• 대한기계학회논문집B
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• 제40권11호
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• pp.737-744
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• 2016

인쇄기판형 열교환기는 집적도가 높고 구조적으로 견고하여 차세대 초임계 이산화탄소 발전 사이클용 열교환기로 각광받고 있다. 본 논문에서는 열원측과 열침측의 채널 크기가 상이한, 획기적인 형태의 인쇄기판형 열교환기에 대한 수치적 연구 결과를 보고한다. 초임계 이산화탄소를 작동유체로 하는 인쇄기판형 열교환기에 대해서 형상변수에 따른 전열성능을 해석하였으며, 그 결과 열원 혹은 열침측의 채널 직경이 증가함에 따라 유속 감소에 의해 전열성능이 단조적으로 감소하는 것을 확인하였다. 채널간격의 경우 열교환기의 전열성능에 크게 영향을 미치지 않는 것으로 나타났다. 또한 수력직경이 동일할 경우 채널 단면의 모양은 전열성능에 괄목할 만한 영향을 미치지 않는 것으로 나타났다.

• Journal of Mechanical Science and Technology
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• 제19권4호
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• pp.1052-1061
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• 2005

A small-scale loop heat pipe (LHP) with polypropylene wick was fabricated and tested for investigation of its thermal performance. The container and tubing of the system were made of stainless steel and several working fluids were tested including methanol, ethanol, and acetone. The heating area was $35\;mm\;{\times}\;35\;mm$ and nine axial grooves were provided in the evaporator to provide vapor passages. The pore size of the polypropylene wick inside the evaporator was varied from $0.5\; {\mu}m\;to\;25\;{\mu}m.$ The inner diameter of liquid and vapor transport lines were 2.0 mm and 4.0 mm, respectively and the length of which were 0.5 m. The size of condenser was $40\;mm\;(W)\;{\times}\;50\;mm\;(L)$ in which ten coolant paths were provided. Start-up characteristics as well as steady-state performance was analyzed and discussed. The minimum thermal load of $10\;W\;(0.8\;W\;/cm^{2})$ and maximum thermal load of $80\;W\;(6.5\;W\;/cm^{2})$ were achieved using methanol as working fluid with the condenser temperature of $20^{\circ}C$ with horizontal position.

• 한국정밀공학회지
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• 제20권10호
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• 한국산업융합학회 논문집
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• 제22권6호
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• pp.767-773
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• 2019

The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.89-94
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• 2011

In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, a numerical analysis model of cooling system in thermal NIL was development by CAD/CAE program and the performance of the cooling system was analyzed by the model. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the case that the cooling material is replaced by liquid nitrogen is investigated.

• International Journal of Air-Conditioning and Refrigeration
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• 제17권4호
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• pp.141-148
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• 2009

Afterfogging of the regenerative gas turbine system has an advantage over inlet fogging in that the high outlet temperature of air compressor makes the injection of more water and the recuperation of more exhaust heat possible. This study investigates the effects of turbine inlet temperature (TIT) on the performance of regenerative gas turbine system with afterfogging through a thermodynamic analysis model. For the standard ambient conditions and the water injection ratios up to 5%, the variation of system performance including the thermal efficiency is numerically analyzed with respect to the variations of TIT and pressure ratio. It is also analyzed how the maximum thermal efficiency, net specific work, and pressure ratio itself change with TIT at the peak points of thermal efficiency curve. All of these are found to increase almost linearly with the increases of both TIT and water injection ratio.

• 대한기계학회논문집
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• 제1권2호
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• pp.95-103
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• 1977

The expermental research was carried out to investigate the thermal performance of the locally manufactured radiators for 1300cc automobiles. The choice of .epsilon. value (the ratio of water tube surface area to the total heat transfer area ) resulted in remarkable difference in their performance including the Louver effect, the overrall heat tranfer coefficient and the heat dissipation capability.

• 한국초전도ㆍ저온공학회논문지
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• 제19권2호
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• pp.53-57
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• 2017

In superconducting power devices including power cables in which high temperature superconducting (HTS) tapes are utilized, a reliable electrical insulation should be achieved for its maximum performance. For an efficient design of HTS superconducting devices, a comparative evaluation of the mechanical and thermal propperties for various insulation materials at cryogenic temperatures is required. Especially, in the process of the property evaluation of the sheet-shaped insulation materials, anisotropy according to the machining direction should be considered because the mechanical and thermal properties are significantly influenced by the sample orientation. In this study, the cryogenic thermal and mechanical properties of various insulation material sheets such as PPLP, Cryoflex, Teflon, and Kapton were determined considering sample orientation. All samples tested at cryogenic temperature showed significantly higher tensile strength as compared with that of room temperature. The ultimate tensile strength at both temperature conditions significantly depended upon the sample orientation. The thermal properties of the insulation materials exhibited a slight difference among samples depending on the orientation: for the PPLP and Cryoflex, the CD orientation showed larger thermal contraction up to 77 K as compared to the MD one. MD samples in PPLP and Cryoflex showed a lower CTE and thermal contraction which made it more promising as an insulation material due to its comparable CTE with HTS CC tapes.

• 반도체디스플레이기술학회지
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• 제11권4호
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• pp.37-42
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• 2012

Nanoimprint lithography (NIL) has attracted broad interest as a low cost method to define nanometer scale patterns in recent years. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, the performance of the cooling system of thermal NIL is numerically investigated by SolidWorks Flow Simulation program. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the effects of the change of flow velocity and cooler location on the cooling performance are investigated. For the 6 cases (0.1 m/s, 0.5 m/s, 1 m/s, 3 m/s, 5 m/s, 10 m/s) of flow velocity and for the 6 cases of distances (50 mm, 40 mm, 30 mm, 20 mm, 10 mm, 1 mm) of cooler location, the heat conjugated flow analyses are performed and discussed.

• 한국수소및신에너지학회논문집
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• 제34권5호
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• pp.465-477
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• 2023

In proton exchange membrane fuel cell (PEMFC), proper thermal management of the stack and moisture generation by electrochemical reactions significantly affect fuel cell performance. In this study, the PEMFC dynamic characteristic model was developed through Simcenter AMESim, a development program. In addition, the developed model aims to understand the thermal resin balance of the stack and performance characteristics for input loads. The developed model applies the thermal management model of the stack and the moisture content and permeability model to simulate voltage loss and stack thermal behavior precisely. This study extended the C based AMESet (adaptive modeling environment submodeling tool) to simulate electrochemical reactions inside the stack. Fuel cell model of AMESet was liberalized with AMESim and then integrated with the balance of plant (BOP) model and analyzed. And It is intended to be used in component design through BOP analysis. The resistance loss of the stack and thermal behavior characteristics were predicted, and the impact of stack performance and efficiency was evaluated.