• 한국전기전자재료학회논문지
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• 제23권8호
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 한국의류학회지
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• 제36권4호
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• pp.382-390
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• 2012

This study shows the optimum attachment of Two-Way Shape Memory Alloy (TWSMA) springs onto thermal liner and its sewing method for the mass production of fire fighter's intelligent turnout gear. SMA springs were attached to the fabric by four different methods and stitched by two different shapes (square and wave). The durability of the attached springs was tested by laundering up to 50 cycles. Examined were whether the springs would remain attached to the fabric after repeated laundering, the shape memory effect and reaction of the springs, and the anti-corrosiveness of the springs. A Human-Clothing-Environment simulator evaluated thermal insulation according to attachment methods, air layer volume, and stitch types. The findings showed that silicon attached springs remained intact after repeated laundering; in addition, repeated laundering did not influence the responsiveness and anti-corrosiveness of SMAs. Air volume had positive relations with the insulation. Attachment methods or stitch methods had limited impact on the thermal insulation. As a result, a wave type stitch with silicone attachment was suggested as the optimum method to attach the SMA springs onto the intelligent turnout gear for fire fighters.

• 한국수소및신에너지학회논문집
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• 제14권4호
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• pp.298-304
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• 2003

The thermal behavior of $NiFe_2O_4$ prepared by a solid-state reaction was investigated for $H_2$ generation by the thermochemical cycle. The reduction of $NiFe_2O_4$ started from $800^{\circ}C$, and the weight loss was 0.2-0.3 wt% up to $1000^{\circ}C$. In the $H_2O$ decomposition reaction, $H_2$ was generated by oxidation of reduced $NiFe_2O_4$. The crystal structure of $NiFe_2O_4$ maintained during the redox reaction of 5 cycles. From this observation, the lattice oxygen in $NiFe_2O_4$ is released without the structural change during the thermal reduction and oxygen deficient $NiFe_2O_4$ can be restored to the spinel structure of $NiFe_2O_4$.

• 한국신뢰성학회지:신뢰성응용연구
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• 제17권1호
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• pp.78-82
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• 2017

Purpose: The purpose of this study is to evaluate failure characteristic and mechanism of four commercial water-repellent coatings for elevated temperature machinery applications. Method: Thermal degradation was performed for up to 64 thermal cycles. 1 cycle consists of 15 minute holding at 523K under 300rpm revolution and 15 minute-natural cooling. Contact angle was measured and microstructure of the coating layer was observed by using a scanning electron microscope. Results: Four kinds of commercial repellent coating showed hydrophobic or super-hydrophobic property implying that all coatings are suitable for room temperature application. Contact angle of three kinds of commercial coatings decreased rapidly after thermal exposure, while only one specimen having hydrophobic surface showed extremely slow degradation. Conclusion: Observed decrease in contact angle of the coatings were attributed to formation of macro-sized pores and disappearance of micro-protrusion during thermal exposure. Optimum water-repellent coating needs to be selected under the consideration of initial contact angle as sell as service temperature.

• 한국안전학회지
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• 제21권6호
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• pp.7-13
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• 2006

A transient heat transfer and thermal stress analysis for a brake drum of commercial vehicles have been performed by ANSYS code in the cases of single braking and the repeated braking condition. The temperature and thermal stress distributions in the brake drum under various braking conditions were obtained using a two-dimensional axisymmetric model. In case of deceleration of 0.3G with an initial vehicle speed of 60km/h, the maximum temperature in the drum was $87.6^{\circ}C$ after braking application. The maximum stress of 78.7MPa in the drum occurred at the intersection between the flange and hat under a condition in which repeated 15 cycles braking with an initial vehicle speed of 60km/h and a deceleration of 0.3G is applied to according to KS R1129. The maximum stress value is much lower than the yield strength of drum material(FC250).

• 한국자동차공학회논문집
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• 제19권6호
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• pp.126-132
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• 2011

Fatigue cracks of the turbocharger are often observed for high performance engines under thermal shock tests. Maximum exhaust gas temperature of recently developed gasoline engines could reach approximately $950^{\circ}C$. It's very important to estimate transient temperature histories during thermal shock cycles to predict the stress and the fatigue life of the turbocharger. With these temperature profiles, temperature-dependent material properties and boundary conditions, we could identify critical locations by the application of finite element simulation technologies. In this paper, we applied the reliable analysis approach to the actual turbocharger to predict the weak locations due to the repetitions of plastic strains and compared the results with the crack locations under physical engine test.

• 한국분말재료학회지
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• 제24권2호
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• pp.102-107
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• 2017

Porous polytetrafluoroethylene (PTFE) thin films are fabricated by spin-coating using a dispersion solution containing PTFE powders, and their crystalline properties are investigated after thermal annealing at various temperatures ranging from 300 to $500^{\circ}C$. Before thermal annealing, the film is densely packed and consists of many granular particles 200-300 nm in diameter. However, after thermal annealing, the film contains many voids and fibrous grains on the surface. In addition, the film thickness decreases after thermal annealing owing to evaporation of the surfactant, binder, and solvent composing the PTFE dispersion solution. The film thickness is systematically controlled from 2 to $6.5{\mu}m$ by decreasing the spin speed from 1,500 to 500 rpm. A triboelectric nanogenerator is fabricated by spin-coating PTFE thin films onto polished Cu foils, where they act as an active layer to convert mechanical energy to electrical energy. A triboelectric nanogenerator consisting of a PTFE layer and Al metal foil pair shows typical output characteristics, exhibiting positive and negative peaks during applied strain and relief cycles due to charging and discharging of electrical charge carriers. Further, the voltage and current outputs increase with increasing strain cycle owing to accumulation of electrical charge carriers during charge-discharge.

• 한국세라믹학회지
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• 제46권5호
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• pp.478-483
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• 2009

Thermal shock and hot corrosion resistance of silicon nitride ceramics are investigated in this study. Silicon nitrides are fabricated by nitride pressureless sintering (NPS) process, which process is the continuous process of nitridation reaction of Si metal combined with subsequent pressureless sintering. The results of thermal shock test show it sustains 400MPa of initial strength during test in the designated condition of ${\Delta}T=700{\sim}25^{\circ}C$ up to maximum 4,800 cycles. Hot corrosion tests also reveal that the strength degradation of NPS silicon nitride did not occur at $700^{\circ}C$ with an exposure in Ar, $H_2$, Na and K for 1,275 h.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.