• 제목/요약/키워드: Thermal cycle and stress

검색결과 155건 처리시간 0.023초

그래핀을 포함하는 폴리설폰 멤브레인의 구조 및 열 특성 (Structural and Thermal Properties of Polysulfone Membrane Including Graphene)

  • 최현명;최용진;성충현;오원태
    • 멤브레인
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    • 제28권1호
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    • pp.37-44
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    • 2018
  • Polysulfone 수지를 사용한 그래핀 복합조성물을 제조하고, 이것들의 멤브레인에 대한 잔류응력과 열전도 특성을 분석하였다. 그래핀을 포함하는 polysulfone 멤브레인의 잔류응력분석은 Si (100) 기판에 스핀코팅으로 $10{\mu}m$ 두께의 막을 도포하여 준비한 시료를 대상으로 하였으며, 잔류응력의 측정은 온도를 승온하고 냉각하는 완전한 1주기 동안 수행하였다. 그래핀을 포함하는 polysulfone 평막을 증류수를 사용한 상전이법으로 제조하여 두께방향과 면방향으로 열전도도를 구분하여 각각 측정하였으며 평막시료의 열전도 이방성을 분석하였다. 그래핀의 구조적 특징에 의해 이를 포함하는 polysulfone 막의 잔류응력은 그래핀 함량이 증가함에 따라 점차로 완화되는 경향을 나타내었고, 열전도특성은 평막형성의 구조적 특성과 그래핀의 고유특성에 의해 두께방향과 면방향의 차이를 확인할 수 있었다.

습식표면처리 및 열 사이클에 따른 Cu/SiNx 계면접착에너지 평가 및 분석 (Effects of Wet Chemical Treatment and Thermal Cycle Conditions on the Interfacial Adhesion Energy of Cu/SiNx thin Film Interfaces)

  • 정민수;김정규;강희오;황욱중;박영배
    • 마이크로전자및패키징학회지
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    • 제21권1호
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    • pp.45-50
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    • 2014
  • 반도체 미세구리배선 적용을 위하여 구리배선의 습식 표면처리 및 열 사이클에 따른 구리 박막과 실리콘질화막 도포층 사이의 계면접착에너지를 4점굽힘시험을 통해 정량적으로 평가하였다. 구리배선을 화학적 기계적 연마한 후 습식 표면처리를 통하여 구리 박막과 실리콘질화막의 계면접착에너지는 $10.57J/m^2$에서 $14.87J/m^2$로 증가하였다. $-45{\sim}175^{\circ}C$범위에서 250사이클 후, 표면처리를 하지 않은 시편의 계면접착에너지는 $5.64J/m^2$으로, 표면처리를 한 시편은 $7.34J/m^2$으로 감소하였으며, 모든 시편의 박리계면은 구리 박막과 실리콘질화막 계면으로 확인되었다. X-선 광전자 분광법으로 계면 결합 상태를 분석한 결과, 화학적 기계적 연마 공정 후 구리배선의 표면 산화물이 습식표면처리에 의해 효과적으로 제거된 것을 확인하였다. 또한, 열 사이클 처리동안, 구리 박막과 실리콘질화막의 큰 열 팽창 계수 차이로 인한 열응력으로 인하여 구리 박막과 실리콘질화막 계면이 취약해지고, 계면을 통한 산소유입에 따른 구리 산화층이 증가하여 계면접착에너지가 저하된 것으로 판단된다.

Thermal Fatigue Life of Underfilled $\mu\textrm$ BGA Solder Joint

  • Kim, H.H.;Han, S.W.;Kim, H.I.;Choi, M.;Shin, Y.E.
    • International Journal of Korean Welding Society
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    • 제4권1호
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    • pp.61-66
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    • 2004
  • In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

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열충격 시험을 통한 MLCCs SAC305 무연 솔더 접합부의 IMCs 성장과 접합특성 저하에 관한 연구 (A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test)

  • 정상원;강민수;전유재;김도석;신영의
    • 한국전기전자재료학회논문지
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    • 제29권3호
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    • pp.152-158
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    • 2016
  • The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

DURABILITY IMPROVEMENT OF A CYLINDER HEAD IN CONSIDERATION OF MANUFACTURING PROCESS

  • Kim, B.;Chang, H.;Lee, K.;Kim, C.
    • International Journal of Automotive Technology
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    • 제8권2호
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    • pp.243-248
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    • 2007
  • The durability of a cylinder head is influenced by the thermal and mechanical history during the manufacturing process, as well as engine operation. In order to improve the durability of cylinder head, both load from engine operation and the preload conditions from the manufacturing process must be considered. The aluminum cylinder head used for a HSDI diesel engine is investigated to reduce the possibility of high cycle fatigue crack in this study. FE analysis is performed to elucidate the mechanism of high cycle fatigue crack in the HSDI diesel cylinder head. Two separate approaches to increase the durability of the cylinder head are discussed: reducing load from engine operation and re-arranging preload conditions from the manufacturing process at the critical location of the cylinder head. Local design changes of the cylinder head and modification of pretension load in the cylinder head bolt were investigated using FE analysis to relieve load at the critical location during engine operation. Residual stress formed at the critical location during the manufacturing process is measured and heat treatment parameters are changed to re-arrange the distribution of residual stress. Results of FE analysis and experiments showed that thorough consideration of the manufacturing process is necessary to enhance the durability of the cylinder head.

