• Design & Manufacturing
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• v.10 no.2
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• pp.50-54
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• 2016

In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.317-318
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• 2007

• Design & Manufacturing
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• v.15 no.1
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• pp.21-25
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• 2021

When the product is removed from the mold after molding during the sheet metal molding process, elastic recovery causes a springback phenomenon. Much research has been done to minimize this phenomenon. In this study, V-bending experiments were conducted using galvanized steel sheets, stainless steel, and aluminum sheet materials, using a total of nine types of thin sheet materials of 1.0t, 1.5t, and 2.0t, respectively. Molding analysis and experimental data were compared and analyzed. In the case of galvanized steel sheets, it was considered that the springback phenomenon occurs more frequently in molding analysis than in experiments. It was considered that the springback phenomenon occurs greatly in the experiment, not the interpretation of the molding of the stainless steel plate and the aluminum plate. It was considered that the springback occurrence tendency of the molding analysis and the experiment was the same, and the springback occurrence error rate of the molding analysis and the experimental result was about 4.0%.

• Composites Research
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• v.12 no.1
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• pp.11-18
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• 1999

The compression molding is widely used in the automotive industry to produce products that are large, thin, lightweight and stiff. The molded product is formed by squeezing a fiber-reinforced plastic composites. During a molding process of fiber reinforced thermoplastic composites, control of filling patterns in mold, orientation and distribution of fibers are needed to predict the effects of molding parameters on the flow characteristics. It is the objective of this paper to develop an isothermal compression molding simulation that can handle both thin and thick charges and motion of the flow front, and can predict pressure distributions and accurate velocity gradients. The composites are treated as an incompressible Newtonian fluid. The effects of slip parameter $\alpha$ and extensional/shear viscosity ratio $\zeta$ on the mold filling parameters are also discussed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.3
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• pp.62-67
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• 2009

Pt thin films on Cr or Ti interlayer were deposited onto a tungsten carbide(WC) substrate by the ion beam assisted DC magnetron sputtering. The various atomic percent of Cr and Ti underneath of the Pt films were prepared to examine the total thin film characteristics. The microstructure and surface analysis of the specimen were conducted by using the SEM, XRD and AFM. Mechanical properties such as hardness and adhesion strength of Pt thin film also were examined. The interlayer of pure Ti was formed with 40 nm thickness while that of pure Cr was done with 50 nm as standard reference. The growth rate of either Cr or Ti thin film was almost same under the same deposition conditions. The SEM images showed that anisotropic grain of Pt thin films consisting of dense columnar structures irrespectively grew from the different target compositions. The values of hardness and adhesion strength of Cr/Pt thin film coated on a WC substrate were higher than those of Ti/Pt thin film.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.100-104
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• 2005

The injection molding is very effective process for various plastic products due to its high productivity. It is also good fur precise products like optical parts. Various thermoplastic materials are also available with this injection molding process. In recent, however, as the overall size of the product increases and micro or nano scale of patterns are applied to the products, we now have some problems such as low fidelity of the replication of the pattern, high molding pressure, or warpage from the in-mold stress. Injection/compression molding is studied to overcome those problems in molding large thin plate with micro pattern array on its surface. An injection compression mold is designed to 3 pieces mold for side gate. We install 4 pressure transducers and 9 thermocouples to measure the melt pressure and surface temperature in the cavity during the process. As a result, the maximum molding pressure for injection compression molding is reduced to 1/3 compared to injection molding and the uniformity of the pressure in the cavity is enhanced by about 15%.

• Transactions on Electrical and Electronic Materials
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• v.15 no.6
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• pp.344-347
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• 2014

This study was carried out on DLC thin film deposition technology used in infrared optical system production as a method of reducing the shape changes of the molding core and the consequent loss of life. Experiments on the deposition on silicon wafer and tungsten carbide used as a substrate for molding core were conducted at each processing condition using a filtered arc system, and it was found that the surface and mechanical properties were of the greatest quality when the substrate bias voltage of -150 V was used. In addition, it was confirmed that the PV and Ra characteristics were improved by the deposition of the DLC thin film.

• Design & Manufacturing
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• v.10 no.3
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• pp.8-13
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• 2016

Despite technological advance, there have been several troubles in photo reaction injection molding (photo RIM) to produce ultra thin light guide panels (LGPs). In this study, micro leakage problem at cavity edge during photo RIM was investigated numerically. In order to obtain optimal processing conditions, we regulated inlet pressure of injected resin at the cavity edge and figured out micro leakage behaviors. At low inlet pressure (less than 100 Pa), though the micro leakage problem was not occurred, another problem, short shot due to not enough driving force, was appeared More than 1,000 Pa of the inlet pressure, injected resin was rapidly leaked through the micro gap at the cavity edge. Finally, we obtained optimal inlet pressure around 600 ~ 1,000 Pa. At this region, injected resin fully filled the cavity without micro leakage behavior. Based on the present study, further comparative investigations with experimental photo RIM should be performed to find optimal processing conditions for produce ultra thin LGPs.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.5
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• pp.594-600
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• 2007

Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. Induction heating is an efficient way to heat a conductive workpiece by means of high-frequency electric current caused by electromagnetic induction. Because the induction heating is a convenient and efficient way of indirect heating, it has various applications such as heat treatment, brazing, welding, melting, and mold heating. The present study covers an experimental investigation on the rapid heating using the induction heating and rapid cooling using a vortex tube in order to eliminate an excessive cycle time increase. Experiments are performed in the case of a steel cup mold core with various heating and cooling conditions. Temperature is measured during heating and cooling time, from which appropriate mold heating and cooling conditions can be obtained.

• Journal of Powder Materials
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• v.9 no.4
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• pp.245-250
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• 2002

In this paper we presented numerical method for the simulation of powder injection molding filling process, which is one of the key processes in powder injection molding. Rheological properties of powder binder mixture such as slip phenomena and yield stress were introduced into the numerical analysis model of powder injection molding filling simulation. Numerical model can be classified into two types. One is 2.5D model which can be introduced to a arbitrary thin geometry and the other is full 3D model which can be applied to a general 3D shape. For 2.5D model we showed the validity of our CAE system with several verification examples. Finally we suggested flow analysis model for 3D powder injection molding filling simulation.