• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.47-52
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• 2017

This research scrutinizes the data retention characteristics of the MLC NAND Flash Memory instigated by the loss effect of trapped charge when the memory is in the state of program saturation. It is attributed to the threshold voltage saturation phenomenon which engenders an interruption to the linear increase of the voltage in the memory cell. This phenomenon is occasioned by the outflow of the trapped charge from the floating gate to the control gate, which has been programmed by the ISPP (Incremental Step Pulse Programming), via Inter-Poly Dielectric (IPD). This study stipulates the significant degradation of thermal retention characteristics of threshold voltage in the saturation region in contrast to the ones in the linear region. Thus the current study evaluates the data retention characteristics of voltage after the program with a repeated reading test in various measurement conditions. The loss effect of trapped charge is found in the IPD layer located between the floating gate and the control gate especially in the nitride layer of the IPD. After the thermal stress, the trapped charge is de-trapped and displays the impediment of the characteristic of reliability. To increase the threshold saturation voltage in the NAND Flash Memory, the storage ability of the charge in the floating gate must be enhanced with a well-thought-out designing of the module in the IPD layer.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.25-30
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• 2018

Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

• Korean Journal of Materials Research
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• v.4 no.1
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• pp.63-74
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• 1994

The ultrathin oxide films less than 100$\AA$ were grown by thermal oxidation in $N_2O$ ambient to improve the controllability of thickness, thickness uniformity, process reproducibility and their electrical properties. Oxidation rate was reduced significantly at very thin region due to the formation of oxynitride layer in $N_2O$ ambient and moreover nitridation of the oxide layer was simultaneously accompanied during growth. The nitrogen incorporation in the grown oxide layer was characterized with the wet chemical etch-rate and ESCA analysis of the grown oxide layer. All the oxides thin films grown in $N_2O$, pure and dilute $O_2$ ambients show Fowler-Nordheim electrical conduction. The electrical characteristics of thin oxide films grown in $N_2O$ such as leakage current, electrical breakdown, interface trap density generation due to the injected electron and reliability were better than those in pure or dilute ambient. These improved properties can be explained by the fact that the weak Si-0 bond is reduced by stress relaxation during oxidation and replacement by strong Si-N bond, and thus the trap sites are reduced.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.153-159
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• 2007

In-cryostat helium lines are under installation to transfer a cryogenic helium into cold components in KSTAR device. In KSTAR, three kinds of helium should be supplied into the cold components, which are supercritical helium Into superconduction(SC) magnet system, liquid helium into current lead system, and gas helium into thermal shields. Cryogenic helium lines consist of transfer lines outside the cryostat, in-cryostat helium lines, and electrical breaks. In-cryostat helium lines should be guaranteed of leak tightness for tong time operation at high internal helium pressure of 20 bar. We wrapped the helium line with multi-layer insulator(MLI) to reduce radiation heat and insulated the surface of the high potential part with prepreg tape. The electrical break was fabricated by brazing ceramic tube with stainless steel tube. To ensure the operation reliability at operation temperature, all the electrical break have been examined by the thermal cycle test at liquid nitrogen and by the hydraulic test at 30 bar. And additional surface insulation was prepared with prepreg tape to give structural safety. At present most of the in-cryostat helium lines have been installed and the final inspection test is progressing.

• Research in Community and Public Health Nursing
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• v.7 no.2
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• pp.410-419
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• 1996

This study was reviewed from 1000 articles related to family planning from 1970 to 1990 and 20 articles associated with natural family planning from 1980 until the present. The purpose of natural family planning(NFP) is to identify the time ovulation of women themselves, to have intercourse with periodic abstinence, and to deliver a healthy child. The ultimate goal of NFP is to promote the family's health. The NFP method is described as periodic abstinence of intercourse to avoid pregnancy by identifying the ovulation time in the menstration cycle. Clinical symptoms and signs of reflection underlying changes in Estrogen and Progesterone are the change of basal body temperature, the change of cervical mucus and cervix, abdominal pain and breast tenderness. The types of NFP are the calender rthythm method, basal body temperature methods, cervical mucus method, symptothermal method, cyclo-thermal method and home based ovulation test kits. Recently the cyclo-thermal method involved. It is calendar rhythm method applied to B.B.T. For the cervical mucus method, when the estrogen level in the blood concentration is increased, the mucus begins to excrete, the amount of moist mucus increases while the mucus is clear, slippery, and smooth. For 3 days, this timing can be considered contraception. Fertility is at a maximum on the day mucus appears, abstinence for 3 days is a type of contraception. Sexual intercourse on a maximum day of mucus maximizes pregnancy potential. But, the contraception depends on the practice of a perfect rule. For basal body temperature methods, at ovulation time, the temperature increases $0.2^{\circ}C-0.5^{\circ}C$. Through the review of literature a high temperature above $0.2^{\circ}C$ for 3 days indicates that the previous 6 day period was ovulation and fertilization. The Symptothermal method is used to determine the prediction of ovulation through the observation of mucus excretion, high temperature, the change of cervical mucus, low abdominal pain, vaginal discharge, and breast change. Home based ovulation test kits are cervico-vaginal fluid aspiration, test a digital electric thermometer, body fluid(blood, saliva, urine) test kits, They are on the market. However, research on the contraception method is still in progress. For pregnancy it is still too early to use home based ovulation test kits because of deficit of reliability and simplicity more research on the technology is needed. It is suggested that NFP methods be included in nursing curriculum in order to educate NFP users how to effectively use NFP methods. Furthermore, this study has implications for the dissemination of NFP methods in terms of Korean policies of family planning and the support of community welfare agences.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.9
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• pp.1305-1310
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• 2010

