;권순용;최시경
    • 한국재료학회지
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    • 제14권10호
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    • pp.688-695
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    • 2004
  • The capacitor contact barrier(CCB) layers have been introduced in the FeRAM integration to prevent the Pt/Al reaction during the back-end processes. Therefore, the interdiffusion and intermetallic formation in $Pt(1500{\AA})/Al(3000{\AA})$ film stacks were investigated over the annealing temperature range of $100\sim500^{\circ}C$. The interdiffusion in Pt/Al interface started at $300^{\circ}C$ and the stack was completlely intermixed after annealing over $400^{\circ}C$ in nitrogen ambient for 1 hour. Both XRD and SBM analyses revealed that the Pt/Al interdiffusion formed a single phase of $RtAl_2$ intermetallic compound. On the other hand, in the presence of TiN($1000{\AA}$) barrier layer at the Pt/Al interface, the intermetallic formation was completely suppressed even after the annealing at $500^{\circ}C$. These were in good agreement with the predicted effect of the TiN diffusion barrier layer. But the conventional TiN CCB layer could not perfectly block the Pt/Al reaction during the back-end processes of the FeRAM integration with the maximum annealing temperature of $420^{\circ}C$. The difference in the TiN barrier properties could be explained by the voids generated on the Pt electrode surface during the integration. The voids were acted as the starting point of the Pt/Al reaction in real FeRAM structure.

기계적 합금화에 의해 제조된 AS-Ti합금의 고온압축성질 (Elevated Temperature Compressive Properties of Al-Ti Alloys Prepared by Mechanical Alloying)

  • 이광민
    • 한국분말재료학회지
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    • 제5권2호
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    • pp.129-132
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    • 1998
  • The elevated temperature compressive tests were carried out in order to investigate the deformation behavior and microstructural characteristics of Al-8%Ti, Al-12%Ti and Al-16%Ti (wt%) alloys, which were mechanically alloyed and consolidated by vacuum hot pressing, A13Ti intermetallic phases were formed with sizes of few hundred nanometers in the mechanically alloyed Al-Ti alloys. The compressive strength of mechanically alloyed AA-Ti alloys increased with decroasing the temperature and with increasing the strain rate. The strain rate sensitivities of Al-8%Ti, Al-12%Ti and Al-16%Ti alloys were measured 0.02,0.03, and 0.14, respectively, at 35$0^{\circ}C$.

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Effect of Aluminium Content on High Temperature Deformation Behavior of TiAl Intermetallic Compound

  • Han, Chang-Suk
    • 한국재료학회지
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    • 제25권8호
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    • pp.398-402
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    • 2015
  • Fundamental studies of microstructural changes and high temperature deformation of titanium aluminide (TiAl) were conducted from the view point of the effect of Al content in order to develop the manufacturing process of TiAl. Microstructures in an as cast state consisted mainly of lamellar structure irrespective of Al content. By homogenization at 1473 K, the microstructures of Ti-49Al and Ti-51Al were transformed into an equiaxial structure which was composed of ${\gamma}$-TiAl, while the lamellar structure that was observed in Ti-46Al and Ti-47Al was much more stable. We found that the reduction of Al content suppressed the formation of equiaxial grains and resulted in a microstructure of only a lamellar structure. On Ti-49Al and Ti-51Al, dynamic recrystallization occurred during high temperature deformation, and the microstructure was transformed into a fine equiaxial one, while the microstructures of Ti-46Al and Ti-47Al contained few recrystallized grains and consisted mainly of a deformed lamellar structure. We observed that on the low-Al alloys the lamellar structure under hard mode deformation conditions deformed as kink observed B2-NiAl. High temperature deformation characteristics of TiAl were strongly affected by Al content. An increase of Al content resulted in a decrease of peak stress and activation energy for plastic deformation and an increase of the recrystallization ratio in TiAl.

