• 제목/요약/키워드: Thin p-layer

검색결과 777건 처리시간 0.03초

버퍼막 두께 및 버퍼막 열처리 온도에 따른 ZnO/b-ZnO/p-Si(111)의 전기적 특성 변화 및 이종접합 다이오드 특성 평가 (Dependence of the Diode Characteristics of ZnO/b-ZnO/p-Si(111) on the Buffer Layer Thickness and Annealing Temperature)

  • 허주회;류혁현
    • 한국진공학회지
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    • 제20권1호
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    • pp.50-56
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    • 2011
  • 본 논문에서는 버퍼막 두께 및 열처리 온도에 따른 ZnO/b-ZnO/p-Si(111) 기반 이종접합 다이오드 전류 특성에 대한 연구가 진행되었고, b-ZnO (ZnO buffer layer) 버퍼막 두께 및 열처리 온도에 따른 p-Si(111) 기판 위에 증착시킨 ZnO 박막의 구조적, 전기적 특성 또한 연구되었다. X-ray diffraction (XRD) 방법을 이용하여 ZnO 박막의 구조적 특성을 측정하였고, semiconductor parameter analyzer를 이용하여 ZnO/b-ZnO/p-Si(111) 이종접합 다이오드의 I-V 특성을 평가하였다. XRD 분석 결과 버퍼막 열처리 온도 $700^{\circ}C$, 버퍼막 두께 70 nm에서 ZnO 박막은 우세한 (002) 방향의 c-축 배향성을 갖는 육방정계(hexagonal wurtize) 결정 구조를 나타내었다. 전기적 특성인 운반자 농도, 비저항 값의 경우에는 버퍼막 열처리 온도 $700^{\circ}C$, 버퍼막 두께 50 nm에서 우수한 전기적 특성(비저항: $2.58{\times}10^{-4}[{\Omega}-cm]$, 운반자 농도: $1.16{\times}10^{20}[cm^{-3}]$)을 보였다. 또한 ZnO/b-ZnO/p-Si(111) 이종접합 다이오드의 전류 특성은 버퍼막 열처리 온도 $700^{\circ}C$에서 버퍼막 두께가 증가할수록 전류 특성이 향상되는 경향을 보였다.

As 토핑된 p형 ZnO 박막의 특성 분석 (Characterization of arsenic doped p-type ZnO thin film)

  • 김동림;김건희;장현우;안병두;이상렬
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.53-54
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    • 2006
  • Arsenic doped p-type ZnO thin films have been realized on intrinsic (100) GaAs substrate by RF magnetron sputtering and thermal annealing treatment. p-Type ZnO exhibits the hole concentration of $9.684{\times}10^{19}cm^3$, resistivity of $2.54{\times}10^{-3}{\Omega}cm$, and mobility of $25.37\;cm^2/Vs$. Photoluminescence (PL) spectra of As doped p-type ZnO thin films reveal neutral acceptor bound exciton ($A^{0}X$) of 3.3437 eV and a transition between free electrons and acceptor levels (FA) of 3.2924 eV. Calculated acceptor binding energy ($E_A$) is about 0.1455 eV. Thermal activation and doping mechanism of this film have been suggested by using X-ray photoelectron spectroscopy (XPS). p-Type formation mechanism of As doped ZnO thin film is more related to the complex model, namely, $As_{Zn}-2V_{Zn}$, in which the As substitutes on the Zn site, rather than simple model, Aso, in which the As substitutes on the O site. ZnO-based p-n junction was fabricated by the deposition of an undoped n-type ZnO layer on an As doped p-type ZnO layer.

