• Korean Journal of Materials Research
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• v.27 no.5
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• pp.289-293
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• 2017

$Y_2Ti_2O_7$ nanoparticles (0.3 mol%) have been successfully synthesized by the co-precipitation process. The samples, adjusted to pH7 with ammonia solution as catalyst and calcined at $700{\sim}900^{\circ}C$, exhibit very fine particles with close to spherical shape and average size of 10-30 nm. It was possible to control the size of the synthesized $Y_2Ti_2O_7$ particles by manipulating the conditions. The $Y_2Ti_2O_7$ nanoparticles were coated on a glass substrate by a dipping coating process with inorganic binder. The $Y_2Ti_2O_7$ solution coated on the glass substrate had excellent adhesion of 5B; pencil hardness test results indicated an excellent hardness of 6H. The thickness of the thick film was about $30{\mu}m$. Decomposition of MB on the $Y_2Ti_2O_7$ thin film shows that the photocatalytic properties were excellent.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.100-100
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• 2010

Hydrophilic $TiO_2$ films were deposited on slide glasses using titanium tetraisopropoxide (TTIP) as a precursor by metal-organic chemical vapor deposition (MOCVD). The temperature of substrate was $400^{\circ}C$ and the temperatures of precursor were kept at $75^{\circ}C$ (sample A) and $60^{\circ}C$ (sample B) during the $TiO_2$ film growth. The deposited $TiO_2$ films were characterized by contact angle measurement and uv/vis spectroscopy. The result show that sample B has very low contact angle of almost zero due to superhydrophilic $TiO_2$ surface and transmittance is $76.85%{\pm}1.47%$ at the range of 400 - 700 nm. So, this condition is very optimal for hydrophilic $TiO_2$ film deposition. However, when the temperature of precursor is lower is lower than $50^{\circ}C$ or higher than $75^{\circ}C$, $TiO_2$ could not be deposited on the substrate and cloudy $TiO_2$ film was formed due to low precursor temperature and the increase of surface roughness, respectively.

• Journal of the Korean Society for Heat Treatment
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• v.18 no.4
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• pp.229-234
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• 2005

Effect of incident ion beam energy on microstructure and adhesion behavior of TiN thin films were studied. Without ion beam assist, TiN film showed (111) growth mode which was thought to have the lowest deformation energy. As the ion beam assist energy increased, TiN film growth mode was changed from (111) to (200) mode. On the Si(100) substrate the critical incident energy for growth mode change was 100 eV/atom, however the critical assist energy was 121 eV/atom on the STD61 substrate. Grain size of TiN films increased with the assist ion beam energy. Finally, adhesion strength of TiN films bombarded above the critical ion assist energy showed 4~5 times higher values than that with lower bombard ion energy.

• Korean Journal of Materials Research
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• v.10 no.4
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• pp.282-289
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• 2000

$PbTiO_3$ films were fabricated by electron cyclotron resonance plasma enhanced chemical vapor deposition(ECR-PECVD). Deposition characteristics of $PbTiO_3$films on $RuO_2$ and Pt substrates were investigated with varying the flow rate of metalorganic source and substrate temperature. The residence time of Pb-oxide molecules in much longer on $RuO_2$ than on Pt substrate, while the perovskite nucleation is more difficult on $RuO_2$ than on Pt substrate. Therefore, the process conditions to obtain the single perovskite $PbTiO_3$ phase are more restricted on $RuO_2$ than on Pt substrates. An introduction of Ti-oxide seed layer increases perovskite nucleation density and thus enlarges the process window to obtain the single perovkite phase. The introduction of Ti-oxide seed layer make the PZT film that Ti-components of $PbTiO_3$ are partially substituted with Zr atoms have single perovskite phase for the wide range of Zr/(Zr+Ti) concentration ratios.

• Journal of the Korean Ceramic Society
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• v.31 no.12
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• pp.1429-1436
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• 1994

We have prepared Ba0.5Sr0.5TiO3 thin films on Si substrate without buffer layer. Deposition was carried out by off-axis rf magnetron sputtering method using Ba0.5Sr0.5TiO3 stoichiometric target. The substrate temperature was changed from 40$0^{\circ}C$ to $700^{\circ}C$ during deposition. As the substrate temperature increased, relative intensity of (110) peak increased up to $600^{\circ}C$, however preferred orientation changed from (110) to (h00) beyond $650^{\circ}C$ of substrate temperature. Deposited films showed microstructures with fine grains whose diameters are less than 100 nm, and columnar structure was observed in the cross-sectional SEM micrograph. AES depth profile showed no significant diffusion at the interfacial reaction area. The effective dielectric constant of films showed maximum value at $600^{\circ}C$, and the leakage current increased with increasing substrate temperature, which may be ascribed to the crystallization of amorphous phases at grain boundary.

