• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 추계학술발표대회 논문집
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• pp.17-21
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• 2000

Logarithmic electrical resistivity of the untreated or thin diameter carbon fiber composite increased suddenly to the infinity when the fiber fracture occurred by tensile electro-micromechanical test, whereas that of the ED or thick fiber composite increased relatively broadly up to the infinity. Electrical resistance of single-carbon fiber composite increased suddenly due to electrical disconnection by the fiber fracture in tensile electro-micromechanical test, whereas that of SFC increased stepwise due to the occurrence of the partial electrical contact with increasing the buckling or overlapping in compressive test. Electrical resistivity measurement can be very useful technique to evaluate interfacial properties and to monitor curing behavior of single-carbon fiber/epoxy composite under tensile/compressive loading.

• Macromolecular Research
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• 제16권2호
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• pp.128-133
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• 2008

Several dual-curable acrylic pressure-sensitive adhesives (PSA) were synthesized by the radical polymerization of acrylic monomers containing benzophenone, hydroxyl, and alkyl groups. The optimum extent of UV-induced cure was determined by varying the content of the benzophenone groups (the photoinitiator) from 0.5 to 1.5 wt%. The weight average molecular weight of the polymers obtained ranged from 300,000 to 700,000 amu. The coated pressure-sensitive adhesives were cured either by short UV exposure to induce the grafting of acrylic polymers, or by heating for 6 hat $60^{\circ}C$ to promote the reactions between the polyisocyanates and hydroxyl groups. The dual-curing behavior was determined by monitoring both processes quantitatively by infrared spectroscopy. The developed dual-curable acrylic pressure-sensitive adhesives were found to compensate for the limitations in UV-induced curing of thick coatings.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 B
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• pp.709-711
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• 2002

The Induction heating is used in various industry and ever-increasing number of applications. The heating roll, which is a kind of induction heating, widely used in curing of coatings and fiber industry. In this papaer, we analized thermal characteristic of induction heating roll by threedimensional eddy-current analysis. Using this analytic results, We could predict the thermal distribution of induction heating roll

• 한국전기전자재료학회논문지
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• 제22권8호
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• pp.625-631
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• 2009

In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.207-208
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• 2007

Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

• Advances in materials Research
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• 제9권4호
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• pp.311-321
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• 2020

In this study, Mangifera Indica tree sawdust reinforced bisphenol-A aniline based benzoxazine composites were prepared by varying the sawdust from 20 wt% to 45 wt%. Thermogravimetric analysis of composites revealed excellent compatibility between polybenzoxazine and sawdust from the remarkable growth in char yield from 22% (neat resin) to 36% (for highly filled) and glass transition temperature from 151 to 165℃. Ultimate weight loss of the composites evaluated from the Derivatives of TG plots. Limiting oxygen index values of the composites reported considerable growth i.e.,from 28 to 32 along with the increase in filler content. Differential scanning calorimetry results showed that sawdust particles have an insignificant effect on curing temperature (219℃) for the raise in sawdust content. Structure of the sawdust, benzoxazine monomer, polybenzoxazine and composites were studied using Fourier transformation infrared spectroscopy. Overall, polybenzoxazine composites with sawdust as filler showed improved thermal properties when compared with pure polybenzoxazine.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2020년도 봄 학술논문 발표대회
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• pp.140-141
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• 2020

Concrete has a lower thermal conductivity or thermal diffusion coefficient compared to other building materials, so it is widely used as fireproof compartment material or refractory material for structures. However, in the event of thermal damage such as fire, cement curing agents and aggregates act differently, resulting in heat generation or deterioration of tissue due to dehydration, resulting in deterioration of physical properties and fire resistance. Therefore, in this study, the processing structure of cement paste is measured through nitrogen absorption method. The test specimen is a cement paste of 40% W/C and is set at 1000 ℃ under heating temperature conditions. As the temperature rose, the micro-pore mass below was reduced based on about 0.01 감소m, but the air gap above that was increased.Thus, in the range of pores measured in nitrogen adsorption, the air mass tended to decrease under high temperature conditions.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 봄 학술논문 발표대회
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• pp.229-230
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• 2023

In this study, the hydration heat differential method was applied to mass concrete structures, and the hydration heat analysis was compared and analyzed with on-site measurement results. The results showed that the temperature history measurements of mass concrete were managed at a difference of 8.4 ℃, and although there was some deviation in thermal stress, a similar trend was observed. Consequently, it was determined that the thermal stress on the surface of mass concrete is less than its tensile strength, which would prevent the occurrence of thermal cracks.

• 공업화학
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• 제2권4호
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• pp.340-347
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• 1991

3, 3', 4, 4'-Benzophenonetetracarboxylic dianhydride(BTDA)와 방향족 디아인민 4, 4'-oxydianiline(ODA) 및 amine terminated polydimethyl siloxane(PDMS)을 이용하여 homopolyimide(HPI)와 siloxane 함유 polyimide(SPI)를 합성하였다. 제 1 단계 반응생성물인 homopolyamic acid(HPAA)는 극성용매인 N-methylpyrrolidone(NMP)을 이용하여 얻었다. 제 1 단계에서 얻은 HPAA와 tetrahydrofuran(THF)에 녹인 세 종류의 PDMS(분자량 $M_n=1700g/mol$, 4000g/mol, 7000g/mol)를 30wt%로 반응시켜 siloxane-copolyamic acid (SPAA)를 얻은 후 이를 thermal curing하여 SPI를 얻었다. SPI및 HPI의 precursor인 SPAA와 HPAA의 inherent viscosity는 0.35~0.48dl/g이었다. 함수율은 SPI는최저 0.998%, HPI는 최저 1.88%정도였다. BTDA/MDA/siloxane계의 유리전이온도는 $258^{\circ}C-267^{\circ}C$이었다. 열중량 분석 결과 BTDA/ODA/siloxane계의 경우가 BTDA/MDA/siloxane계보다 다소 높은 분해 온도를 갖는 것으로 나타났다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.212-215
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• 2002

Interfacial evaluation and damage sensing of the carbon fiber/epoxy-amine terminated (AT)-polyetherimide (PEI) composites were performed using micromechanical test and electrical resistance measurement. As AT-PEI content increased, the fracture toughness of epoxy-AT-PEI matrix increased, and thus their interfacial shear strength (IFSS) was improved due to the improved toughness. After curing process, the changes in electrical resistance (ΔR) with increasing AT-PEI contents increased gradually because of the changes in thermal expansion coefficient (TEC) and thermal shrinkage of matrix. Matrix fracture toughness was correlated to the IFSS, residual stress and electrical resistance. The results obtained from the electrical resistance measurement during curing process, reversible stress/strain, and durability test were consistent with modified matrix toughness properties.