• Progress in Superconductivity
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• 제12권1호
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• pp.41-45
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• 2010

Low temperature micro-calorimeters have been employed in the field of high resolution alpha spectrometers. These alpha detectors typically consist of a superconducting or metal absorber and a temperature sensor. The temperature sensor can be a transition edge sensor (TES), a metallic magnetic calorimeter (MMC) or other low temperature detectors for an accurate measurement of temperature change due to an alpha particle absorption. We report a recent study of the heat flow between a replaceable absorber and a temperature sensor. A piece of gold foil in $2.4{\times}2.7{\times}0.03\;mm^3$ is used as an absorber. A $40\;{\mu}m$ diameter Au:Er paramagnetic sensor is attached to another small piece of gold foil in $400{\times}200{\times}30\;{\mu}m^3$ to serve as the temperature sensor. This sensor assembly, Au:Er and gold foil, is placed on a miniature SQUID susceptometer in a gradiometric configuration. The thermal connection between the absorber and the sensor was made with three gold bonding wires. The measured thermal conductance shows a linear dependence to the temperature. The values are in a good agreement with Wiedemann-Franz type thermal conductance of the gold wires.

• Nuclear Engineering and Technology
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• 제55권11호
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• pp.4295-4306
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• 2023

The vibration of fuel rods in axial flow is a universally recognized issue within both engineering and academic communities due to its significant importance in ensuring structural safety. This paper aims to thoroughly investigate the stability and nonlinear vibration of a fuel rod subjected to axial flow in a newly designed high temperature gas cooled reactor. Considering the possible presence of thermal expansion and large deformation in practical scenarios, the thermal effect and geometric nonlinearity are modeled using the von Karman equation. By applying Hamilton's principle, we derive the comprehensive governing equation for this fluid-structure interaction system, which incorporates the quadratic nonlinear stiffness. To establish a connection between the fluid and structure aspects, we utilize the Galerkin method to solve the perturbation potential function, while employing mode expansion techniques associated with the structural analysis. Following convergence and validation analyses, we examine the stability of the structure under various conditions in detail, and also investigate the bifurcation behavior concerning the buckling amplitude and flow velocity. The findings from this research enhance the understanding of the underlying physics governing fuel rod behavior in axial flow under severe yet practical conditions, while providing valuable guidance for reactor design.

• 폴리머
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• 제31권6호
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• pp.543-549
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• 2007

폴리우레탄의 우수한 기계적 물성에 전기 전도성을 가질 수 있도록 은 입자와의 복합체를 제조하였다. 균일하고 우수한 물성을 나타내기 위해서는 고른 분산성이 중요하게 되는데 폴리우레탄의 hard segment와 soft segment를 바꿔가며 가장 열적 안정성이 뛰어나고 은 입자를 균일하게 분산시킬 수 있는 폴리우레탄의 구조를 파악하였다. 열적 안정성은 방향족 증가와 사슬의 hard segment 비율 증가에 따라 높아짐을 알 수 있었고 분산성에서는 hard segment의 방향족이 포함된 것이 지방족보다 우수한 분산성을 가졌다. 또한 soft segment에 따라서는 낮은 분자량에서 사슬의 motility로 인해 좋은 분산성을 나타내었다. 하지만 전기 전도성에서는 고른 분산성보다도 입자간의 inter-connection을 이룰 수 있는 형태가 가장 낮은 저항값을 나타내었으며. NDI와 낮은 분자량의 PEG로 이루처진 복합체가 가장 좋은 물성을 나타내었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 한국태양에너지학회 논문집
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• 제35권4호
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• pp.1-7
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• 2015

The operation of the natural circulation type solar heating systems with facade integrated collector was analyzed by experiment. Two different types of flat plate solar collectors were used for these experiments. One was for the normal flat plate solar collector with the size of 1m*2m and the other was for the large size solar collector with $4m^2$(1m*4m). The experiments were carried out to investigate the effect of the series or parallel connection method on the performance of the collectors. As a result, the solar thermal system which is installed on the wall or facade would be applicable for the natural circulation type if the system design reflects various parameters, including collector connecting method(series or parallel), to provide enough vertical height between collector and storage tank, and to reduce pressure loss due to collector and piping network, etc. The natural circulation type of solar thermal system as proposed in this study can increase the system reliability by removing or minimizing the use of the components such as pump, controller, sensors which may cause serious troubles of the system for a long-time operation

