A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test |
Jung, Sang-Won
(School of Mechanical Engineering, Chung-Ang University)
Kang, Min-Soo (School of Mechanical Engineering, Chung-Ang University) Jeon, Yu-Jae (School of Mechanical Engineering, Chung-Ang University) Kim, Do-Seok (School of Mechanical Engineering, Chung-Ang University) Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University) |
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