• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.11
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• pp.767-773
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• 2017

Printed Circuit Heat Exchanger (PCHE) has an advantage for exchanging thermal energy between high-pressure and high-temperature fluids because its core is made by diffusion bonding method of accumulated metal thin-plates which are engraved of flow channel. Moreover, because it is possible that the flow channel can be micro-size hydraulic diameter, the heat transfer area per unit volume can be made larger than traditional heat exchanger. Therefore, PCHE can have higher efficiency of heat transfer. The smaller channel size can make the larger heat transfer area per unit volume. But if high pressure fluid flows inside the channel, the channel wall can be deformed, the structure and shape of flow channel and header have to be designed appropriately. In this study, the design methodology of PCHE channel in high pressure environment based on pressure vessel codes was investigated. And this methodology was validated by computational analysis.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.619-625
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• 2008

The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.9-17
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• 2018

Aluminum (Al) and its alloys have been used widely in a variety of industries such as structural, electronic, aerospace, and particularly automotive industries due to their lightweight characteristic, outstanding ductility, formability, high oxidation and corrosion resistance, and high thermal and electrical conductivity. Al have different kinds of alloys according to the various additional elements system and they should be selected properly depending on their effectiveness and suitability for their particular purpose. The major elements for Al alloys are silicon (Si), magnesium (Mg), manganese (Mn), copper (Cu), and zinc (Zn). In order for Al alloys to use for each industry, it is necessary to study of Al to Al joining and/or the Al to dissimilar materials joining to combine the individual parts into one. Many studies on joining technologies about Al to Al and Al to dissimilar materials have been performed such as press joining, bolted joint, welding, soldering, riveting, adhesive bonding, and brazing. This study reviews a variety of Al alloys and their joining method including its principles and properties with recent trends.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.11
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• pp.1100-1107
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• 2007

In this study, a method to characterize material properties of adhesive that is used in a layered plates bonding process is developed by combined evaluation of experiment, simulation and optimization technique. A small bonded specimens of rectangular plate are prepared to this end, and put into a thermal loading conditions. $Moir{\acute{e}}$ interferomety is used to measure submicron displacements occurred during the process. The elevated temperature is chosen as control factors. FE analysis with constant values for the adhesive materials is also carried out to simulate the experiment. Significant differences are observed from the two results, in which the simulation predicts the monotonic increase of the bending displacement whereas the measurement shows decrease of the displacement at above $75^{\circ}C$. In order to minimize the difference of the two, material parameters of the adhesive at a number of different temperatures are posed as unknowns to be determined, and optimization is conducted. As a result, optimum material parameters are found that excellently matches the simulation and experiment, which are decreased with respect to the temperature.

• Journal of Microbiology and Biotechnology
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• v.30 no.1
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• pp.146-154
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• 2020

With the advantages of biocatalytic method, enzymes have been excavated for the synthesis of chiral amino acids by the reductive amination of ketones, offering a promising way of producing pharmaceutical intermediates. In this work, a robust phenylalanine dehydrogenase (PheDH) with wide substrate spectrum and high catalytic efficiency was constructed through rational design and active-site-targeted, site-specific mutagenesis by using the parent enzyme from Bacillus halodurans. Active sites with bonding substrate and amino acid residues surrounding the substrate binding pocket, 49L-50G-51G, 74M,77K, 122G-123T-124D-125M, 275N, 305L and 308V of the PheDH, were identified. Noticeably, the new mutant PheDH (E113D-N276L) showed approximately 6.06-fold increment of k_cat/Km in the oxidative deamination and more than 1.58-fold in the reductive amination compared to that of the wide type. Meanwhile, the PheDHs exhibit high capacity of accepting benzylic and aliphatic ketone substrates. The broad specificity, high catalytic efficiency and selectivity, along with excellent thermal stability, render these broad-spectrum enzymes ideal targets for further development with potential diagnostic reagent and pharmaceutical compounds applications.

• Advances in aircraft and spacecraft science
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• v.1 no.1
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• pp.1-14
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• 2014

Physico-chemical changes of the plasma modified titanium alloy [Ti-6Al-4V] surface were studied with respect to their crystallographic changes by X-Ray Diffraction (XRD) and Scanning Electron Microscope (SEM).The plasma-treatment of surface was carried out to enhance adhesion of high performance nano reinforced epoxy adhesive, a phenomenon that was manifested in subsequent experimental results. The enhancement of adhesion as a consequence of improved spreading and wetting on metal surface was studied by contact angle (sessile drop method) and surface energy determination, which shows a distinct increase in polar component of surface energy. The synergism in bond strength was established by analyzing the lap-shear strength of titanium laminate. The extent of enhancement in thermal stability of the dispersed nanosilica particles reinforced epoxy adhesive was studied by Thermo Gravimetric Analysis (TGA), which shows an increase in onset of degradation and high amount of residuals at the high temperature range under study. The fractured surfaces of the joint were examined by Scanning electron microscope (SEM).

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.289-292
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• 2009

The fabrication method of glass bipolar plates for micro PEM fuel cell application has been established and performance evaluation has been carried out. The advantages of glass bipolar plates for micro PEM fuel cells are light weight, high chemical resistivity, and easy manufacture. The MEMS fabrication process of anisotropic wet etching, thermal & UV bonding along with metal layer deposition has been introduced. From performance evaluation, it was shown that the micro fuel cell with a metal layer deposited on the reactive area yielded higher power density than the one without it. But both power densities of the two cases showed out to be adequate with the current status of micro fuel cell technology.

• Journal of the Korean Ceramic Society
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• v.52 no.6
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• pp.435-440
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• 2015

It is a challenge from an industrial point of view to fabricate silicon nitride substrates with high thermal conductivity and good mechanical properties for power devices from high-purity Si scrap powder by means of thick film processes such as tape casting. We characterize the residual carbon and oxygen content after the binder burnout followed by nitridation as a function of the temperature in the temperature range of $300^{\circ}C-700^{\circ}C$ and the atmosphere in a green tape sample which consists of high-purity Si powder and polymer binders such as polyvinyl butyral and dioctyl phthalate. The optimum condition of binder burnout is suggested in terms of the binder removal temperature and atmosphere. If considering nitridation, the burnout of the organic binder in air compared to that in a nitrogen atmosphere could offer an advantage when fabricating reaction-bonded $Si_3N_4$ substrates for power devices to enable low carbon and oxygen contents in green tape samples.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1078-1084
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• 2006

Impurity contamination induced by $CF_4\;and\;HBr/Cl_2/O_2$ plasma etching on Si surface was examined by using surface spectroscopes. XPS(x-ray photoelectron spectroscopy) surface analysis showed that F of 0.4 at % exists in the surface layer in the form of Si-F bonding but Br and Cl are below the detection limit $(0.1{\sim}1.0%)$ of the spectroscope. Static-SIMS(secondary ion mass spectrometry) surface analysis showed that the etched Si surface was contaminated with etching gas elements such as H, F, Cl and Br, and they existed to the depth of about $20{\sim}40nm$. The etched Si surface was treated with three different methods that were HF dip, thermal oxidation followed by HF dip and oxygen-plasma oxidation followed by HF dip. They showed an effect in reducing the impurity contamination and the oxygen-plasma oxidation followed by HF dipping method appears to be a little bit more effective.