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Ultraviolet Photodetection Properties of ZnO/Si Heterojunction Diodes Fabricated by ALD Technique Without Using a Buffer Layer

  • Hazra, Purnima;Singh, S.K.;Jit, S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권1호
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    • pp.117-123
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    • 2014
  • The fabrication and characterization of a Si/ZnO thin film heterojunction ultraviolet photodiode has been presented in this paper. ZnO thin film of ~100 nm thick was deposited on <100> Silicon (Si) wafer by atomic layer deposition (ALD) technique. The Photoluminescence spectroscopy confirms that as-deposited ZnO thin film has excellent visible-blind UV response with almost no defects in the visible region. The room temperature current-voltage characteristics of the n-ZnO thin film/p-Si photodiodes are measured under an UV illumination of $650{\mu}W$ at 365 nm in the applied voltage range of ${\pm}2V$. The current-voltage characteristics demonstrate an excellent UV photoresponse of the device in its reverse bias operation with a contrast ratio of ~ 1115 and responsivity of ~0.075 A/W at 2 V reverse bias voltage.

PEALD 장치 제작 및 Co박막 증착 (Construction of a PEALD System and Fabrication of Cobalt Thin Films)

  • 이두형;노승정
    • 한국진공학회지
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    • 제16권2호
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    • pp.110-115
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    • 2007
  • Atomic layer deposition(ALD)에 유도결합 플라즈마 소스를 채용하여 plasma enhanced ALD(PEALD)장치를 제작하고 플라즈마 발생 실험을 수행하였다. ALD와 PEALD를 이용하여 기판온도 $230^{\circ}C$에서 p-type Si(100)기판 위에 Co박막을 증착하였다. 이때, $Co_{2}(CO)_{6}$을 Co전구체로, 암모니아를 반응가스로, 아르곤을 캐리어(carrier) 및 퍼지(purge)가스로 사용하였다. 증착된 Co박막의 구성성분과 박막의 두께를 auger electron spectroscopy(AES)와 field emission scanning electron microscopy(FESEM)을 이용하여 분석하였다. ALD와 PEALD를 이용하여 증착된 Co박막에서 모두 불순물이 발견되었는데, PEALD의 경우 ALD에 비해 불순물의 양이 약 반으로 감소되었다. 암모니아 플라즈마가 Co전구체에 포함된 탄소와의 반응을 매우 효과적으로 유도하는 것으로 확인되었다.

ASA 프로그램을 이용한 박막태양전지 구조설계 최적화

  • 백승신;최형욱;이영석;이준신
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.37-37
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    • 2009
  • 박막태양전지는 p-i-n substrate형과 n-i-p substrate형 두가지구조로 제조된다. 각 layer에서 activation energy와 band gap energy를 ASA simulator를 통해 조절해보았다. Simulation결과 p-i-n substrate형에서 p-layer와 n-i-p substrate형 n-layer에서 동일하게 activation energy 0.2eV, band gap energy 1.80eV에 최고효율 나왔고 각각 10.07%, 10.17%의 최고효율을 구할 수 있었다. 최적화 과정을 통하여 같은 조건에서 p-i-n substrate형 보다 n-i-p substrate형이 보다 높은 효율을 낸다는 것을 알 수 있었으며 본 연구를 통해 각 구조의 차이를 알 수 있었고 이는 높은 효율의 박막태양전지 설계에 도움이 될 것 이다.

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티타늄 기판 위에 강유전성 BaTiO3박막 형성과 분극처리에 의한 Eagle’s MEM 용액에서의 Calcium Phosphate 생성 (Fabrication of Ferroelectric BaTiO3Thin Film on Ti Substrate and Formation of Calcium Phosphate in Eagle’s MEM Solution)

  • 이용렬;정영화;황규석;송호준;박영준
    • 한국재료학회지
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    • 제12권7호
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    • pp.560-567
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    • 2002
  • Titanium (Ti) is a bioinert material and has lower elastic coefficient and better strength/volume property than other metals. Ferroelectric materials show alignment of positive and negative charges by poling treatment. This study was purposed to develop a new implant system by combining the advantages of Ti and ferroelectric property of $BaTiO_3$ (BTO). It was performed with the assumption that the $Ca^{2+ }$ ions would be easily attracted on negatively charged surface and the attracted cation might behave as nuclei for bone-like crystal growth in biological solutions. A ferroelectric BTO thin film on Ti was fabricated and the effect of poling treatment on the improvement of calcium phosphate (Ca-P) formation in biological solutions was evaluated. After immersion in Eagle’s minimum essential media (MEM) solution, NaCl was formed on Ti, and Ca-P layer containing NaCl was formed on Ti-O. Weak and sparse Ca-P layers were formed on BTO, while thick, homogeneous, and dense Ca-P layer was formed on negatively polarized BTO (N-BTO), which was confirmed by FE-SEM and EDX. In summary, these results demonstrate that poling the ferroelectric BTO surface negatively is effective for the formation of Ca-P layer in MEM solution, and that N-BTO coating on Ti could be used as a possible alternative method for enhancing the osseointegration of the implants.

