• Computers and Concrete
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• v.29 no.4
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• pp.237-246
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• 2022

The concrete quality relies on general factors like preparation technique, uniformity of the compaction, amount and appropriateness of the additives. The current article investigates the impact of a well knows amino acid, L-arginine as an additive on water requirements, setting durations and characterization of various cement samples. Compressive strength tests of reference and L-arginine added cements at age of 2, 7 and 28 days were carried out according to TS-EN 196-1. Samples were blended by incorporating various amounts of L-arginine (25 ppm, 50 ppm and 75 ppm) in the cement water mixture which were tested with Fourier transform infrared spectroscopy (FT-IR), X-ray diffraction (XRD), thermo-gravimetric analysis (TG), scanning electron microscopy (SEM) and the energy-dispersive X-ray spectroscopy (EDS) on the 28th day. Results revealed that L-arginine does not affect the setting time, volume expansion of cement and water demands negatively; rather it imparts enhanced sustainability to the samples. It was determined that the highest value belonged to the 75L mortar with an increase of 2.6% compared to the reference sample when the compressive strengths of all mortars were compared on the 28th day. Besides, it has been observed that the development of calcium silicate hydrate or C-S-H gel, calcium hydroxide or CH and other hydrated products are associated with each other. L-arginine definitely has a contribution in the consumption of CH formed in the hydration process.

• Progress in Superconductivity and Cryogenics
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• v.9 no.1
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• pp.37-42
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• 2007

We are developing a 22.9 kV/25 MVA superconducting fault current limiting(SFCL) system for a power distribution network. A Bi-2212 bulk SFCL element, which has the merits of large current capacity and high allowable electric field during fault of the power network, was selected as a candidate for our SFCL system. In this work, we experimentally investigated important characteristics of the 190 kVA Bi-2212 SFCL element in its application to the power grid e.g. DC voltage-current characteristic, AC loss, current limiting characteristic during fault, and so on. Some experimental data related to thermal and electromagnetic behaviors were also compared with the calculated ones based on numerical method. The results show that the total AC loss at rated current of the 22.9 kV/25 MVA SFCL system, consisting of one hundred thirty five 190 kVA SFCL elements, becomes likely 763 W, which is excessively large for commercialization. Numerically calculated temperature of the SFCL element in some sections is in good agreement with the measured one during fault. Local temperature distribution in the190 kVA SFCL element is greatly influenced by non-uniform critical current along the Bi-2212 bulk SFCL element, even if its non-uniformity becomes a few percentages.

• Korean Journal of Materials Research
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• v.23 no.7
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• pp.379-384
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• 2013

In order to produce size-controllable Ag nanoparticles and a nanomesh-patterned Si substrate, we introduce a rapid thermal annealing(RTA) method and a metal assisted chemical etching(MCE) process. Ag nanoparticles were self-organized from a thin Ag film on a Si substrate through the RTA process. The mean diameter of the nanoparticles was modulated by changing the thickness of the Ag film. Furthermore, we controlled the surface energy of the Si substrate by changing the Ar or $H_2$ ambient gas during the RTA process, and the modified surface energy was evaluated through water contact angle test. A smaller mean diameter of Ag nanoparticles was obtained under $H_2$ gas at RTA, compared to that under Ar, from the same thickness of Ag thin film. This result was observed by SEM and summarized by statistical analysis. The mechanism of this result was determined by the surface energy change caused by the chemical reaction between the Si substrate and $H_2$. The change of the surface energy affected on uniformity in the MCE process using Ag nanoparticles as catalyst. The nanoparticles formed under ambient Ar, having high surface energy, randomly moved in the lateral direction on the substrate even though the etching solution consisting of 10 % HF and 0.12 % $H_2O_2$ was cooled down to $-20^{\circ}C$ to minimize thermal energy, which could act as the driving force of movement. On the other hand, the nanoparticles thermally treated under ambient $H_2$ had low surface energy as the surface of the Si substrate reacted with $H_2$. That's why the Ag nanoparticles could keep their pattern and vertically etch the Si substrate during MCE.

