• 한국전기전자재료학회논문지
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• 제17권11호
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• pp.1149-1155
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• 2004

In this paper, novel methods for improvement of thermal stability of Ni-germano Silicide were proposed for nano CMOS applications. It was shown that there happened agglomeration and abnormal oxidation in case of Ni-germano Silicide using Ni only structure. Therefore, 4 kinds of tri-layer structure, such as, Ti/Ni/TiN, Ni/Ti/TiN, Co/Ni/TiN and Ni/Co/TiN were proposed utilizing Co and Ti interlayer to improve thermal stability of Ni-germano Silicide. Ti/Ni/TiN structure showed the best improvement of thermal stability and suppression of abnormal oxidation although all kinds of structures showed improvement of sheet resistance. That is, Ti/Ni/TiN structure showed only 11 ohm/sq. in spite of 600 $^{\circ}C$, 30 min post silicidation annealing while Ni-only structure show 42 ohm/sq. Therefore, Ti/Ni/TiN structure is highly promising for nano-scale CMOS technology.

• 한국기계가공학회지
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• 제19권1호
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• pp.100-107
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• 2020

As demand for high value-added products with hard materials increases, the line center is used for producing high value-added products in many industries such as aerospace, automobile fields. The line center is a key device for smart factory automation that can improve the production efficiency and the productivity. Therefore, the development of a mill-turn line center is necessary to produce high value-added products with complex shapes flexibly. In the mill-turn process, a milling process and a turning process are combined. In particular, the turning process needs to increase the rigidity of the spindle. The purpose of this study is to analyze the thermal-structural stability through thermo-structural coupled analysis for a mill-turn spindle with a curvic coupling. The maximum temperature and thermal stability of the spindle were analyzed by thermal distribution. In addition, the thermal deformation and thermal-structural stability of the spindle were analyzed through thermo-structural coupled analysis.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.132-136
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• 2003

A Multi-Spectral Camera (MSC) is the payload of KOMPSAT-2 which is designed for earth imaging in visible and near-Infrared region on a sun-synchronous orbit. The telescope in the MSC is a Ritchey-Chretien type with large aperture. The telescope structure should be well stabilized and the optical alignment should be kept steady so that best images can be achieved. However, the MSC is exposed to adverse thermal environment on the orbit which can give impacts on optical performance. Metering structure which is exposed to adverse space environment should have tight requirement of low thermal expansion and hygroscopic stability. In order to meet those stability requirements in addition to fundamental structural ones telescope structure was designed with newly developed graphite-cyanate composite which has high tensile modulus, high thermal conductivity and low moisture absorption compared with conventional graphite-epoxy composite. In this paper, space-borne telescope structure with new composite material will be presented and fulfillment of stability requirements will be verified with designed structure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.15-16
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• 2006

The thermal stability of nickel silicide with compressively and tensilely stressed nitride capping layer has been investigated in this study. The Ni (10 nm) and Ni/Co/TiN (7/3/25 nm) structures were deposited on the p-type Si substrate. The stressed capping layer was deposited using plasma enhanced chemical vapor deposition (PECVD) after silicide formation by one-step rapid thermal process (RTP) at $500^{\circ}C$ for 30 sec. It was found that the thermal stability of nickel silicide depends on the stress induced by the nitride capping layer. In the case of Ni (10 nm) structure, the high compressive sample shows the best thermal stability, whereas in the case of Ni/Co/TiN (7/3/25 nm) structure, the high compressive sample shows the worst thermal stability.

• 한국전기전자재료학회논문지
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• 제21권1호
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• pp.18-22
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• 2008

In this paper, the Ni-Co alloy was used for thermal stability estimation comparison with Ni structure. The proposed Ni/Ni-Co structure exhibited wider range of rapid thermal process windows, lower sheet resistance in spite of high temperature annealing up to $700^{\circ}C$ for 30 min, more uniform interface via FE-SEM analysis, NiSi phase peak. Therefore, The proposed Ni/Ni-Co structure is highly promising for highly thermal immune Ni-silicide for nano-scale MOSFET technology.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.667-670
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• 2003

Ni-silicide has low thermal stabiliy. This point is obstacle to apply NiSi to devices. So In this paper, we have studied for obtain thermal stability and analysis of dopant dependency of NiSi. And then we applied Ni-silicide to devices. To improvement of thermal stability, we deposit Ni70/Co10/Ni30/TiN100 to sample. Co midlayer is enhanced thermal stability of NiSi. Co/Ni/TiN, this structure show very difference between n-poly and p-poly in sheet resistance. But Ni/Co/Ni/TiN, structure show less difference. Also junction leakage is good.

