• 한국정밀공학회지
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• 제20권10호
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Nuclear Engineering and Technology
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• 제54권6호
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• pp.2173-2187
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• 2022

A 3D thermo-elasto-hydrodynamic model is developed to analyze the sealing performance of a notched mechanical seal applied in the reactor coolant pump. In the model, the generalized Reynolds equation, the energy equation coupled with notch heat balance equation, the heat conduction equations, and the deformation equations of the sealing rings are iteratively solved by the finite element method. The film pressure and temperature distribution are obtained, and the deformation of the sealing rings is revealed to study the mechanism of the notched mechanical seals. A parameterized study is conducted to analyze the sealing performance under different operating conditions. As a comparison, the sealing performance of non-notched seals is also studied. The results show that the hydrostatic effect is dominant in the load-carrying capacity of the fluid film due to the radial mechanical and thermal deformations. The notch can cool the fluid film and influence the thermal deformation of seal rings. The sealing performance is sensitive to the pressure difference, ambient temperature, and rotational speed. It is suggested to set the notches on the softer sealing rings to acquire the greater hydrodynamic effect. Compared with the non-notched, the notched end face holds a better lubrication performance, especially under lower rotational speed.

• Coupled systems mechanics
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• 제3권1호
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• pp.89-110
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• 2014

In this work we provide the theoretical formulation, discrete approximation and solution algorithm for instability problems combing geometric instability at large displacements and material instability due to softening under combined thermo-mechanical extreme loads. While the proposed approach and its implementation are sufficiently general to apply to vast majority of structural mechanics models, more detailed developments are provided for truss-bar model. Several numerical simulations are presented in order to illustrate a very satisfying performance of the proposed methodology.

• 한국지반공학회논문집
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• 제37권10호
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• pp.27-40
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• 2021

동상민감성 지반의 융기 및 침하 방지를 위한 공법을 지반 안정화 공법이라고 하며 열 사이펀은 대표적인 지반 안정화 공법 중 하나이다. 열 사이펀은 최근 간편한 해석모델 개발과 더불어 열 해석이 진행되었지만, 이에 따른 동상민감성 지반의 열적 거동을 고려하지 않았다. 따라서 본 연구는 열 사이펀의 성능에 따른 지반의 온도 변화를 위한 열 해석과 이에 따른 지반의 거동을 예측하기 위한 구조해석을 동시에 수행하기 위해 ABAQUS 내부 사용자 서브루틴을 사용하여 열 사이펀을 적용한 TM(Thermo-Mechanical) 모델을 개발하여 열 사이펀의 성능에 따른 지반 융기 억제성능을 확인하였다. 해석결과 열 사이펀의 성능 증가에 따라 지반의 최종 융기가 감소하였으며 냉매 충전율 25%, 50% 그리고 100%의 열 사이펀 적용 시 각각 5.5%, 14.4%, 21% 융기 억제성능을 나타내었다.

• Journal of Mechanical Science and Technology
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• 제17권12호
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• pp.2099-2106
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• 2003

In this paper, a novel fast response NDIR analyzer (FRNDIR), which uses an electrically pulsed semiconductor emitter and dual type PbSe detector for the PPM-level detection of carbon dioxide (CO$_2$) at a wavelength of 4.28 $\mu\textrm{m}$, is described. Modulation of conventional NDIR energy typically occurs at 1 to 20 Hz. To achieve real time high-speed measurement, the new analyzer employs a semiconductor light emitter that can be modulated by electrical chopping. Updated measurements are obtained every one millisecond. The detector has two independent lead selenide (PbSe) with IR band pass filters. Both the emitter accuracy and the detector sensitivity are increased by thermoelectric cooling of up to -20 degrees C in all semiconductor devices. Here we report the use of semiconductor devices to achieve improved performance such that these devices have potential application to CO$_2$ gas measurement and, in particular, the measurement of fast response CO$_2$ concentration at millisecond level.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2016년도 추계 학술논문 발표대회
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• pp.60-61
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• 2016

Performance has been developed in terms of structural strength. Especially, in a structural steels, it is regarded as a common design process that an yield stress of thicker plate than 40mm uses that of below 40mm in thickness. This can be done using TMCP(Thermo mechanical control process). In this study, the structural stabilities such as deflection, maximum load carrying capacity would be calculated in high temperatures.

• 한국수소및신에너지학회논문집
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• 제29권5호
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• pp.538-548
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• 2018

The thermo-acoustic instability in the combustion process of a gas turbine is caused by the interaction of the heat release mechanism and the pressure perturbation. These acoustic vibrations cause fatigue failure of the combustor and decrease the combustion efficiency. This study is to develop a segmented dynamic thermo-acoustic model to understand combustion instability of gas turbine. Therefore, this study required a dynamic analysis rather than static analysis, and developed a segmented model that can analyze the performance of the system over time using the Matlab/Simulink. The developed model can confirm the thermo-acoustic combustion instability and exhaust gas concentration in the combustion chamber according to the equivalent ratio change, and confirm the thermo-acoustic combustion instability for the inlet temperature and the load changes. As a result, segmented dynamic thermo-acoustic model has been developed to analyze combustion instability under the operating condition.

• Composites Research
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• 제36권2호
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• pp.117-125
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• 2023

본 논문에서는 복합소재 적층 구조물의 열-기계적 거동을 효과적으로 예측할 수 있는 8절점 판 요소 기반 전산해석 기법을 제안하고자 한다. 횡방향 수직 변형이 고려된 개선된 일차전단변형이론을 바탕으로 유한요소 정식화를 수행하였으며, 독립적으로 가정되는 변위장 및 응력장 사이의 타당한 수학적 관계식을 도출함으로써 해석 결과의 정확도와 계산 과정의 효율성을 동시에 향상시키고자 하였다. 또한, 횡 방향 변위장의 개선을 통해 횡 방향 수직 변형을 효과적으로 고려함으로써, 복합소재 적층 구조물의 열적 거동 예측 과정에서의 신뢰성을 확보하고자 하였다. 수치 예제로써 열-기계 하중을 받는 2차원 복합소재 적층평판을 고려하였으며, 3차원 탄성해 및 참고문헌에서 활용 가능한 해석 결과와의 비교, 검토를 통해 제안된 유한요소 해석 기법의 성능을 검증하였다.

• Nuclear Engineering and Technology
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• 제43권6호
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• pp.489-498
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• 2011

UK National Nuclear Laboratory's (NNL's) version of the ENIGMA fuel performance code is described, including details of the development history, the system modelled, the key assumptions, the thermo-mechanical solution scheme, and the various incorporated models. The recent development of ENIGMA in the areas of whole core analysis and dry storage applications is then discussed. With respect to the former, the NEXUS code has been developed by NNL to automate whole core fuel performance modelling for an LWR core, using ENIGMA as the underlying fuel performance engine. NEXUS runs on NNL's GEMSTONE high performance computing cluster and utilises 3-D core power distribution data obtained from the output of Studsvik Scandpower's SIMULATE code. With respect to the latter, ENIGMA has been developed such that it can model the thermo-mechanical behaviour of a given LWR fuel rod during irradiation, pond cooling, drying, and dry storage - this involved: (a) incorporating an out-of-pile clad creep model for irradiated Zircaloy-4; (b) including the ability to simulate annealing out of the clad irradiation damage; (c) writing of additional post-irradiation output; (d) several other minor modifications to allow modelling of post-irradiation conditions.