팔라듐 표면처리를 통한 Massive Spalling 현상의 억제 (Retardation of Massive Spalling by Palladium Layer Addition to Surface Finish)

  • 이대현;정보묵;허주열
    • 대한금속재료학회지
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    • 제48권11호
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    • pp.1041-1046
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    • 2010
  • The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

The Study on the the P3HT:PCBM Bulk Heterojunction Solar Cells Utilizing $WO_3$ Nano-particle As a Hole Transporting Layer

  • 최하나;김성현;김경곤
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.321-321
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    • 2010
  • The PEDOT:PSS layer is usually used as hole transporting layer for the polymer bulk heterojunction solar cells. However, the interface between ITO and PEDOT:PSS is not stable and the chemical reaction between ITO and PEDOT can result in degraded device performance. We used the tungsten oxides as a hole transport layer by spin-coating. The $WO_3$ nanoparticles were well dispersed in ammonium hydroxide and deionized water and formed thin layer on the ITO anode. We found that $WO_3$ surface is more hydrophobic than the bare ITO or PEDOT:PSS-coated surfaces. The hydrophobic surfaces promote an ordered growth of P3HT films. A higher degree of P3HT ordering is expected to improve the hole mobility and the lifetime of the device using the tungsten oxide showed better stability compared to the device using the PEDOT:PSS.

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원자층 증착법으로 성장된 ZnO 박막의 질소 도핑에 대한 연구 (Nitrogen Doping Characterization of ZnO Prepared by Atomic Layer Deposition)

  • 김도영
    • 한국전기전자재료학회논문지
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    • 제27권10호
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    • pp.642-647
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    • 2014
  • For feasible study of opto-electrical application regarding to oxide semiconductor, we implemented the N doped ZnO growth using a atomic layer deposition technique. The p-type ZnO deposition, necessary for ZnO-based optoelectronics, has considered to be very difficulty due to sufficiently deep acceptor location and self-compensating process on doping. Various sources of N such as $N_2$, $NH_3$, NO, and $NO_2$ and deposition techniques have been used to fabricate p-type ZnO. Hall measurement showed that p-type ZnO was prepared in condition with low deposition temperature and dopant concentration. From the evaluation of photoluminescence spectroscopy, we could observe defect formation formed by N dopant. In this paper, we exhibited the electrical and optical properties of N-doped ZnO thin films grown by atomic layer deposition with $NH_3OH$ doping source.

MOCVD 법에 의한 Bi-Te계 열전소재 제조 및 박막형 열전소자 제작 (Growth of Bi-Te Based Materials by MOCVD and Fabrication of Thermoelectric Thin Film Devices)

  • 권성도;주병권;윤석진;김진상
    • 한국전기전자재료학회논문지
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    • 제21권12호
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    • pp.1135-1140
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    • 2008
  • Bismuth-telluride based thin film materials are grown by Metal Organic Chemical Vapor Deposition(MOCVD). A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_2Te_3$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $4{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_2Te_3$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_2Te_3$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the sample was heated by heating block and the voltage output measured. As expected for a thermoelectric generator, the voltage decreases linearly, while the power output rises to a maximum. The highest estimated power of $1.3{\mu}W$ is obtained for the temperature difference of 45 K. we provide a promising procedure for fabricating thin film thermoelectric generators by using MOCVD grown thermoelectric materials which may have nanostructure with high thermoelectric properties.