Browse > Article
http://dx.doi.org/10.4313/JKEM.2016.29.3.152

A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test  

Jung, Sang-Won (School of Mechanical Engineering, Chung-Ang University)
Kang, Min-Soo (School of Mechanical Engineering, Chung-Ang University)
Jeon, Yu-Jae (School of Mechanical Engineering, Chung-Ang University)
Kim, Do-Seok (School of Mechanical Engineering, Chung-Ang University)
Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.29, no.3, 2016 , pp. 152-158 More about this Journal
Abstract
The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.
Keywords
Lead-free solder; Thermal shock test; Intermetallic compounds; Shear test;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 J. J. Soh, D. S. Shim, K. S. Kim, and W. B. Byun, Trans. KIEE., 7, 1289 (2009)
2 Y. J. Jeon, S. I. Son, D. S. Kim, and Y. E. Shin, J. Korean Inst. Electr. Electron. Mater. Eng., 23, 611 (2010).
3 Y. E. Shin, S. J. Hwang, J. Korean Inst. Electr. Electron. Mater. Eng., 16(6), 549 (2003).   DOI
4 J. H. Lee, N. H. Kang, C. W. Lee, and J. H. Kim, Journal of KWS., 24(2), 17 (2006).
5 K. Y. Yu, S. M. Yang, and H. S. Yu, KSAE 2009 Annual Conference, (2009) p. 2637.
6 JEDEC Solid State Technology Association. "JESD22- A104C." Temperature cycling (2005).
7 JIS Z 3198-7, Translated and Published by Japanese Standards Association (2003).
8 E. K. Lee, C. W. Kim, Korean Society Of Precision Engineering (2009) p. 197.
9 I. Plotog, T. Cucu, B. Mihailescu, G. Varzaru, P. Scasta, and I. Busu, Electronics and Telecommunications (ISETC), 9th International Symposium on. IEEE, (Bucharest, Romania, 2010) p. 421.
10 Pang, H. L. John, and D. Y. R. Chong. Advanced Packaging, IEEE Transactions, 24, 499 (2001).   DOI
11 B. H. Liou, C. M. Chen, R. H. Horng, Y. C. Chiang, and D. S. Wu, Microelectronics Reliability, 52.5, 861 (2012).   DOI
12 C. C. Lee, P. J. Wang, and J. S. Kim, Electronic Components and Technology Conference, 2007. ECTC'07. Proceedings. 57th. IEEE, 648 (2007).
13 Y. J. Xu, L. Q. Wang, F. S. Wu, W. S. Xia, and H. Liu, Electronic Packaging Technology (ICEPT), 14th (IEEE, 2013) p. 959.
14 Y. Tian, J. Chow, X. Liu, and Y. P. Wu, Journal of electronic materials, 42, 230 (2013). [DOI: http://dx.doi.org/10.1007/s11664-012-2302-4]   DOI
15 W. S. Hong, W. S. Kim, N. C. Park, and K. B. Kim, Journal of KWJS, 25, 82 (2007).
16 G. T. Lim, B. J. Kim, K. W. Lee, M. J. Lee, Y. C. Joo, and Y. B. Park, Journal of the Microelectronics and Packaging Society, 15, 17 (2008).