In a practical design process, the method of extracting the design space information of the complex system for verifying, improving, and optimizing the design process by taking into account the design variables and their shape tolerance is very important. Finite element analysis has been successfully implemented and integrated with design of experiment such as D-Optimal array; thus, a response surface model and optimization tools have been obtained, and design variables can be optimized by using the model and these tools. Then, to guarantee the robustness of the design variables, a robust design should be additionally performed by taking into account the statistical variation of the shape tolerance of the optimized design variables. In this study, a new approach based on the use of the response surface model is proposed; in this approach, the standard normal distribution of the shape tolerance is considered. By adopting this approach, it is possible to simultaneously optimize variables and perform a robust design. This approach can serve as a means of efficiently modeling the trade-off among many conflicting goals in the applications of finite element analysis. A case study on the robust optimal design of disc brakes under thermal loadings was carried out to solve multiple objective functions and determine the constraints of the design variables, such as a thermal deformation and weight.

• The KIPS Transactions:PartA
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• v.17A no.6
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• pp.265-274
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• 2010

As the process technology scales down and integration densities continue to increase, interconnection has become one of the most important factors in performance of recent multi-core processors. Recently, to reduce the delay due to interconnection, 3D architecture has been adopted in designing multi-core processors. In 3D multi-core processors, multiple cores are stacked vertically and each core on different layers are connected by direct vertical TSVs(through-silicon vias). Compared to 2D multi-core architecture, 3D multi-core architecture reduces wire length significantly, leading to decreased interconnection delay and lower power consumption. Despite the benefits mentioned above, 3D design technique cannot be practical without proper solutions for hotspots due to high temperature. In this paper, we propose three floorplan schemes for reducing the peak temperature in 3D multi-core processors. According to our simulation results, the proposed floorplan schemes are expected to mitigate the thermal problems of 3D multi-core processors efficiently, resulting in improved reliability. Moreover, processor performance improves by reducing the performance degradation due to DTM techniques. Power consumption also can be reduced by decreased temperature and reduced execution time.

• International Journal of Naval Architecture and Ocean Engineering
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• v.10 no.2
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• pp.129-140
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• 2018

A residual stress generated in the steel structure is broadly categorized into initial residual stress during manufacturing steel material, welding residual stress caused by welding, and heat treatment residual stress by heat treatment. Initial residual stresses induced during the manufacturing process is combined with welding residual stress or heat treatment residual stress, and remained as a final residual stress. Because such final residual stress affects the safety and strength of the structure, it is of utmost importance to measure or predict the magnitude of residual stress, and to apply this point on the design of the structure. In this study, the initial residual stress of steel structures having thicknesses of 25 mm and 70 mm during manufacturing was measured in order to investigate initial residual stress (hereinafter, referred to as initial stress). In addition, thermal elastic plastic FEM analysis was performed with this initial condition, and the effect of initial stress on the welding residual stress was investigated. Further, the reliability of the FE analysis result, considering the initial stress and welding residual stress for the steel structures having two thicknesses, was validated by comparing it with the measured results. In the vicinity of the weld joint, the initial stress is released and finally controlled by the weld residual stress. On the other hand, the farther away from the weld joint, the greater the influence of the initial stress. The range in which the initial stress affects the weld residual stress was not changed by the initial stress. However, in the region where the initial stress occurs in the compressive stress, the magnitude of the weld residual compressive stress varies with the compression or tension of the initial stress. The effect of initial stress on the maximum compression residual stress was far larger when initial stress was considered in case of a thickness of 25 mm with a value of 180 MPa, while in case of thickness at 70 mm, it was 200 MPa. The increase in compressive residual stress is almost the same as the initial stress. However, if initial stress was tensile, there was no significant change in the maximum compression residual stress.

• Korean Journal of Optics and Photonics
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• v.33 no.5
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• pp.218-229
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• 2022

We have investigated reliable inspection methods for finding the defects generated during the manufacturing process of lightweight, large-aperture satellite telescope mirrors using silicon carbide, and we have measured the basic physical properties of the mirrors. We applied the advanced ceramic material (ACM) method, a combined method using liquid-silicon penetration sintering and chemical vapor deposition for the carbon molded body, to manufacture four SiC mirrors of different sizes and shapes. We have provided the defect standards for the reflectors systematically by classifying the defects according to the size and shape of the mirrors, and have suggested effective nondestructive methods for mirror surface inspection and internal defect detection. In addition, we have analyzed the measurements of 14 physical parameters (including density, modulus of elasticity, specific heat, and heat-transfer coefficient) that are required to design the mirrors and to predict the mechanical and thermal stability of the final products. In particular, we have studied the detailed measurement methods and results for the elastic modulus, thermal expansion coefficient, and flexural strength to improve the reliability of mechanical property tests.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.24-37
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• 2024

Due to the thin nature of semiconductor packages, even minor thermal loads can cause significant warpage, impacting product reliability through issues like delamination or cracking. The mold curing process, which encloses the package to protect the semiconductor chip, is particularly challenging to predict due to the complex thermal, chemical, and mechanical interactions. This study proposes a cost-effective machine learning model to predict warpage in the mold curing process. We developed methods to characterize the curing degree based on time and temperature and quantify the material's mechanical properties accordingly. A Finite Element Method (FEM) simulation model was created by integrating these properties into ABAQUS UMAT to predict warpage for various design factors. Additionally, a Warpage formula was developed to estimate local warpage based on the package's stacking structure. This formula combines bending theory with thermo-chemical-mechanical properties and was validated through FEM simulation results. The study presents a method to construct a machine learning model for warpage prediction using this formula and proposes a cost-effective approach for building a training dataset by analyzing input variables and design factors. This methodology achieves over 98% prediction accuracy and reduces simulation time by 96.5%.