• Journal of the Korean Ceramic Society
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• v.47 no.4
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• pp.329-332
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• 2010

In order to investigate the effect of tail state on the electrical and the optical properties in amorphous IGZO(a-IGZO), a-IGZO films were deposited at room temperature on fused silica substrats using pulsed laser deposition method. The laser pulse energy was used as the processing parameter. In-situ post annealing was carried out at $150^{\circ}C$ right after the film deposition. The $O_2$ partial pressure during the deposition and the post annealing was fixed to 10mTorr. The carrier mobility of the a-IGZO films had a range from 2 to $18\;cm^2/Vs$ at carrier concentrations greater than $10^{18}\;cm^{-3}$. As the laser energy density increased, the Hall mobility increased. And post annealing improved the Hall mobility, as well. The optical property was examined using the ultraviolet-visible spectroscopy. The a-IGZO films that have low Hall mobility exhibited stronger and broader absorption tails in >3.0 eV region. Post annealing reduced the intensity of the tail-like absorption. The absorption tail in a-IGZO films is an important factor which affects the electrical and the optical properties.

• Journal of Electrochemical Science and Technology
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• v.9 no.3
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• pp.202-211
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• 2018

In this work, Fe-Pd alloy films have been electrodeposited on different substrates using an electrolyte containing $[Pd(NH_3)_4]^{2+}$ (0.02 M) and $[Fe-Citrate]^{2+}$ (0.2 M). The influences of substrate and overpotential on chemical composition, nucleation and growth kinetics as well as the electrodeposited films morphology have been investigated using energy dispersive X-ray spectroscopy (EDS), current-time transients, scanning electron microscopy (SEM), atomic force microscopy (AFM) and X-ray diffraction (XRD) patterns. In all substrates - brass, copper and sputtered fluorine doped tin oxide on glass (FTO/glass) - Fe content of the electrodeposited alloys increases by increasing the overpotential. Also the cathodic current efficiency is low due to high rate of $H_2$ co-reduction. Regarding the chronoamperometry current-time transients, it has been demonstrated that the nucleation mechanism is instantaneous with a typical three dimensional (3D) diffusion-controlled growth in the case of brass and copper substrates; while for FTO, the growth mode changes to 3D progressive. At a constant overpotential, the calculated number of active nucleation sites for metallic substrates is much higher than that of FTO/glass; however by increasing the overpotential, the number of active nucleation sites increases. The SEM micrographs as well as the XRD patterns reveal the formation of Fe-Pd alloy thin films with nanostructure arrangement and ultra-fine grains.

• Journal of the Korean Applied Science and Technology
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• v.32 no.4
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• pp.789-794
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• 2015

In this study, we investigated the stability with respect to the Langmuir-Blodgett(LB) monolayer films of stearic acid and phospholipid(L-${\alpha}$-dimyristoylphosphatidyl choline, DMPC) mixture. LB films of stearic acid and DMPC monolayer were deposited by the LB method on the indium tin oxide(ITO) glass. The electrochemical properties measured by cyclic voltammetry with three-electrode system in $0.05N\;NaClO_4$ solution, -0.3 V initial, 1650 mV switching potential and -1350 mV final potential. As a result, monolayer LB films of stearic acid and phospholipid mixture was appeared on irreversible process caused by the oxidation current from the cyclic voltammogram. Diffusion coefficient (D) of stearic acid and DMPC mixture(molar ratio 1:1, 1:2, 1:3) was calculated $1.4{\times}10^{-3}$, $1.7{\times}10^{-3}$ and $1.6{\times}10^{-3}(cm^2/s)$ in $0.05N\;NaClO_4$ solution, respectively.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.4
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• pp.804-810
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• 2005

An analytical subthreshold swing (SS) model has been presented for double gate MOSFET(DGMOSFET) in this study. The results calculated by this model are more precise for about 10nm channel length and thickness than those derived from the previous models. The results of this model are compared with Medici simulation to varify the validity of this model, and good agreementes have been obtained. The changes of SS have been investigated for various channel lengths, channel thicknesses and gate oxide thicknesses using this model, given that these parameters are very important in design of DGMOSFET. This demonstrates that the proposed model provides useful data for design of nano-scale DGMOSFET. It is Known that the SS is improved to smaller ratios of channel thickness vs channel length and is smaller in very thin oxides. New gate dielectric materials with high permittivity have to be developed to enable design of nano-scale DGMOSFET.