• Applied Chemistry for Engineering
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• v.8 no.5
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• pp.742-748
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• 1997

Diamond films which have high hardness and thermal conductivity can be used to improve the performance of WC-Co as a cutting tool material. However, it is difficult to get such coatings of good uniformity and adhesiveness due to the surface characteristics of WC-Co. To get better coatings, some techniques, such as the surface treatment of substrate or the formation of interlayer between substrate and diamond film, have been tried. In the present work, the nickel interlayer is formed onto WC-Co by electroless Ni-P plating, which is introduced as a new method, and then diamond film is deposited on the interlayer. Formation and uniformity of three layers, i.e., substrate, electroless plate, and diamond film, and the adhesiveness of interlayers were studied. To investigate the effects of pretreatment on electroless plating, two different methods such as acid treatment and diamond powder treatment were used. The effects of heat treatment of the electroless plated surface on adhesiveness between the substrate and the interlayer were examined. It was found that as the temperature increases, the Ni crystals grow and then result in improved adhesiveness. Diamond film coatings of pure diamond phase were obtained at $800^{\circ}C$. It is concluded that the heat treated electroless Ni-P plating can be effectively used as a interlayer between WC-Co substrate and diamond film.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.434-435
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• 2012

Plasma enhanced chemical vapor deposition (PECVD) silicon dioxide thin films have many applications in semiconductor manufacturing such as inter-level dielectric and gate dielectric metal oxide semiconductor field effect transistors (MOSFETs). Fundamental chemical reaction for the formation of SiO2 includes SiH4 and O2, but mixture of SiH4 and N2O is preferable because of lower hydrogen concentration in the deposited film [1]. It is also known that binding energy of N-N is higher than that of N-O, so the particle generation by molecular reaction can be reduced by reducing reactive nitrogen during the deposition process. However, nitrous oxide (N2O) gives rise to nitric oxide (NO) on reaction with oxygen atoms, which in turn reacts with ozone. NO became a greenhouse gas which is naturally occurred regulating of stratospheric ozone. In fact, it takes global warming effect about 300 times higher than carbon dioxide (CO2). Industries regard that N2O is inevitable for their device fabrication; however, it is worthwhile to develop a marginable nitrous oxide free process for university lab classes considering educational and environmental purpose. In this paper, we developed environmental friendly and material cost efficient SiO2 deposition process by substituting N2O with O2 targeting university hands-on laboratory course. Experiment was performed by two level statistical design of experiment (DOE) with three process parameters including RF power, susceptor temperature, and oxygen gas flow. Responses of interests to optimize the process were deposition rate, film uniformity, surface roughness, and electrical dielectric property. We observed some power like particle formation on wafer in some experiment, and we postulate that the thermal and electrical energy to dissociate gas molecule was relatively lower than other runs. However, we were able to find a marginable process region with less than 3% uniformity requirement in our process optimization goal. Surface roughness measured by atomic force microscopy (AFM) presented some evidence of the agglomeration of silane related particles, and the result was still satisfactory for the purpose of this research. This newly developed SiO2 deposition process is currently under verification with repeated experimental run on 4 inches wafer, and it will be adopted to Semiconductor Material and Process course offered in the Department of Electronic Engineering at Myongji University from spring semester in 2012.

• Journal of the Korea Institute of Military Science and Technology
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• v.11 no.2
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• pp.136-143
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• 2008

A three-wavelength solar bank is a very important part for a solar simulator with commercial superlux lamps. It is projected metal halide lamps to satisfy following points simultaneously: $\pm$10% of uniformity for irradiance of target area and irradiance in each wave region, and $1,232W/m^2$ of maximum solar irradiance in summer. The developed solar lamp bank has been analyzed numerically by commercial programs in this study to carry out experiments. In conclusion, designed B-type heat lamp is not concentrated in one place than designed A-type heat lamp, it is spreaded widely, and it was proved numerical computation. We suggest that solar simulator is applied to actual experiment test through heat flow numerical analysis in solar lamp bank and the lamp is applied private industry or the military using complex environmental assessment test.