• Journal of Electrical Engineering and Technology
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• 제12권2호
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• pp.665-673
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• 2017

This paper proposes a field weakening control method for operating an induction motor with a variable DC input voltage condition. In the variable DC voltage condition such as a battery, the field weakening method are required for the maximum output power. The conventional field weakening control methods can be used for operating the induction motor over the rated speed in a constant DC-link voltage condition. However, the conventional methods for operating the motor with the variable DC voltage is not suitable for the maximum output power. To overcome this problem, this paper proposes the optimized field weakening control method to extend the operating range of the induction motor with a rated power in a limited thermal and a wide DC input voltage conditions. The optimized d-axis and q-axis current equations are derived according to the field weakening region I and II to extend the operating region. The experimental results are presented to verify the effectiveness of the proposed method.

• International Journal of Control, Automation, and Systems
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• 제3권3호
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• pp.493-501
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• 2005

A power plant simulation tool ('PowerSim') has been developed with 10 years experience from the development of a plant simulator for efficient modeling of a power plant. PowerSim is the first developed tool in Korea for plant simulation with various plant component models, instructor station function and the Graphic Model Builder (GMB). PowerSim is composed of a graphic editor using general purpose design software, a netlist converter, component models, the scheduler, Instructor Station and an executive. The graphic editor generates a netlist that shows the connection status of the various plant components from the Simdiagram, which is drawn by Icon Drag method supported by GUI environment of the PowerSim. Netlist Converter normalizes the connection status of the components. Scheduler makes scheduling for the execution of the device models according to the netlist. Therefore, the user makes Simdiagram based on the plant Pipe and Instrument Drawing (P&ID) and inputs the plant data for automatic simulating execution. This paper introduces Graphic Model Builder (GMB), instructor station, executive and the detailed introduction of thermal-hydraulic modeling. This paper will also introduce basic ideas on how the simulation Diagram, based on netlist generated from general purpose design software, is made and how the system is organized. The developed tool has been verified through the simulation of a real power plant.

• 한국전기전자재료학회논문지
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• 제13권12호
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• pp.1058-1062
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• 2000

We investigated resistive superconducting fault current limites (SFCLs) fabricated using YBCO thin films on 2-inch diameter sapphire substrates. Nearly identical SFCL units were prepared and tested. The units were connected in series and parallel to increase the current and voltage ratings. A serial connection of the units showed significantly unbalanced power dissipation between the units. This imbalance was removed by introducing a shunt resistor to the firstly quenched unit. Parallel connection of the units increased the current rating. An SFCL module of 4 units in parallel, each of which has minimum quench current rating. An SFCL module of 4 units in parallel, each of which has minimum quench current 25 A$\_$peak/, was produced and successfully tested at a 220 V$\_$rms/circuit. From the resistance increase, we estimated that the film temperature increased to 200 K in 5 msec, and 300 K in 120 msec. Successive quenches revealed that this system is stable without degradation in the current limiting capability under such thermal shocks as quenches at 220 V$\_$rms/.

• 한국수소및신에너지학회논문집
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• 제17권3호
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• pp.338-346
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• 2006

In this paper, the test results of medium-size(120 kW class) PV system which was installed in the Taeahn thermal power station of Korea Western Power Co., Ltd., were summarized for developing the practical technology to applicate high voltage grid connection PV system. The 120 kW photovoltaic system which was consisted of 1,300 modules, PCS, and 150 kVA transformer station has been operated since Aug. 05, 2005. For verifying the modeling results of PV system, the operation data was compared with modeling results which was executed commercial PSCAD/EMTD and Psim tools. An equivalent circuit model of a solar cell has been also used for solar array modeling. A series of parameters required for array modeling have been estimated from general specification data of a solar module. A PWM voltage source inverter(VIS) and its current control scheme have been analyzed by using P&O (perturbation and Observation) MPPT algorithms technique.