• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• The Korean Journal of Mycology
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• v.40 no.2
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• pp.78-85
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• 2012

URP primers that were derived from repetitive DNA sequence of rice weedy rice have been applied for producing PCR polymorphisms in different fungal species. URP-PCR protocol employed stringent PCR with high annealing temperature over $55^{\circ}C$ throughout the thermo-cycling reaction, giving high reproducibility. Under the PCR condition, Each single URP primer produced characteristic fingerprints from diverse genomes of different fungal species, indicating its universal applicability. URP-PCR has been accessed for applicability to various fungal species with 33 genus, 142 species and 1,489 isolates. Numerous related papers have demonstrated that URP-PCR profiles of fungal species are very useful for identifying fungal species at intra and inter species levels. The results were reviewed in this paper.

• Korean Journal of Microbiology
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• v.43 no.1
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• pp.1-6
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• 2007

We describe a multiplex PCR method that can detect and differentiate simultaneously four different kinds of DNA viruses, Epstein-Barr virus (EBV), cytomegalovirus (CMV), hepatitis B virus (HBV) and parvovirus B19 (B19). Primers for the multiplex PCR reaction were designed to amplify specific regions of the EBV (pol), CMV (pol), HBV (pol) and B19 (ns) viral genomes and used to simultaneously detect individual viruses. In order to achieve optimal sensitivity and specificity for multiplex PCR, the thermo-cycling parameters, primer sequences, and concentration of each reaction components were optimized systematically. The sensitivity of the detection method ranged between 5 and 10 copies of viral genome with a mixture of multiple primer pairs. Furthermore, this highly sensitive test showed no cross-reactivity among the four viruses. Thus, the results obtained in this study provide evidence that the assay system is a good tool for supporting the diagnosis of viral infection and contamination.

• The Journal of Korean Academy of Prosthodontics
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• v.44 no.4
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• pp.383-393
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• 2006

Statement of problem : Limited research on flowable resin has been undertaken on its application directly on dentin associated with the adhesive systems. Purpose : This study was to evaluate the shear bond strengh and fracture aspect of flowable resin on human dentin with various types of dentin bonding adhesives with thermo cycling effect. Materials and methods: Filtek-Flow(3M ESPE, USA) was used as flowable resin and Eighty human molars were randomly divided into 4 groups : three dentin bonding adhesives (Scotchbond-Multipurpose : 3-step contentional system, One-Step : One-bottle system. Prompt L-Pop : All-in-one, self-etching primer) and 32% etching treatment without bonding adhesive as a control group. For evaluating their durability of bonding, each group was subdivided : storaging in the water at 37$^{\circ}C$(24 hours) and thermocycling (0$^{\circ}C$-55$^{\circ}C$, 30 seconds intervals, 1000 cycle). Shear bond strength tests were performed and resin-dentin interface and fracture mode were observed. Results were analysed by one-way ANOVA and Scheffe's multiple range test. Results and Conclusion : 1. At 0 cycle, the mean shear bond strength of One-Step exhibited the highest value of all groups(p<0.05), and there were no significant differences between Prompt L-Pop and Scotchbond-Multipurpose, Scotchbond-Multipurpose and control(p>0.05). After 1000 thermocycling, One-Step exhibited higher value than other groups(p<0.05), and there were no significant differences among other groups (p>0.05). 2. The shear bond strength of each group was significantly decreased after thermocycling except Scotchbond-Multipurpose (p>0.05). 3. The most common failure mode was adhesive type and mixed type, next in order.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Restorative Dentistry and Endodontics
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• v.33 no.2
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• pp.148-161
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• 2008

The purpose of this study was to evaluate the effect of chlorhexidine (CHX) on microtensile bond strength (${\mu}TBS$) of dentin bonding systems. Dentin collagenolytic and gelatinolytic activities can be suppressed by protease inhibitors, indicating that MMPs (Matrix metalloproteinases) inhibition could be beneficial in the preservation of hybrid layers. Chlorhexidine (CHX) is known as an inhibitor of MMPs activity in vitro. The experiment was proceeded as follows: At first, flat occlusal surfaces were prepared on mid-coronal dentin of extracted third molars. GI (Glass Ionomer) group was treated with dentin conditioner, and then, applied with 2 % CHX. Both SM (Scotchbond Multipurpose) and SB (Single Bond) group were applied with CHX after acid-etched with 37% phosphoric acid. TS (Clearfil Tri-S) group was applied with CHX, and then, with adhesives. Hybrid composite Z-250 and resin-modified glass ionomer Fuji-II LC was built up on experimental dentin surfaces. Half of them were subjected to 10,000 thermocycle, while the others were tested immediately. With the resulting data, statistically two-way ANOVA was performed to assess the ${\mu}TBS$ before and after thermo cycling and the effect of CHX. All statistical tests were carried out at the 95 % level of confidence. The failure mode of the testing samples was observed under a scanning electron microscopy (SEM). Within limited results, the results of this study were as follows; 1. In all experimental groups applied with 2 % chlorhexidine, the microtensile bond strength increased, and thermo cycling decreased the micro tensile bond strength (P > 0.05). 2. Compared to the thermocycling groups without chlorhexidine, those with both thermocycling and chlorhexidine showed higher microtensile bond strength, and there was significant difference especially in GI and TS groups. 3. SEM analysis of failure mode distribution revealed the adhesive failure at hybrid layer in most of the specimen. and the shift of the failure site from bottom to top of the hybrid layer with chlorhexidine groups. 2 % chlorhexidine application after acid-etching proved to preserve the durability of the hybrid layer and microtensile bond strength of dentin bonding systems.