• Transactions of the KSME C: Technology and Education
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• v.3 no.4
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• pp.265-271
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• 2015

The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.

• Fashion & Textile Research Journal
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• v.20 no.5
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• pp.600-607
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• 2018

Polypropylene fibers, while having many advantages such as light weight, sweat fast drying, water-repellent, drainage, thermal insulation, anti-static property has a drawback in dyeing. In recent years, the development of dyeable polypropylene fibers has expanded its value in the textile market. The purpose of this study is to fabricate composite spun yarns using polypropylene, acrylic, rayon and wool and to analyze tensile properties, uniformity characteristics, bending properties, hairiness, and surface shape according to the degree of fineness and blended ratio. The specimens consisted of 100% polypropylene spun yarn pp30, pp40 and ppa(pp/acrylic), ppr(pp/rayon), ppw(pp/wool), 5 altogether sed in this study. The results of the study are as follows. The breaking strength of polypropylene spun yarn blended with rayon and acrylic was higher than that of 100% polypropylene spun yarn. The polypropylene spun yarn is higher the fineness been shown to decrease the breaking strength and elongation. The bending properties of polypropylene spun yarns were in the order of ppa>ppr>pp40>pp30>ppw. The unevenness of ppw, ppr, and ppa was higher than pp40 and pp30. With the exception of ppw with crimp properties, pp30 and pp40 were found to have a hairiness index greater than ppr, ppa. In the microscopic photographs of polypropylene spun yarn, pp30, which had the highest hairiness index, was found to have a thick yarn and a large number of hairs, and ppw had hairs of 3 mm or more protruding elongated outwardly.

• Transactions of the Korean hydrogen and new energy society
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• v.28 no.4
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• pp.407-418
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• 2017

Battery heat management is essential for high power and high energy battery system because it affects its performance, longevity, and safety. In this paper, we investigated the temperature of the 18650 Lithium Ion Battery Module used in a Energy Storage System (ESS) and the cooling method to minimize cell-to-cell temperature variation of battery module. For uniform temperature distribution within a battery module, the flow direction of the coolant in a battery module has been changed according to the time interval, and studied the effect of the cooling method on the temperature uniformity in a battery module which includes a number of battery cells. The experimental results show that bi-directional battery cooling method can effectively reduce the cell-to-cell temperature variation compared with the one-directional battery cooling. Furthermore, it is also found that bi-directional battery cooling can reduce the maximum temperature in a battery module.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.43-47
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• 2003

As and BF$_2$dopants are implanted for the formation of source/drain with dose of 1${\times}$10$^{15}$ ions/$\textrm{cm}^2$∼5${\times}$10$^{15}$ ions/$\textrm{cm}^2$ then formed cobalt disilicide with Co/Ti deposition and doubly rapid thermal annealing. Appropriate ion implantation and cobalt salicide process are employed to meet the sub-0.13 $\mu\textrm{m}$ CMOS devices. We investigated the process results of sheet resistance, dopant redistribution, and surface-interface microstructure with a four-point probe, a secondary ion mass spectroscope(SIMS), a scanning probe microscope (SPM), and a cross sectional transmission electron microscope(TEM), respectively. Sheet resistance increased to 8%∼12% as dose increased in $CoSi_2$$n^{＋}$ and $CoSi_2$$p^{V}$ , while sheet resistance uniformity showed very little variation. SIMS depth profiling revealed that the diffusion of As and B was enhanced as dose increased in $CoSi_2$$n^{＋}$ and $CoSi_2$$p^{＋}$ . The surface roughness of root mean square(RMS) values measured by a SPM decreased as dose increased in $CoSi_2$$n^{＋}$ , while little variation was observed in $CoSi_2$$p^{＋}$ . Cross sectional TEM images showed that the spikes of 30 nm∼50 nm-depth were formed at the interfaces of $CoSi_2$$n^{＋}$ / and $CoSi_2$/$p^{＋}$, which indicate the possible leakage current source. Our result implied that Co/Ti cobalt salicide was compatible with high dose sub-0.13$\mu\textrm{m}$ process.