• Journal of Electrochemical Science and Technology
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• v.2 no.2
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• pp.68-75
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• 2011

In this review, we have investigated the effect of $TiO_2$-based blocking layers (t-BLs), deposited on a transparent conductive oxide (TCO)-coated glass substrate, on the photovoltaic performance of dye-sensitized solar cells (DSSCs). The t-BL was deposited using spin-coating or sputtering technique, and its thicknesses were varied to study the influence of the thin $TiO_2$ layer in between transparent conducting glass and nanocrystalline $TiO_2$ (nc-$TiO_2$). The DSSC with the t-BL showed the improved adhesion and the suppressed charge recombination at a TCO glass substrate than those without the t-BL, which led to the higher conversion efficiency.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.2
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• pp.307-314
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• 1998

PZT thin films were fabricated by the Sol-gel method. Starting materials used for the preparation of the stock solution were Pb-acetate trihydrate, Zr-normal propoxide and Ti-isopropoxide. 2-Methoxyethanol and iso-propanol were used for solution. For studying the diffusion of Pb ion into the substrates. We used bare Si substrate, $SiO_2/Si$ substrates which was produced by thermal oxidation and $TiO_2/SiO_2/Si$ which was mad by Sol-gel method. Densification and adhesion of thin films were observed by SEM. Phase formation of thin films and diffusion of Pb ion into the substrate were examined by XRD and ESCA, respectively. In the case of bare Si and $SiO_2/Si$ substrate, we obtained the perovskite phase at $700^{\circ}C$ and restricted a little the diffusion of Si ion into the film with $SiO_2$ buffer layer. In the case of $TiO_2/SiO_2/Si$, perovskite phase were obtained at $500^{\circ}C$ and the diffusion of Pb ion and Si ion were restriced.

• Journal of the Korean Ceramic Society
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• v.40 no.2
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• pp.198-205
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• 2003

$Ba_{0.66}Sr_{0.34}TiO_3$ thin films and seed-layers were deposited on $Pt/Ti/SiO_2/Si$substrate by R.F. magnetron sputtering method. Effects of various substrate temperature conditions on electrical properties (such as capacitance and leakage current) of BST thin films were studied. The effect of seed-layer was also studied. When seed-layer was inserted between BST and Pt, the crystallization of the BST thin films was considerably improved and the processing temperature was lowered. Compared to the pure BST thin films, dielectric constant, dielectric loss, and leakage current of BST thin films deposited on the seed-layer were considerably improved. It could be revealed that electrical properties are influenced by the substrate temperatures of BST thin films and are enhanced by the seed-layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.1001-1007
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• 2001

In this study, high dielectric materials, (Pb,La)Ti $O_3$ thin films were fabricated by PLD (Pulsed Laser Deposition) method and investigated in terms of structural and electrical characteristics in order to develope the dielectric materials for the use of new capacitor layers of Giga bit-level DRAM. The deposition conditions were examined in order to fabricate uniform thin films through systematic changes of oxygen pressures and substrate temperature. The uniform thickness and smooth morphology of (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films were obtained at the conditions of substrate-target distance 5.5[cm], laser energy density 2.1[J/$\textrm{cm}^2$], oxygen pressure 200[mTorr] and substrate temperature 500[$^{\circ}C$]. After the (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films were fabricated under the above conditions, they were post-annealed by RTA process in order to increase the dielectric constant. The film thickness of 1200 [$\AA$] had dielectric constant 821. Assuming that operating voltage is 2V, leakage current density of (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films would result into 10$^{-7}$ [A/$\textrm{cm}^2$] and satisfied the specification of 256M DRAM planar capacitor, 4$\times$10$^{-7}$ [A/$\textrm{cm}^2$]m}^2$]

• Journal of Korean Ophthalmic Optics Society
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• v.3 no.1
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• pp.115-120
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• 1998

The $TiN_x$ thin films were prepared on glass substrate by RF(radio-frequency) magnetron sputtering apparatus from a Ti target in a gaseous mixture of argon and nitrogen. In deposition, a RF power supply was used as a power source with a constant power of 240W, and the substrate was heated to $200^{\circ}C$. The films were obtained at nitrogen flow rates in the range 3-9 seem with a constant argon flow rate of 20 seem. For the films obtained, the chemical binding energy of the films was investigated by XPS (x-ray photoelectron spectroscopy) in order to analyze the chemical nature and composition of the films.