• Restorative Dentistry and Endodontics
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• v.33 no.2
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• pp.125-132
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• 2008

The purpose of this study is to compare the shear bond strength of repaired composite resin with different bonding agents and evaluate the effect of bonding agents on composite repair strength. Forty composite specimens (Z-250) were prepared and aged for 1 week by thermo cycling between 5 and $55^{\circ}C$ with a dwell time of 30s. After air abrasion with $50\;{\mu}m$ aluminum oxide, following different bonding agents were applied (n = 10); SB group: Scotchbond multipurpose adhesive (3 step Total-Etch system); XE group: Clearfil SE bond (2 step Self-Etch system); XP group: XP bond (2 step Total-Etch system); XE group: Xeno III (1 step Self-Etch system). After bonding procedure was completed, new composite resin (Z-250) was applied to the mold and cured. For control group. 10 specimens were prepared. Seven days after repair, shear bond strength was measured. Data was statistically analyzed using one-way ANOVA and Tukey's test (p<0.05). The means and standard deviations of shear bond strength (MPa ${\pm}$ S.D.) per group were as follows: SB group: 17.06; SE group: 19.10; XP group: 14.44; XE group: 13.57; Control Group: 19.40. No significant difference found in each group. Within the limit of this study, it was concluded that the different type of bonding system was not affect on the shear bond strength of repaired composite resin.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.2
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• pp.200-211
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• 1999

For many years permanent soft denture liners has been widely used in dental practice directly or indirectly because of its function in absorbing and distributing the impact force. However, it reveals problems such as lack of permanency and decreased bond strength in long term use. The purpose of this study is to measure the bond strength and failure between denture base resin and several permanent liners. Lucitone 199 was used as denture base resin with soft acrylic liners (Triad, Tokuso Rebase) and silicone elastomers (Tokuyama, Ufi Gel C) bonded to measure the tensile strength before and after thermocycling. The thermocycling was done in 2000 cycles at $5^{\circ}C,\;26^{\circ}C\;and\;55^{\circ}C$ and the measured tensile strength values before and after thermocycling were compared. The mode of failure was investigated in the separated specimens. The results are as follows. 1. As to tensile strength, the strongest material is Tokuso Rebase followed by Triad, Tokuyama, Ufi Gel C in before thermocycling and the order of Triad, Tokuso Rebase, Tokuyama, Ufi Gel C in after thermocycling state. There was significant difference between the values of Triad, Tokuso Rebase and Tokuyama, Ufi Gel C(p<0.05). 2. As to degree of displacement, Ufi Gel C showed most displacement with or without thermo-cycling treatment and also the difference was significant with the other materials(p<0.05). 3. As to comparisons before and after thermocycling, Tokuso Rebase and Tokuyama showed significant difference in bond strength, whereas Triad and Tokuso Rebase showed significant difference in the degree of displacement(p<0.05). 4. In debonded specimens, Triad and Ufi Gel C showed adhesion failure and Tokuyama showed cohesion failure. Both failures were observed in Tokuso Rebase with adhesion failure up to 70%. The results of this study showed that degree of bond strength between permanent soft denture liner and denture base resin were variable. There was a significant difference between soft acrylics and silicone elastomers with regard to bond strength. Further research in improving bond strength of widely used silicone elastomers and in developing the method of measuring bond strength between denture base resin and the lining materials is needed.

• Journal of Digital Convergence
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• v.19 no.3
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• pp.245-251
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• 2021

This study was to investigate the effect of the new surface treatment method of zirconia on the shear bond strength with resin cement. The zirconia specimens were classified according to the surface treatment. CON: non-treatment, HF: 10 minutes exposure to 9% HF, ZS15: Apply 15% ZrO2 slurry, ZS30: Apply 30% ZrO2 slurry, ZS50: Apply 50% ZrO2 slurry. The resin cement was layered on the surface treated zirconia, and the shear bond strength between the zirconia and the resin cement was measured after thermo-cycling. The statistical methods for shear bond strength were Kruskal-Wallis test, Mann-Whitney U test, and Bonferroni correction(α=.05/10=.005). ZS15, ZS30, and ZS50 groups treated with zirconia slurry showed higher shear bond strength than CON and HF groups(p<.05/10=.005). Within the limits of this study, the surface treatment using zirconia slurry increased the shear bond strength with resin cement. The new surface treatment method complements and improves the limitations of the adhesion of zirconia, so that various clinical applications of zirconia can be expected.