• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.4
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• pp.614-622
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• 2003

In this paper, the stress-strain curves of bearing steels at hot working conditions are obtained by hot compression test with a computer controlled servo-hydraulic Gleeble 3800 testing machine and elongations and reductions of area of the bearing steels are also obtained by hot tensile test with a Gleeble 1500 testing machine. Experiments are conducted under the various strain-rates and temperatures and their results are used to obtain the flow stress information. A rigid thermo-viscoplastic finite element method is applied to the multi-stage hot forging process in order to predict temperature distribution of workpiece. The experimental results and the analysis results are used to obtain an optimal hot forging condition.

• Food Science and Biotechnology
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• v.16 no.2
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• pp.234-237
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• 2007

Water resistance of three biopolyester films, such as poly-L-lactate (PLA), poly-hydroxybutyrate-co-valerate (PHBV), and Ecoflex, and low density polyethylene (LDPE) film was investigated by measuring contact angle of various probe liquids on the films. The properties measured were initial contact angle of water, dynamic change of the water contact angle with time, and the critical surface energy of the films. Water contact angle of the biopolyester films ($57.62-68.76^{\circ}$) was lower than that of LDPE film ($85.19^{\circ}$) indicating biopolyester films are less hydrophobic. The result of dynamic change of water contact angle also showed that the biopolyester films are less water resistant than LDPE film, but much more water resistant than cellulose-based packaging materials. Apparent critical surface energy for the biopolyester films (35.15-38.55 mN/m) was higher than that of LDPE film (28.59 mN/m) indicating LDPE film is more hydrophobic.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.63-67
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• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.98-104
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• 2023

The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.749-750
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• 2011

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.7-13
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• 2013

3D stacked IC is one of the promising candidates which can keep Moore's law valid for next decades. IC can be stacked through various bonding technologies and they were reviewed in this report, for example, wafer direct bonding and atomic diffusion bonding, etc. As an effort to reduce the high temperature and pressure which were required for high bonding strength in conventional Cu-Cu thermo-compression bonding, surface activated bonding, solid liquid inter-diffusion and direct bonding interface technologies are actively being developed.

• Structural Engineering and Mechanics
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• v.69 no.5
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• pp.537-545
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• 2019

Stress analysis of bottom-hole rock has to be considered with much care to further understand rock fragmentation mechanism and high penetration rate. This original study establishes a fully coupled simulation model and explores the effects of overburden pressure, horizontal in-situ stresses, drilling mud pressure, pore pressure and temperature on the stress distribution in bottom-hole rock. The research finds that in air drilling, as the well depth increases, the more easily the bottom-hole rock is to be broken. Moreover, the mud pressure has a great effect on the bottom-hole rock. The bigger the mud pressure is, the more difficult to break the bottom-hole rock is. Furthermore, the maximum principal stress of the bottom-hole increases as the mud pressure, well depth and temperature difference increase. The bottom-hole rock can be divided into three main regions according to the stress state, namely a) three directions tensile area, b) two directions compression areas and c) three directions compression area, which are classified as a) easy, b) normal and c) hard, respectively, for the corresponding fragmentation degree of difficulty. The main contribution of this paper is that it presents for the first time a thorough study of the effect of related factors, including stress distribution and temperature, on the bottom-hole rock fracture rather than the well wall, using a thermo-poroelastoplasticity model.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.