• Journal of the Korean Ceramic Society
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• v.55 no.5
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• pp.452-460
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• 2018

This study investigate changes in mechanical behaviors such as indentation load-displacement and hardness of thermal barrier coatings (TBCs) using cycling of thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/super alloy are prepared using different starting granules, 204C-NS and 204NS commercial powers, and the effect of double layers of 204C-NS on 204NS and 204NS on 204C-NS are investigated. The highest temperature applied during thermal shock test is $1100^{\circ}C$ and the maximum number of cycles is 1,200. The results indicate that bilayered TBC showed a relatively mechanically resistant property during thermal shock cycles and that the mechanical behavior is influenced by the microstructure of TBCs by exposure to high temperature during tests or different starting granules.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.280-293
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• 2018

The conversion of an invisible thermal radiation pattern of an object into a visible image using infrared (IR) thermal technology is very useful to understand phenomena what we are interested in. Although IR thermal images were originally developed for military and space applications, they are currently employed to determine thermal properties and heat features in various applications, such as the non-destructive evaluation of industrial equipment, power plants, electricity, military or drive-assisted night vision, and medical applications to monitor heat generation or loss. Recently, IR imaging-based monitoring systems have been considered for application in agricultural, including crop care, plant-disease detection, bruise detection of fruits, and the evaluation of fruit maturity. This paper reviews recent progress in the development of IR thermal imaging techniques and suggests possible applications of thermal imaging techniques in agriculture.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.12
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• pp.957-962
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• 2014

We present a method to quantitatively measure the thermal conductivity of one-dimensional nanostructures by utilizing scanning thermal wave microscopy (STWM) at a nanoscale spatial resolution. In this paper, we explain the principle for measuring the thermal diffusivity of one-dimensional nanostructures using STWM and the theoretical analysis procedure for quantifying the thermal diffusivity. The SWTM measurement method obtains the thermal conductivity by measuring the thermal diffusivity, which has only a phase lag relative to the distance corresponding to the transferred thermal wave. It is not affected by the thermal contact resistances between the heat source and nanostructure and between the nanostructure and probe. Thus, the heat flux applied to the nanostructure is accurately obtained. The proposed method provides a very simple and quantitative measurement relative to conventional measurement techniques.

• Journal of Mechanical Science and Technology
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• v.18 no.10
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• pp.1712-1721
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• 2004

A method of measuring the thermal diffusivity of semi-infinite solid material at room temperature using photothermal displacement is proposed. In previous works, within the constant thickness of material, the thermal diffusivity was determined by the magnitude and phase of deformation gradient as the relative position between the pump and probe beams. In this study, however, a complete theoretical treatment of the photothermal displacement technique has been performed for thermal diffusivity measurement in semi-infinite solid materials. The influence of parameters, such as, radius and modulation frequency of the pump beam and the thermal diffusivity, was studied. We propose a simple analysis method based on the zero -crossing position of real part of deformation gradient and the minimum position of phase as the relative position between two beams. It is independent of parameters such as power of pump beam, absorption coefficient, reflectivity, Poisson's ratio, and thermal expansion coefficient.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.4
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• pp.347-355
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• 2014

Thermal problems that are directly related to the lifetime of an electronic device are becoming increasingly important owing to the miniaturization of electronic devices. To solve thermal problems, it is essential to study thermal stability through thermal diffusion and insulation. A honeycomb sandwich plate has anisotropic thermal conductivity. To analyze the thermal deformation and temperature distribution of a system that employs a honeycomb sandwich plate, the thermal and elastic properties need to be determined. In this study, the thermal and elastic properties of a honeycomb sandwich plate, such as thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and shear modulus, are predicted. The properties of a honeycomb sandwich plate vary according to the hexagon size, thickness, and material properties.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1155-1159
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• 2014

Thermal barrier coating (TBC) which is used to protect the substrate of gas turbine is exposed to high temperature environment. Because of high temperature environment, thermally grown oxide (TGO) is grown at the interface of thermal barrier coating in operation of gas turbine. The growth of TGO critically affects to durability of TBC, so the evaluation about durability of TBC with TGOs of various thickness is needed. In this research, TGO was inserted by aging of TBC specimen to evaluate the effect of the TGO growth. Then thickness of TGO was defined by microstructure analysis, and thermal fatigue test was performed with these aging specimens. Finally, the relation between thermal fatigue life and the TGO growth according to aging time was obtained.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1065-1073
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• 2009

In this paper, the estimation method of C(t)-integral for combined mechanical and thermal loads is proposed for elastic-plastic-creep material via 3-dimensional FE analyses. Plasticity induced by initial loading makes relaxation rate different from those produced elastically. Moreover, the interactions between mechanical and thermal loads make the relaxation rate different from those produced under mechanical load alone. To quantify C(t)-integral for combined mechanical and thermal loads, the simplified formula are developed by modifying redistribution time in existing work done by Ainsworth et al..

• Journal of Mechanical Science and Technology
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• v.14 no.5
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• pp.477-482
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• 2000

This study discusses a non-contact optical technique (electronic speckle pattern interferometry) that is well suited for thermal deformation measurement without any surface preparation and compensating process. Fiber reinforced plastics ($[0]_{16},\;[0/90]_{8S}$) were analyzed by ESPI to determine their thermal expansion coefficients. The thermal expansion coefficient of the transverse direction of a uniaxial composite is evaluated as $48.78{\times}10^{-6}(1/^{\circ}C)$. Also, the thermal expansion coefficient of the cross-ply laminate $[0/90]_{8S}$ is numerically estimated as $3.23{\times}10^{-6}(1/^{\circ}C)$ that is compared with that measured by ESPI.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.2
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• pp.7-15
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• 2009

• Tribology and Lubricants
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• v.12 no.3
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• pp.79-84
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• 1996

One of the greatest dangers in mechanical face seals is the formation of heat checking and thermal stress cracks on the sliding surfaces. These thermal distortions due to non-uniform heating lead to increase the leakage of the sealed fluids and wear, and with balance of the seal can cause the seal faces to part. In this study heat checking and thermal stress cracks are investigated experimentally. These thermal distortions are explained using the thermal models of the conatct geometries between the seal ring and the seal seat. To overcome these thermal problems, the thermohydrodynamic seal is presented. The newly developed mechanical seal may substantially reduce the friction torque, frictional heating which causes heat checking and thermal stress cracks, and wear.