• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1065-1073
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• 2009

In this paper, the estimation method of C(t)-integral for combined mechanical and thermal loads is proposed for elastic-plastic-creep material via 3-dimensional FE analyses. Plasticity induced by initial loading makes relaxation rate different from those produced elastically. Moreover, the interactions between mechanical and thermal loads make the relaxation rate different from those produced under mechanical load alone. To quantify C(t)-integral for combined mechanical and thermal loads, the simplified formula are developed by modifying redistribution time in existing work done by Ainsworth et al..

• Journal of Ocean Engineering and Technology
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• v.11 no.1
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• pp.113-123
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• 1997

The welding residual stresses produced by welding frequently cause a crack and promote stress corrosion etc. in heat affected zone contained with external load and weakness of material. For the purpose pof relaxation of welding residual stress, post welding heat teratment(PWHT) is widely used. In this paper, the computer program which is based on Thermal-Elasto-plastic-creep theory for plane deformation on developed by finite element method (F.E.M) and verified its propriety by experimental measurement and also by using the developed computer program. The mechanical behavior of butt welding joint is clairfied during PWHT.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.6
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• pp.609-617
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• 2011

There is a trend towards the progressive use of higher operating temperatures and stresses to achieve improved efficiencies in power-generation equipment. It is important to perform the crack assessment under hightemperature and high-pressure conditions. The C(t)-integral is a key parameter in crack assessment for transient creep states. The estimation of the C(t)-integral is complex when considering the mechanical and thermal loads simultaneously. In this paper, we study estimation of C(t)-integral under combined mechanical and thermal load depending on loading conditions.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.145-148
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• 1996

• Structural Engineering and Mechanics
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• v.30 no.6
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• pp.665-678
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• 2008

The beams components subjected to the loading such as axial, bending and cyclic thermal loads were studied in this research. The used constitutive equations are those of elasto-plasticity coupled to ductile and/or creep damage. The nonlinear kinematic hardening behavior was considered in elastoplasticity modeling. The unified damage law proposed for ductile failure and fatigue by the author of Sermage et al. (2000) and Kachanov's creep damage model applied to cyclic creep and low cycle fatigue of beams. Based on the results of the analysis, the shakedown limit loads were determined through the calculation of the residual strains developed in the beam analysis. The iterative technique determines the shakedown limit load in an iterative manner by performing a series of full coupled elastic-plastic and continuum damage cyclic loading modeling. The maximum load carrying capacity of the beam can withstand, were determined and imposed on the Bree's interaction diagram. Comparison between the shakedown diagrams generated by or without creep and/or ductile damage for the loading patterns was presented.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.04b
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• pp.11-11
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• 2002

Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.51-59
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• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.227-227
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• 2000

Pressure vessels usually consist of main body and pipes which are connected with the main body. And as joining method of such main body and pipes, welding is carried out. After welding, welding residual stresses inevitably occur around welded joints. As residual stresses act harmfully on fatigue strength, corrosion and buckling strength of structure, PWHT is carried out for the purpose of removing the residual stress. But, during PWHT process, 2 ¼Cr-1Mo steels are frequently apt to generate reheat crack. For this reason, it is strongly needed to analyze and examine the mechanical behavior of welded joints before and after PWHT process. So, in this study, welded nozzle parts of pressure vessel where reheat cracks frequently occur are selected for examining the mechanism of crack-occurrence. (Received December 2, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.100-104
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• 2000

Pressure vessels usually consist of main body and pipes which are connected with the main body. And as joining method of such main body and pipes, welding is carried out. After welding, welding residual stresses inevitably occur around welded joints. As residual stresses act harmfully on fatigue strength, corrosion and buckling strength of structure, PWHT is carried out for the purpose of removing the residual stress. But, during PWHT process, $2\frac{1}{4}Cr-1Mo$ steels are frequently apt to generate reheat crack. For this reason, it is strongly needed to analyze and examine the mechanical behavior of welded joints before and after PWHT process. So, in this study, welded nozzle parts of pressure vessel where reheat cracks frequently occur are selected for examining the mechanism of crack-occurrence.