• 제목/요약/키워드: Thin layer

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BST 박막 소자의 유전특성 (The Dielectric Characteristics of BST Thin Film Devices)

  • 홍경진;민용기;신훈규;조재철
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.660-663
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    • 2001
  • The devices of BST thin films to composite (Ba$\_$0.7/ Sr$\_$0.3/)TiO$_3$using sol-gel method were fabricated by changing of the depositing layer number on Pt/Ti/SiO$_2$/Si substrate. The thin film capacitor to be ferroelectric devices was investigated by structural and electrical properties. The thickness of BST thin films at each coating numbers 3, 4 and 5 times was 2500[${\AA}$], 3500[${\AA}$], 3800[${\AA}$]. The dielectric factor of thin film when the coating numbers were 3, 4 and 5 times was 190, 400 and 460 on frequency 1[MHz]. The dielectric loss of BST thin film was linearly increased by increasing of the specimen area.

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ITO/Ag/ITO 투명전도막의 전기적 특성 (Electrical Properties of ITO/Ag/ITO Conducting Transparent Thin Films)

  • 채홍철;백창현;홍주화
    • 대한금속재료학회지
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    • 제49권2호
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    • pp.192-196
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    • 2011
  • The multi-layered thin film with an ITO/Ag/ITO structure was produced on PET by using magnetron reactive sputtering method. First, 30 nm of ITO thin film was coated on PET by using normal temperature process. Then 20-52 nm of the Ag thin film was coated. Lastly, 30 nm of ITO thin film was coated on Ag layer. The sample of the 20 nm Ag thin film showed more than 70% transmission and a $2.7{\Omega}/{\Box}$ sheet resistance. When compared to the existing single-layered transparent conducting thin film, multi-layered film was found to be superior with about $5{\Omega}/{\Box}$ less sheet resistance. However, since the Ag layer became thinner, the band gap energy needs to be increased to more than 3.5 eV.

게이트 절연막에 사용된 점착층에 대한 영향 (Effect of Adhesion Layer on Gate Insulator)

  • 이동현;형건우;표상우;김영관
    • 한국전기전자재료학회논문지
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    • 제19권4호
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    • pp.357-361
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    • 2006
  • The electrical performances of organic thin-film transistors (OTFTs) have been improved for the last decade. In this paper, it was demonstrated that the electrical characteristics of the organic thin film transistors (OTFTs) were improved by using polymeric material as adhesion layer on gate insulator. We have investigated OTFTs with polyimide adhesion layer which was fabricated by vapor deposition polymerization (VDP) processing and formed by co-deposition of 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride and 4,4'-oxydianiline. It was found that the OTFTs with adhesion layer showed better electrical characteristics than with bare layer because of good matching between semiconductor and gate insulator. Our devices of performance are field effect mobility of $0.4cm^2/Vs$, threshold voltage of -0.8 V and on-off current ratio of $10^6$. In addition, to improve the electrical characteristics of OTFT, we have reduced the thickness of adhesion layer up to a few nanometrs.

Advanced Permeation Properties of Solvent-free Multi-Layer Encapsulation of thin films on Ethylene Terephthalate(PET)

  • Han, Jin-Woo;Kang, Hee-Jin;Kim, Jong-Yeon;Kim, Jong-Hwan;Han, Jung-Min;Moon, Hyun-Chan;Park, Kwang-Bum;Kim, Hwi-Woon;Seo, Dae-Shik
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.973-976
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    • 2006
  • In this paper, the inorganic multi-layer encapsulation of thin film was newly adopted to protect the organic layer from moisture and oxygen. Using the electron beam, Sputter, inorganic multi-layer thin-film encapsulation was deposited onto the Ethylene Terephthalate(PET) and their interface properties between inorganic and organic layer were investigated. In this investigation, the SiON $SiO_2$ and parylene layer showed the most suitable properties. Under these conditions, the water vapor transmission rate (WVTR) for PET can be reduced from level of $0.57g/m^2/day$ (bare substrate) to $1^{\ast}10^{-5}g/m^2/day$ after application of a SiON and $SiO_2$ layer. These results indicate that the $PET/SiO_2/SiON/Parylene$ barrier coatings have high potential for flexible organic light-emitting diode(OLED) applications.

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Efficient Organic Light-emitting Diodes by Insertion a Thin Lithium Fluoride Layer with Conventional Structure

  • Kim, Young-Min;Park, Young-Wook;Choi, Jin-Hwan;Kim, Jai-Kyeong;Ju, Byeong-Kwon
    • Journal of Information Display
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    • 제7권2호
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    • pp.26-30
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    • 2006
  • Insertion of a thin lithium fluoride (TLF) layer between an emitting layer (EML) and an electron transporting layer has resumed in the developement of a highly efficient and bright organic light-emitting diode (OLED). Comparing with the performance of the device as a function of position with the TLF layer in tris-(8-hydroxyquinoline) aluminum $(Alq_{3})$, we propose the optimal position for the TLF layer in the stacked structure. The fabricated OLED shows a luminance efficiency of more than 20 cd/A, a power efficiency of 12 Im/W (at 20 mA/$cm^{2}$), and a luminance of more than 22 000 cd/$m^{2}$ (at 100 mA/$cm^{2}$), respectively. We suggest that the enhanced performance of the OLED is probably attributed to the improvement of carrier balance to achieve a high level of recombination efficiency in an EML.