TiAl에 석출한 질화물의 결정구조와 형태 (Crystal Structure and Morphology of Nitride Precipitates in TiAl)

  • 한창석;구경완
    • 한국재료학회지
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    • 제18권1호
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    • pp.51-56
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    • 2008
  • The crystal structures and morphologies of precipitates in $L1_0$-ordered TiAl intermetallics containing nitrogen were investigated by transmission electron microscopy (TEM). Under aging at an approximate temperature of 1073 K after quenching from 1423 K, TiAl hardens appreciably due to the nitride precipitation. TEM observations revealed that needle-like precipitates, which lie only in one direction parallel to the [001] axis of the $L1_0$-TiAl matrix, appear in the matrix preferentially at the dislocations. Selected area electron diffraction (SAED) pattern analyses showed that the needle-shaped precipitate is perovskite-type $Ti_3AlN$ (P-phase). The orientation relationship between the P-phase and the $L1_0$-TiAl matrix was found to be $(001)_P//(001)_{TiAl}\;and\;[010]_P//[010]_{TiAl}$. By aging at higher temperatures or for longer periods at 1073 K, plate-like precipitates of $Ti_2AlN$ (H-phase) with a hexagonal structure formed on the {111} planes of the $L1_0$-TiAl matrix. The orientation relationship between the $Ti_2AlN$ and the $L1_0$-TiAl matrix is $(0001)_H//(111)_{TiAl}\;and\;_H//_{TiAl}$.

Intermetallic Compound Formation Behavior and Bump Shear strength at Sn-In Eutectic Solder/UBM Interface

  • 최재훈;전성우;정부양;오태성;김영호
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.99-102
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    • 2003
  • Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

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열처리에 따른 TiAl금속간화합물의 층상조직 변화 (Changes of Lamellar Structure of TiAl Intermetallic Compound Heat Treatment)

  • 신재관;정인상;박경채
    • 열처리공학회지
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    • 제6권3호
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    • pp.127-137
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    • 1993
  • The changes of lamellar(${\alpha}_2+{\gamma}$) structure of TiAl intermetallic compound which is a high potential, high temperature aerospace material was investigated by heat treatment. The lamellar structure was short and made subgrain in prior a grains after homogenizing at 1523 K. It became longer and finer, and the subgrain went out during subsequent isothermal heatteating at 1273 K. The yield, fracture strength and strain to fracture if the heat treated specimens was increased and the hardness of them was decreased a little in the finer lamellar structure, because fine lamellar interface, sugrain boundary and grain boundary may block initiation and propagation of crack.

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기계적 분쇄화 및 스파크 플라즈마 소결에 의한 TiAl 합금의 제조 (Fabrication of TiAl Alloys by Mechanical Milling and Spark Plasma Sintering)

  • 김민수;김준식;황승준;홍영환;오명훈
    • 열처리공학회지
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    • 제17권1호
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    • pp.17-22
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    • 2004
  • In the present study, newly developed spark plasma sintering(SPS) technique was introduced to refine the grain size of ${\gamma}$-based TiAl intermetallic compounds. Ti-46Al-1.5Mo and Ti-46Al-1.5Mo-0.2C(at%) prealloyed powders were produced by mechanical milling(MM) in high-energy attritor. The mechanically milled powders were characterized by XRD and SEM for the microstructural evolution as a function of milling time. And then, the MMed powders were sintered by both spark plasma sintering and hot pressing in vacuum (HP). After the sintering process, MM-SPSed specimens were heat-treated in a vacuum furnace (SPS-VHT) and in the SPS equipment(MM-SPS) for microstructural control. It was found from microstrutural observation that the microstructure consisting of equiaxed ${\gamma}$-TiAl with a few hundred nanometer in average size and ${\alpha}_2-Ti_3Al$ particles were formed after both sintering processes. It was also revealed from hardness test and three-point bending test that the effect of grain refinement on the hardness and bending strength is much higher than that of carbon addition. The fully lamellar microstructures, which is less than $80{\mu}m$ in average grain size was obtained by SPS-VHT process, and the fully lamellar microstructure which is less than $100{\mu}m$ in average grain size was obtained by MM-SPS for a relatively shorter heat-treatment time.