• Applied Microscopy
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• v.50
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• pp.12.1-12.11
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• 2020

Hot stage microscopy (HSM) is a thermal analysis technique that combines the best properties of thermal analysis and microscopy. HSM is rapidly gaining interest in pharmaceuticals as well as in other fields as a regular characterization technique. In pharmaceuticals HSM is used to support differential scanning calorimetry (DSC) and thermo-gravimetric analysis (TGA) observations and to detect small changes in the sample that may be missed by DSC and TGA during a thermal experiment. Study of various physical and chemical properties such sample morphology, crystalline nature, polymorphism, desolvation, miscibility, melting, solid state transitions and incompatibility between various pharmaceutical compounds can be carried out using HSM. HSM is also widely used to screen cocrystals, excipients and polymers for solid dispersions. With the advancements in research methodologies, it is now possible to use HSM in conjunction with other characterization techniques such as Fourier transform infrared spectroscopy (FTIR), DSC, Raman spectroscopy, scanning electron microscopy (SEM) which may have additional benefits over traditional characterization techniques for rapid and comprehensive solid state characterization.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.5
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• pp.533-538
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• 2015

Thermal characterization of individual pixels in microbolometer infrared image sensors is needed for optimal design and improved performance. In this work, we used thermoreflectance microscopy on uncooled microbolometer image sensors to investigate the thermal characteristics of individual pixels. Two types of microbolometer image sensors with a shared-anchor structure were fabricated and thermally characterized at various biases and vacuum levels by measuring the temperature distribution on the surface of the microbolometers. The results show that thermoreflectance microscopy can be a useful thermal characterization tool for microbolometer image sensors.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.12
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• pp.957-962
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• 2014

We present a method to quantitatively measure the thermal conductivity of one-dimensional nanostructures by utilizing scanning thermal wave microscopy (STWM) at a nanoscale spatial resolution. In this paper, we explain the principle for measuring the thermal diffusivity of one-dimensional nanostructures using STWM and the theoretical analysis procedure for quantifying the thermal diffusivity. The SWTM measurement method obtains the thermal conductivity by measuring the thermal diffusivity, which has only a phase lag relative to the distance corresponding to the transferred thermal wave. It is not affected by the thermal contact resistances between the heat source and nanostructure and between the nanostructure and probe. Thus, the heat flux applied to the nanostructure is accurately obtained. The proposed method provides a very simple and quantitative measurement relative to conventional measurement techniques.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.5
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• pp.235-240
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• 2013

Pure-carbon materials such as graphite, graphene, carbon nanotubes, and diamond have very high thermal conductivities. The reported thermal conductivity of graphene is in the range 3000~5000W/m-K at room temperature. Here, we developed graphene/cu foam hybrid type heat spreader to obtain higher thermal conductivity than Cu foam. Hybrid materials were characterized using optical microscopy (OM), scanning electron microscopy (SEM) and thermal conductivity measurement system; LFA (Laser Flash Analysis @ LFA 447, NETZSCH). We suggest that excellent thermal properties of graphene/cu foam hybrid structures are beneficial for all proposed electrical applications and can lead to a thermal management application.

• Applied Microscopy
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• v.38 no.4
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• pp.383-386
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• 2008

In performing in situ heating transmission electron microscopy (TEM) for materials characterizations, arising concerns such as specimen drifts and unintentional Cu contamination are discussed. In particular, we analysed the thermal and mechanical characteristics of in situ heating holders to estimate thermal drift phenomena. From the experimental results, we suggest an empirical model to describe the thermal drift behavior so that we can design an effective plan for in situ heating experiment. Practical approaches to minimize several hindrances arisen from the experiment are proposed. We believe that our experimental recommendations will be useful for a microscopist fascinated with the powerful potential of in situ heating TEM.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.19-31
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• 2022

With the advent of technologies based on big data, the trend of electronics towards high performance and high integration density continues. However, this development of electronics suffers from overheating issues, which seriously threaten the reliability of the devices. To develop effective strategies for thermal management, it is crucial to accurately evaluate the temperature distribution and design the heat dissipation path within the device in the operating condition. This paper introduces thermoreflectance microscopy that can observe the temperature distribution of a device with high spatial and temporal resolutions in a non-contact way. Specifically, the working principle and various forms of thermoreflectance microscopy are presented along with the latest research trends to improve the temperature, space, and time resolutions. We further review several examples in which thermoreflectance microscopy is applied to investigate the temperature and thermal characteristics of electronic devices.

• Journal of the Korean institute of surface engineering
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• v.35 no.5
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• pp.289-294
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• 2002

ZnTe films have been grown on (100) GaAs substrate with two representative problems. The one is lattice mismatch, the other is thermal expansion coefficients mismatch of ZnTe /GaAs. It claims here, the relationship of film thickness and defects distribution with (100) ZnTe/GaAs using hot wall epitaxy (HWE) growth was investigated by transmission electron microscopy (TEM). It analyzed on the two-sort side using TEM with cross-sectional transmission electron microscopy (XTEM) and high-resolution electron microscopy (HREM). Investigation into the nature and behavior of dislocations with dependence-thickness in (100) ZnTe/ (100) GaAs hetero-structures grown by transmission electron microscopy (TEM). This defects range from interface to 0.7 $\mu\textrm{m}$ was high density, due to the large lattice mismatch and thermal expansion coefficients. The defects of low density was range 0.7$\mu\textrm{m}$~1.8$\mu\textrm{m}$. In the thicker range than 1.8$\mu\textrm{m}$ was measured hardly defects.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.15-18
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• 2005

We have designed and fabricated a thermal scanning electron microscopy. It includes an electron source, two condenser lenses, one objective lens, a scanning coil and a stigmator coil for focusing in column and also have a secondary electron detector for constructing the image in chamber with a high vacuum condition and control part for operating the SEM. Especially, in order for us to find out the optical characteristics, our attention and studies have been concentrated on the effects of two condenser lenses and one objective lens for high resolution with SEM. Finally, we developed a high resolution thermal scanning electron microscopy.

• Carbon letters
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• v.16 no.1
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• pp.34-40
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• 2015

In this study, in order to improve the thermal and electrical properties of epoxy/graphene nanoplatelets (GNPs), surface modifications of GNPs are conducted using silane coupling agents. Three silane coupling agents, i.e. 2-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane (ETMOS), 3-glycidoxypropyltriethoxysilane (GPTS), and 3-glycidoxypropyltrimethoxysilane (GPTMS), were used. Among theses, GPTMS exhibits the best modification performance for fabricating GNP-incorporated epoxy composites. The effect of the silanization is evaluated using transmission electron microscopy (TEM), scanning electron microscopy, thermogravimetric analysis, and energy dispersive X-ray spectroscopy. The electrical and thermal conductivities are characterized. The epoxy/silanized GNPs exhibits higher thermal and electrical properties than the epoxy/raw GNPs due to the improved dispersion state of the GNPs in the epoxy matrix. The TEM microphotographs and Turbiscan data demonstrate that the silane molecules grafted onto the GNP surface improve the GNP dispersion in the epoxy.

• Proceedings of the Korean Environmental Health Society Conference
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• 2005.06a
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• pp.386-393
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• 2005

The calcination characteristic of waste eggshell were examined by thermal gravimetric analysis (TGA), qualitative and quantitative analysis by X-ray fluorescence, and microstructural analysis by scanning electronic microscopy(SEM). The calcined sample was lager grain and pore size.