• 한국재료학회지
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• 제14권2호
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• pp.94-100
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• 2004

We have investigated the magnetic domain structure and the thermal stability of magnetotransport properties of IrMn biased spin-valves containing Co, CoFe and NiFe. The magnetic domain structures were imaged using a magneto-optical indicator film(MOIF) technique. To investigate the thermal stability, magnetoresistance(MR) was measured at annealing temperature(TANN) and room temperature($T_{RT}$) followed by the annealing. Domain imaging reveal that the increase of annealing temperature led to changes in the exchange coupling between the two ferromagnet(FM) layers through nonmagnetic layer rather than between FM and antiferromagnet. unlike the NiFe biased IrMn spin valve with large domains, MOIF pictures of Co and CoFe biased IrMn spin valve structures show the formation of many small microdomains. The magnetic structure, as revealed by the domain images, appeared unchanged while the MR dropped dramatically. From the combined giant magnetoresistance(GMR) and MOIF results, it was apparent that the decrease of MR ratio was not related to the spin valve magnetic structure up to about $350^{\circ}C$($T_{RT}$ ).

• Structural Engineering and Mechanics
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• 제32권3호
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• pp.429-445
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• 2009

Thermal stability of quasi-isotropic composite and polymeric structures is considered one of the most important criteria in predicting life span of building structures. The outdoor applications of these structures have raised some legitimate concerns about their durability including moisture resistance and thermal stability. Exposure of such quasi-isotropic composite/polymeric structures to various and severe climatic conditions such as heat flux and frigid climate would change the material behavior and thermal viability and may lead to the degradation of material properties and building durability. This paper presents an analytical model for the generalized problem. This model accommodates the non-linearity and the non-homogeneity of the internal heat generated within the structure and the changes, modification to the material constants, and the structural size. The paper also investigates the effect of the incorporation of the temperature and/or material constant sensitive internal heat generation with four encountered climatic conditions on thermal stability of infinite cylindrical quasi-isotropic composite/polymeric structures. This can eventually result in the failure of such structures. Detailed critical analyses for four case studies which consider the population of the internal heat generation, cylindrical size, material constants, and four different climatic conditions are carried out. For each case of the proposed boundary conditions, the critical thermal stability parameter is determined. The results of this paper indicate that the thermal stability parameter is critically dependent on the cylinder size, material constants/selection, the convective heat transfer coefficient, subjected heat flux and other constants accrued from the structure environment.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권2호
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• pp.277-282
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• 2017

Nickel germanide (NiGe) is one of the most promising alloy materials for source/drain (S/D) of Ge MOSFETs. However, NiGe has limited thermal stability up to $450^{\circ}C$ which is a challenge for fabrication of Ge MOSFETs. In this paper, a novel method is proposed to improve the thermal stability of NiGe using Co interlayer. As a result, we found that the thermal stability of NiGe was improved from $450^{\circ}C$ to $570^{\circ}C$ by using the proposed Co interlayer. Furthermore, we found that current-voltage (I-V) characteristic was improved a little by using Co/Ni/TiN structure after post-annealing. Therefore, NiGe formed by the proposed Co interlayer that is, Co/Ni/TiN structure, is a promising technology for S/D contact of Ge MOSFETs.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.17-18
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• 2008

In this paper, 1%-nitrogen doped Nickel was used for improvement of thermal stability of Ni-Germanide. Proposed Ni-N(1%)/TiN structure has shown better thermal stability, sheet resistance and less agglomeration characteristic than pure Ni/TiN structure. During the germanidation process, it is believed that the nitrogen atoms in the deposited nickel layer can suppress the agglomeration of Ni germanide by retarding the diffusion of Ni atoms toward silicon layer, hence improve the thermal stability of Ni-germanide.