• Journal of the Korean Vacuum Society
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• v.17 no.2
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• pp.165-169
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• 2008

It is very important to decompose uniformly the metal film in semiconductor devices process. The thickness uniformity of the ITO film by standard magnetron sputtering system are about $\pm4%\sim\pm5%$ and the center of the wafer is more thick than the edge of the wafer. We designed and made the discharge electrode structure and controlled the direction of sputtering materials in magnetron sputtering system. The thickness uniformity are increased to $\pm0.8\sim1.3%$ in 4" wafer using the new sputtering gun in magnetron sputtering system. In wafer to wafer thickness uniformity, $\pm$5.3% are increased to $\pm$1.5% using the new sputtering gun. The thickness uniformity of the Al film are about $\pm$1.0% using the new sputtering gun in magnetron sputtering system.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.347.1-347.1
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• 2014

최근, 박막 트랜지스터는 빠른 동작 속도, 낮은 공정비용 그리고 저온공정 등의 특성을 필요로 하고 있다. 그 중 indium-zinc oxide (InZnO)는 높은 전기적 특성, 높은 광 투과도 그리고 우수한 안정성 때문에 기존의 반도체를 대체할 수 있을 것으로 기대된다. InZnO의 경우 indium과 zinc의 조성비에 따라 특성 변화의 차이가 크기 때문에 다양한 조성비에 대한 연구가 보고되고 있는데, 기존의 InZnO 박막을 증착하는 방법의 경우에 조성비의 변화 과정에 많은 공정상의 어려움이 있다. 이 같은 문제점 때문에 조성비의 변화를 용이하게 할 수 있는 용액공정을 이용한 연구가 진행되고 있다. 또한 용액공정은 높은 균일성, 공정 시간 및 비용 감소 그리고 대면적화가 가능한 장점을 가지고 있다. 한편, 용액공정을 기반으로 한 InZnO의 경우에 용액 상태에서 고체 상태의 순수한 금속 산화물 상태로 바꾸기 위해 post-treatment 가 필요하다. 일반적으로 furnace 열처리 방법을 사용하는데, 이 경우 낮은 열효율 및 고비용 등의 문제점을 가지고 있다. 특히 glass 또는 flexible 기판의 경우 열처리 온도에 대한 제약이 있다. 이러한 문제를 해결하기 위한 방법으로 최근에 microwave irradiation를 이용한 저온 post-treatment 방법이 보고되고 있다. Microwave irradiation는 짧은 공정시간 및 열 균일성 등의 장점이 있다. 따라서 본 연구에서는 다양한 indium과 zinc의 조성비를 갖는 용액을 제작한 후 spin coating을 이용하여 증착한 InZnO 기반의 박막 트랜지스터를 제작하였다. Furnace와 microwave 방식으로 post-treatment 하여 비교 평가한 결과 microwave irradiation 한 경우 furnace 열처리 한 경우 보다 더 안정된 동작 전압을 가지는 것으로 나타났다. 따라서 저온공정이 가능한 microwave irradiation 방법으로 post-treatment 한다면 차세대 산화물 반도체로서의 적용이 가능할 것으로 기대된다.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.147-151
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• 2007