고분자 기판위에 다층 구조의 박막형 보호층을 적용한 투습률 향상 (Improvement of Permeation of Applied Multi-layer Encapsulation of Thin Films on Ethylene Terephthalate(PET))

  • 김종환;한진우;김영환;서대식
    • 한국전기전자재료학회논문지
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    • 제19권3호
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    • pp.255-259
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    • 2006
  • In this paper, the inorganic-organic thin film encapsulation layer was newly adopted to protect the organic layer from moisture and oxygen. Using the electron beam, Sputter and Spin-Coater system, the various kinds of inorganic and organic thin-films were deposited onto the Ethylene Terephthalate(PET) and their interface properties between organic and inorganic layer were investigated. In this investigation, the SiON and Polyimide(PI) layer showed the most suitable properties. Under these conditions, the WVTR(water vapour transition rate) for PET can be reduced from level of $0.57\;g/m^2{\cdot}day$ (bare subtrate) to $1{\times}10^{-5}\;g/m^2{\cdot}day$ after application of a SiON and Polyimide layer. These results indicates that the SiON/PI/SiON/PI/PET barrier coatings have high potential for flexible organic light-emitting diode(OLED) applications.

운모 기판을 플렉시블 다결정 실리콘 박막 트랜지스터에 적용하기 위한 버퍼층 형성 연구 (Formation of a Buffer Layer on Mica Substrate for Application to Flexible Thin Film Transistors)

  • 오준석;이승렬;이진호;안병태
    • 한국재료학회지
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    • 제17권2호
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    • pp.115-120
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    • 2007
  • Polycrystalline silicon (poly-Si) thin film transistors (TFTs) might be fabricated on the mica substrate and transferred to a flexible plastic substrate because mica can be easily cleaved into a thin layer. To overcome the adhesion and stress problem between poly-Si film and mica substrate, a buffer layer consisting of $SiO_x/Ta/Ti$ three layers has been developed. The $SiO_x$ layer is for electrical isolation, the Ti layer is for adhesion of $SiO_{x}$ and mica. and Ta is for stress relief between $SiO_x$ and Ti. A TFT was fabricated on the mica substrate by a conventional Si process and was successfully transferred to a plastic substrate.

초 저속 순차증착으로 제작한 Bi계 초전도 박막의 생성막 평가 (Analysis of the Hi-system Superconducting Thin Films Fabricated by Layer-by-Layer Deposition Method at an Ultra low growth rate)

  • 양승호;김영표;박용필
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.503-504
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    • 2007
  • $Bi_2Sr_2Ca_{n-1}Cu_nO_x$(n=0, 1, 2)superconducting thin films have been fabricated by atomic layer-by-layer deposition at an ultra low growth rate using IBS(Ion Beam Sputtering) method. During the deposition, 90 mol% ozone gas of typical pressure of $1{\sim}9{\times}10^{-5}$ Torr are supplied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less than 10 units cell and then Bi-2201 oriented along the c-axis is grown.

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OTFT의 게이트 절연막에 사용된 점착층에 대한 영향 (The Effect of Adhesion layer on Gate Insulator for OTFTs)

  • 이동현;형건우;표상우;김정수;김영관
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.70-71
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    • 2005
  • The electrical performances of organic thin-film transistors (OTFTs) have been improved for the last decade. In this paper, it was demonstrated that the electrical characteristics of the organic thin film transistors (OTFTs) were improved by using polymeric material as adhesion layer on gate insulator. We have investigated OTFTs with polyimide adhesion layer which was fabricated by vapor deposition polymerization (VDP) processing and formed by co-deposition of 6FDA and ODA. It was found that the OTFTs with adhesion layer showed better electrical characteristics than with bare layer because of good matching between semiconductor and gate insulator. Our devices of performance are field effect mobility of $0.4cm^2$/Vs, threshold voltage of -0.8 V and on-of current ratio of $10^6$. In addition, to improve the electrical characteristics of OTFT, we have reduced the thickness of adhesion layer up to a few nanometrs.

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플라즈마 침류질화처리된 SKD61강의 표면경화층의 미세조직과 특성 (Microstructures and Properties of Surface Hardened Layer on the Plasma Sulfnitrided SKD61 Steel)

  • 이인섭;박철;박익민
    • 한국재료학회지
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    • 제12권7호
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    • pp.568-572
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    • 2002
  • Plasma sulfnitriding technology was employed to harden the surface of SKD61 steel. The plasma sulfnitriding was performed with 3 torr gas pressure at $580^{\circ}C$ for 20 hours. Plasma sulfnitriding resulted in the formation of very thin $2-3\mu\textrm{m}$ FeS sulfide layer on top of $15-20\mu\textrm{m}$ compound layer, which consisted of predominantly $\varepsilon$- $Fe{2-3}$ N and a second phase of $\Upsilon'-Fe_4$N. In comparision with plasma nitriding treatment, plasma sulfnitriding treatment showed better surface roughness and corrosion resistance due to the presence of the thin FeS layer. which coated microvoids and microcracks on top of the nitrided layer. It was also found that plasma sulfnitrided sample showed better wear resistance due to the presence of the thin FeS layer which acted as a solid lubricant.