• Title/Summary/Keyword: Thick Film

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Microwave assisted processing of silver thick films for microelectronic applications

  • Rane, Sunit;Bhatkar, Rushna;Mulik, Uttam;Amalnerkar, Dinesh
    • Advances in materials Research
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    • v.2 no.3
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    • pp.133-140
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    • 2013
  • This paper aims to focus on the microwave processing of thick films which is a fast, cheap technique and could be the alternative to the currently used conventional high temperature processing technique. Microwave processing has gained worldwide acceptance as a novel method for heating and sintering a variety of materials, as it offers specific advantages in terms of speed, energy efficiency, process simplicity, finer microstructures and lower environmental hazards. Silver conducting thick films were prepared and processed in the household microwave oven. The films sintered at different time period by keeping the other parameter such as microwave power, film thickness etc constant. The microstructure analysis revealed that the surface morphology of the microwave processed films become compact with respect to the processing time. The sheet resistance for microwave sintered silver films is in the range of 0.003 to $1.207{\Omega}/{\Box}$ where as the films fired at 750 and $850^{\circ}C$ showed the resistance of 0.009 and $0.003{\Omega}/{\Box}$ which can be comparable. The results revealed that the microstructure of the microwave sintered films has more uniform and compact surface than that of the conventionally fired films. The paper reports upon the preparation of silver thick film by screen printing technique and processing the same by microwave which also compared with the conventionally processed thick films.

Development of piezocapacitive thick film strain gage based on ceramic diaphragm (세라믹 다이어프램을 이용한 정전용량형 후막 스트레인 게이지)

  • Lee, Seong-Jae;Park, Ha-Young;Kim, Jung-Ki;Min, Nam-Ki
    • Proceedings of the KIEE Conference
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    • 2003.07c
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    • pp.1529-1531
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    • 2003
  • Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, piezocapastive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. The screen printing technique has been used to fabricate the pressure sensors on alumina substrate($Al_2O_3$). Thick film capacitive of strain sensing characteristics are reported and dielectric paste based on (Ti+Ba) materials. The electric property of dielectric paste has been studied and exhibit good properly with good gage factor comparable to piezoresistive strain gage. New piezocapacitive strain sensor was designed and tested. The output of capacitive value was good characteristics.

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An Investigation on the Dielectric and Microwave Properties of Ag(Ta,Nb)O3 Thick Films on the Alumina Substrates (알루미나 기판에 스크린 프린팅된 Ag(Ta,Nb)O3 후막의 유전특성 및 초고주파 특성에 대한 연구)

  • Lee, Ku-Tak;Koh, Jung-Hyuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.11
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    • pp.925-928
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    • 2011
  • Perovskite niobates and tantalates have been placed on a short list of functional materials for future technologies. This article was investigated ferroelectric materials $Ag(Ta,Nb)O_3$ thick film. In this study, we have fabricated the $Ag(Ta,Nb)O_3$ thick film on the $Al_2O_3$ substrates by screen printing method. The $Ag(Ta,Nb)O_3$ thick film were fabricated by the mixed oxide method. The sintering temperature and time were 1,150$^{\circ}C$, 2 hr. The electrical properties of $Ag(Ta,Nb)O_3$ thick film were investigated at 30~100$^{\circ}C$.

Aspects of Hard Breakdown Characteristics in a 2.2-nm-thick $SiO_2$ Film

  • Komiya, Kenji;Omura, Yasuhisa
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.3
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    • pp.164-169
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    • 2002
  • This paper mainly discusses the hard breakdown of 2.2-nm-thick $SiO_2$ films. It is shown that the hard breakdown event of a 2.2-nm-thick $SiO_2$ film greatly depends on the applied electric field. It is strongly suggested that the local weak spots created by applying a low initial stress to a 2.2-nm-thick $SiO_2$film resist the onset of hard breakdown. In other words, it is anticipated that the stored electrostatic energy is fast dissipated by trap-assisted tunneling in 2.2-nm-thick $SiO_2$ film. Consequently, it is strongly suggested that 2.2-nm-thick $SiO_2$ films are intrinsically quite robust.

On the Stannic Oxide Thick Film (산화 주석 후막에 대하여)

  • 박순자
    • Journal of the Korean Ceramic Society
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    • v.12 no.1
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    • pp.5-11
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    • 1975
  • Thick film resistor paste was made utilizing oxide materials such as SnO, SnO+Sb2O3, and SnO+Zn. The oxide materials were mixed respectively with Q-12 glass powder and finally suspended in ethyl cellulose dissolved in ethyl cellosolve. Thick film resistor was made by screen printing the paste on the alumina substrate and firing it at a suitable temperature. Among thick films made from the resistor paste, the thick film containing 85% SnO and fired at $600^{\circ}C$ demonstrated the finest electrical properties showing 10 K ohm in sheet resistance, 110 ppm/$^{\circ}C$ in TCR. In general, TCR of the thick films made from the oxide-mixture paste is good in linearity, therefore it is suggested the oxide-mixture paste is utilized as the negative thermistor.