Cu-free multi-component sol, of which final oxide composition becomes $Bi_{1.9}Pb{0.35}SrCaO,\;Bi_{1.8}Pb_{0.2}SrCaO\;and\;Bi_{1.5}SrCaO$, respectively, was prepared through sol-gel route and coated on a bare Cu substrate. Starting materials were metal-alkoxides as follows.; [$Bi(OC_{2}H_{5})_{3}\;Pb(O^{1}C_{3}H_{7})_{2},\;Sr(O^{i}C_{3}H_{7})_{2},\;Ca(OC_{2}H_{5})_{2}$] as a reagent grade. Transparent light yellowish sol was obtained in the case of $Bi_{1.9}Pb_{0.35}SrCaO\;and\;Bi_{1.8}Pb_{0.2}SrCaO$ composition and $Bi_{1.5}SrCaO$ composition's sol was light greenish. Each sol was repeatedly dip-coated on Cu substrate four times and pre-heated at $400^{\circ}C$ and finally heat-treated in the range of $740{\sim}900^{\circ}C$. In the results, crystalline phases confirmed by XRD were (2201) orthorhombic and monoclinic phases. However, only $Bi_{1.9}Pb_{0.35}SrCaO_{x}$ composition showed pseudo-superconductive behavior after heat-treatment at $900^{\circ}C$ for 12 seconds and then onset temperature was 77 K, even though it did not exhibit zero resistance below Tc.

• Korean Journal of Materials Research
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• v.11 no.4
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• pp.283-289
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• 2001

Composite cathodes of 50/50 vol% LSM- YSZ (La$_{1-x}$Sr$_{x}$MnO$_3$-yttria stabilized zirconia) were deposited onto surface- Polished YSZ electrolytes by colloidal deposition technique. The cathode characteristics were then examined by scanning electron microscopy (SEM) and X-ray diffraction (XRD) and studied by ac impedance spectroscopy (IS). The typical impedance spectra measured for an air/LSM- YSZ/YSZ/Pt/air cell at $700^{\circ}C$ were composed of two depressed arcs. Addition of YSZ to the LSM electrode significantly enlarged the triple-phase boundaries (TPB) length inside the electrode, which led to a pronounced decrease in cathodic resistivity of LSM-YSZ composite electrodes. Polishing the electrolyte surface to eliminate the influences of surface impurities and to enlarge the TPB length can further reduce cathode resistivity. The cathodic resistivity of the LSM- YSZ electrodes was a strong function of operation temperature, composition and particle size of cathode materials, applied current, and electrolyte surface roughness.

• Korean Journal of Materials Research
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• v.9 no.8
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• pp.825-830
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• 1999

Characteristics of SiOF films deposited by a FTES/$O_2$-plasma enhanced chemical vapor deposition method have been investigated using Fourier transform infrared spectroscopy, X-ray photoelectro spectroscopy, and ellipsometry. Electrical properties such as dielectric constant, dielectric breakdown and leakage current density are investigated using C-V and I-V measurements with MIS(Au/SiOF/p-Si) capacitor structure. Stepcoverage of the films have been also characterized using scanning electron microscopy and ellipsometry. A high quality SiOF film was formed on that the flow rates of FTES and $O_2$were 300sccm, respectively. The dielectric constant of the deposited SiOF film was about 3.1. This value is lower than that of the oxide films obtained using other method. The dielectric breakdown field and leakage current are more than 10MV/cm and about $8[\times}10^{9}A/\textrm{cm}^2$, respectively. The deposited SiOF film with thickness as $2500{\AA}$ on the $0.3{\mu}{\textrm}{m}$ metal pattern shows a high step-coverage without a void.

• Korean Journal of Materials Research
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• v.5 no.7
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• pp.794-801
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• 1995

To connect the driver IC and Al coated glass, a method has been developed to plate electrolessly Ni on Al/PR system. It Is necessary to pretreat Al to remove oxide film before plating. In order to find pretreatment process which does not damage photoresist or glass, alkaline and fluoride zincate process have been investigated. Because photoresist and aluminum thin film can easily dissolve in alkaline solution, it is considered that the fluoride zincate process was a suitable one. After immersion in the zincate solution containing 1.5 g/$\ell$ ammonium bifluoride and 100 g/$\ell$ zinc sulfate, electroless nickel plating could be performed. The additive in the zincate solution and thiourea in the plating solution increased smoothness of the plated surface. Acld dip could improve the uniformit of the surface.