1 |
H. Sirringhaus, P. J. Brown, R. H. Friend, and M. H. Nielsen, Nature 401, 685 (1999).
DOI
|
2 |
H. W. Rhee, K. S. Chin, S. Y. Oh, and J. W. Choi, Thin Solid Films 363, 236 (2000).
DOI
ScienceOn
|
3 |
S. Maniv, C. J. Miner, and W. D. Westwood, J. Vac. Sci. Technol. A1, 1379 (1983).
|
4 |
K. Wasa, M. Kitabatake, and H. Adachi, Thin Film Materials Technology, William Andrew, 71 (2004).
|
5 |
K. L. Chopra. S. Major, and D. K. Pandya, Thin Solid Films 102, 1 (1983).
DOI
ScienceOn
|
6 |
T. Karasawa and Y. Miyata, Thin Solid Films 223, 135 (1997).
|
7 |
A. Kulkarni, T. Lim, M. Khan, and K. Schulz, J. Vac. Sci. Technol. A16, 1636 (1998).
|
8 |
Y. L. Choi and S. H. Kim, Korean J. Mater. Res. 16, 490 (2006).
DOI
ScienceOn
|
9 |
M. Bender, W. Seeling, C. Daube, H. Frankenberger, and B. Ocker, J. Stollenwerk 326, 67 (1998).
|
10 |
A. H. M. Zahirul Alam, Y. Takashima, K. Sasaki, and T. Hata, Thin Solid Films 279, 131 (1996).
DOI
ScienceOn
|
11 |
L. Chkoda, C. Heske, M. Sokolowski. E. Umbach. F. Steuber, J. Staudigel, M. Stobel and J. Simmerer, Synthetic Metals 111-112, 315 (2000).
|