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Investigation of Cooling Effect of Flow Velocity and Cooler Location in Thermal Nanoimprint Lithography  

Lee, Woo-Young (School of Mechanical Engineering, Korea University of Technology and Education)
Lee, Ki Yeon (Department of Mechanical Engineering, Soonchunhyang University)
Kim, Kug Weon (Department of Mechanical Engineering, Soonchunhyang University)
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Journal of the Semiconductor & Display Technology / v.11, no.4, 2012 , pp. 37-42 More about this Journal
Nanoimprint lithography (NIL) has attracted broad interest as a low cost method to define nanometer scale patterns in recent years. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, the performance of the cooling system of thermal NIL is numerically investigated by SolidWorks Flow Simulation program. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the effects of the change of flow velocity and cooler location on the cooling performance are investigated. For the 6 cases (0.1 m/s, 0.5 m/s, 1 m/s, 3 m/s, 5 m/s, 10 m/s) of flow velocity and for the 6 cases of distances (50 mm, 40 mm, 30 mm, 20 mm, 10 mm, 1 mm) of cooler location, the heat conjugated flow analyses are performed and discussed.
Thermal NIL; Heat Flow; Flow Simulation; Cooling System; Flow Velocity; Cooler Location;
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