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Preparation of BaTiO3 Thick Film by an Interfacial Polymerization Method

  • Iwasaki, Mitsunobu;Park, Won-Kyu
    • Korean Journal of Materials Research
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    • v.17 no.10
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    • pp.548-554
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    • 2007
  • [ $BaTiO_3$ ] thick film by an interfacial polymerization method was prepared at the liquid/liquid interface between benzyl alcohol saturated solution with the basic catalyst [diethyl amine ($NHEt_2$) or triethylamine ($NEt_3$)], and the water dissolved with $TiO_2$ and $Ba(CH_3COO)_2$. The film thickness increased gradually with an increase in diethyl amine($NHEt_2$) or triethylamine($NEt_3$) volume and the reaction time. The homogeneity of $BaTiO_3$ thick film after sintered at $600^{\circ}C$ was confirmed by EPMA analysis, which showed that both of Ba and Ti element were homogeneously distributed on the surface as well as in the perpendicular direction of the film. The thickness of $BaTiO_3$ film obtained by this process was $8.75\;{\mu}m$.

바이오응용을 위한 압전 공진형 MEMS 소자

  • Kim Yong Bum;Kim Hyung Joon;Kang Ji-Yoon;Kim Tae Song
    • 한국가시화정보학회:학술대회논문집
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    • 2002.04a
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    • pp.1-7
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    • 2002
  • This papers describes the preparation and experimental results of a micro mass detection devices based on cantilever and a diffuser-type micro pump using screen printing thick-film technologies and Si micro-machining. PZT-PCW thick films were prepared by new hybrid method based on the screen printing. By applying these PZT-PCW piezoelectric thick films on actuator, a cantilever for mass detection sensor and a micropump for microfluidic element are successfully fabricated. Resonant frequency and displacement of PZT-PCW thick film actuator in air and in liquid are measured by laser vibrometer system as a function of actuator size. The resonant frequency of PZT-PCW thick film actuator in liquid decreases order of 1/2-1/4 due to damping effect. The sensitivity of cantilever is characterized by Au deposition method which has the mass loading effect such as adsorption of protein. The Sensitivity of PZT-0.12PCW thick film cantilever is proportional to detecting area.

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Influence of Metal-Coating Layer on an Electrical Resistivity of Thick-Film-Type Thermoelectric Modules Fabricated by a Screen Printing Process (스크린 프린팅 공정에 의해 제조된 열전후막모듈의 전기저항에 미치는 금속코팅층의 영향)

  • Kim, Kyung-Tae;Koo, Hye-Young;Ha, Gook-Hyun
    • Journal of Powder Materials
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    • v.18 no.5
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    • pp.423-429
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    • 2011
  • Thermoelectric-thick films were fabricated by using a screen printing process of n and p-type bismuth-telluride-based pastes. The screen-printed thick films have approximately 30 ${\mu}m$ in thickness and show rough surfaces yielding an empty gap between an electrode and the thick film. The gap might result in an increase of an electrical resistivity of the fabricated thick-film-type thermoelectric module. In this study, we suggest a conductive metal coating onto the surfaces of the screen-printed paste in order to reduce the contact resistance in the module. As a result, the electrical resistivity of the thermoelectric module having a gold coating layer was significantly reduced up to 30% compared to that of a module without any metal coating. This result indicates that an introduction of conductive metal layers is effective to decrease the contact resistivity of a thick-film-typed thermoelectric module processed by screen printing.

A study on the Glass Frit for Thick Film Copper Conductor (후막 구리도체용 유리에 관한 연구)

  • Lee, Joon;Lee, Sang Won
    • Applied Chemistry for Engineering
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    • v.2 no.3
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    • pp.289-299
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    • 1991
  • In order to obtain glasses appropriate to the thick film copper conductors, nine glasses based on both lead borosilicate and leadless borosilicate systems were made and the applicabilities of them were examined in conjunction with the requirements for thick film copper conductors. As the results, it was found that all the glasses are fitted to provide suitable sheet resistance, solderability and solder leach resistance to thick film copper conductors. However, it was turned out that only the lead borosilicate based glasses worked for getting usable aged adhesion strength of copper thick film to the alumina substrate, while copper conductor films made from the other glasses had poor aged adhesion strengths. Particularly cuprous oxide added lead borosilicate glass was considered as one of the most favorable glasses for manufacturing thick film copper conductors.

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EPD Thick Film Formation of Ceramic Powder Materials (세라믹 분말재료의 EPD 후막형성 기술)

  • Soh, Dea-Wha;Jeon, Yong-Woo
    • Journal of the Speleological Society of Korea
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    • no.75
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    • pp.49-54
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    • 2006
  • Electrophoretic Deposition (EPD) is the most convenient technology to deposit natural or oxide powders of nonconductive materials in alcoholic suspension solution with adding electrolyte of iodine to form ceramic thick film on metal substrate under applied electric field with double electric layer between electrode and metal substrate. In this research work, the important parameters and technical ways were studied to form EPD thick films of typical oxide ceramics of Al2O3, YBCO and tourmaline powders.