고온 열순환 공정이 BCB와 PECVD 산화규소막 계면의 본딩 결합력에 미치는 영향에 대한 연구 (A Study on the Effects of High Temperature Thermal Cycling on Bond Strength at the Interface between BCB and PECVD SiO2 Layers)

  • 권용재;석종원
    • Korean Chemical Engineering Research
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    • 제46권2호
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    • pp.389-396
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    • 2008
  • 벤조시클로부텐(benzocyclobutene; BCB)과 플라즈마 화학기상증착(PECVD)된 산화규소막이 코팅된 웨이퍼들 사이의 계면에서, 고온 열순환 공정에 의한 잔류응력 및 본딩 결합력의 효과를 4점 굽힙시험법과 웨이퍼 곡률 측정법에 의해 평가하였다. 이를 위해 웨이퍼들은 사전에 확립된 표준 본딩공정에 의거하여 본딩하였으며 이들 웨이퍼에 대한 열순환 공정은 상온으로부터 최대 순환온도 사이에서 수행하였다. 최대 온도 350 및 $400^{\circ}C$에서 수행한 열순환 공정에서, 본딩 결합력은 첫번째 순환공정 동안 크게 증가하는 데, 이는 순환공정 시 발생하는 산화규소막의 축합 반응에 의한 잔류응력 감소 때문인 것으로 분석되었다. 이러한 산화규소막의 잔류응력이 감소함에 따라 BCB와 산화규소막으로 구성된 다층막의 잔류응력에 의해 변형되는 에너지는 상승하였고 따라서 BCB와 산화규소막 사이 다층막의 의 본딩 결합력은 증가하였다.

EGR Valve의 구조 안전성 해석에 관한 연구 (Study on Structural Safety Analysis of EGR Valve)

  • 한문식;조재웅
    • 한국생산제조학회지
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    • 제20권5호
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    • pp.528-534
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    • 2011
  • This study analyzes thermal stress and durability fatigue on the modelling of EGR valve. In case of 10% opening at its inlet, the minimum temperature gets cool as 3 times as inlet temperature. The maximum equivalent stress becomes lowest as the value of $2.6274{\times}109$ Pa and fatigue life becomes highest as 23.657 Cycle. But the minimum temperature gets cool as 2.2 times as inlet temperature in case of 50% opening at its inlet. The equivalent stress becomes higher and fatigue life becomes lower than in case of 10% opening. In case of 100% opening at its inlet, the minimum temperature gets cool as 0.2 times as inlet temperature. The equivalent stress becomes lower and fatigue life becomes higher than in case of 50% opening. Maximum equivalent stress and total deformation are shown at the closing of EGR valve by the pressure of inflow gas. The structural analysis result of this study can be effectively utilized with the design of EGR valve by investigating prevention and durability against its damage.

유한요소법에 의한 I형빔의 용접변형에 관한 연구 (A Study on Welding Deformation of I-Beam Steel Structure by FEM Method)

  • 석한길
    • Journal of Welding and Joining
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    • 제21권5호
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    • pp.561-567
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    • 2003
  • For construction of I-beam steel structures, a fillet welding is one of the main manufacturing process. However, this welding process cause some problems associated with welding residual stress and welding deformation that are harmful to the safety of structures. Accordingly, this study clarified the creation mechanism of the welding deformation on I-beam steel structure from the experimental results given by the FEM method. To prevent or minimize the longitudinal bending deformation, first of all, a field supervision is necessary to observe the optimal groove design. Secondly, the welding order for cooling weld zone is needed.

금속/세라믹 계면 물성 분석 (Metal/ceramic Interface Mechanical Property Analysis)

  • 김송희;강형석
    • 산업기술연구
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    • 제24권A호
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    • pp.9-15
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    • 2004
  • The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

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Thermal Impact Characteristics by Forest Fire on Porcelain Insulators for Transmission Lines

  • Lee, Won-Kyo;Choi, In-Hyuk;Choi, Jong-Kee;Hwang, Kab-Cheol;Han, Se-Won
    • Transactions on Electrical and Electronic Materials
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    • 제9권4호
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    • pp.143-146
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    • 2008
  • In this study the thermal impact characteristics by forest fire are extensively investigated using temperature controlled ovens. The test conditions for thermal impact damage are simulated according to the characteristics of natural forest fire. The test pieces are suspension porcelain insulators made by KRI in 2005 for transmission lines. In the thermal impact cycle tests with $300\;^{\circ}C$ thermal impact gradient (-70 to $230\;^{\circ}C$), cycling in 10 minute periods, no critical failures occurred in the test samples even with long cycle times. But in tests with thermal impact gradient from room temperature to $200-600\;^{\circ}C$, cycling in 10 to 30 minute periods, there were critical failures of the porcelain insulators according to the thermal impact gradient and quenching method. In the case of thermal impact by forest fire, it was found of that duration time is more important than the cycling time, and the initiation temperature of porcelain insulator failures is about $300\;^{\circ}C$, in the case of water quenching, many cracks and fracture of the porcelain occurred. It was found that the thermal impact failure is closely related to the displacement in the cement by thermal stress as confirmed by simulation. It was estimated that the initiation displacement by the thermal impact of $300\;^{\circ}C$ is about 0.1 %. Above 1% displacement, it is expected that the most porcelain insulators would fail.