• Journal of the Society of Naval Architects of Korea
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• v.32 no.2
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• pp.75-83
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• 1995

As a basic research for the automation of plate forming process, the theoretical aspect of plate bending by line heating was surveyed and numerical simulation of plate bonding deformation was performed using the 3-dimensional nonlinear transient thermal elasto-plastic finite element analysis. Analyzing the unsteady heat conduction problem of the flat steel plate under heat flux input by gas torch, the time history of 3-dimensional thermal distribution was obtained. Transient thermal deformation process of the plate was analyzed under the thermal loading. And the calculated results are investigated in detail.

• Elastomers and Composites
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• v.51 no.4
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• pp.280-285
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• 2016

The purpose of this study is to get optimum design and operation conditions of the heating rubber roller for laminating process. The cause of performance degradation of heating rubber roller is delamination of rubber on metal tube, rubber aging due to high temperature. We measured the material properties of thermal expansion, thermal conductivity, specific heat and density and analyzed thermal distributions of rubber layer using finite element method. As a result of heat/flow analysis, the density distribution of heating coil must shorten the stabilization time by reducing the temperature deviation on the length direction at the temperature rising section after increasing the density of the area contacting with the laminate film at the center part which is an opposite of the current composition while enabling to maintain the temperature of heater to be consistent while maintaining the temperature deviation to be low when heat loss is created. Finally, we determined optimum heating method of heating rubber roller.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2001.05a
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• pp.238-242
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• 2001

In this paper, we proposed an optimal identification method of the membership functions and the numbers of fuzzy rule base for the stabilization controller of the Thermal process control system by RVEGA. Although fuzzy logic controllers and expert systems have been successfully applied in many complex industrial process, they must rely on experts knowledges. So it is difficult in determination of the linguistic state space, definition of the membership functions of each linguistic term and the derivation of the control rules. To verify the validity of this RVEGA-based fuzzy controller, Thermal process control system, with strong nonlinear dynamics, was selected for application of this algorithm and compare with PI controller, and the empirically improved fuzzy controller.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.11a
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• pp.52-53
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• 2020

The thermal spray coating process is being used to protect the metals and alloys from wear, abrasion, fatigue, tribology, and corrosion failure. Therefore, in the present study, Al and Zn was deposited by plasma arc thermal spray process onto the steel substrate and their performance was assessed. The bond adhesion result shows that Al coating has higher value attributed to compact, dense, and less porous compared to Zn coating which contain defects/pores and uneven morphology assessed by scanning electron microscopy (SEM). Electrochemical results show that the Al coating exhibited higher impedance value compared to Zn in artificial ocean water solution at prolonged exposure periods. However, both coatings show the increment in polarization resistance with exposure periods which reveal that porosity of coatings is filled by the corrosion products.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.39-47
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• 2002

Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.

• Fashion & Textile Research Journal
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• v.20 no.1
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• pp.83-92
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• 2018

This paper investigated garment formability and fabric mechanical properties of one-way and two-way stretch fabrics according to the thermal treatment methods. One-way and two-way stretch fabrics were woven using 75d and 150d PET/spandex covering yarns and then these were wet thermal treated with four kinds of finishing machines. The fabric mechanical properties of these stretch fabrics specimens were measured and compared with the regular PET fabrics. The stretch ratio of one-way stretch fabric was ranged 12 to 26 percentage, 15 to 45 percentage for 2-way stretch fabrics and 4 to 10 percentage for regular fabrics. Garment formability of stretch fabric was superior than that of regular fabrics, in addition, 2-way stretch fabric was better than one-way. The garment formability of the stretch fabrics treated with CPB and Lava wet thermal machines showed the highest values, and the stretch ratio of these 2-way stretch fabrics was also the highest, which was ranged 20 to 45 percentage. This phenomenon was assumed to be due to high extensibility and bending rigidity with low shear modulus of the 2-way stretch fabric treated with CPB and Lava wet thermal machines. It was shown that the garment formability of stretch fabrics treated without dry thermal treatment was higher than that of dry thermal treated fabrics. It revealed that high stretch fabric was available under the condition of low process tension in the wet and dry thermal treatments of the finishing process, which makes high garment formability.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.10
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• pp.652-658
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• 2016

Thermal batteries use inorganic salt as electrolyte, which is inactive at room temperature. As soon as heat pellets are fired by an igniter, all the solid electrolytes are instantly melted into excellent ionic conductors. However, the abnormal heat generation by the igniter flame or heat pellets causes the thermal decomposition of the electrode and the melting of the anode, eventually leading to a thermal runaway, which results in overheating or explosion. The thermal runaway can be significantly reduced by the adoption of $Zr/BaCrO_4$ heat papers. In this study, the heat papers with various ratios of fuel (Zr) and oxidizer ($BaCrO_4$) were prepared by the paper-making process. We have investigated the calorimetric value, burning rate, and ignition sensitivity. The ignition test of heat pellets and the discharge test of thermal batteries were also carried out. At the composition of 40 wt.% of Zr, the heat papers showed the highest specific calorimetric value and burning rate. As a result, $Zr/BaCrO_4$ heat paper made by the paper-making process has shown the applicability for thermal batteries.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.289.2-289.2
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• 2016

In-Ga-Zn-O(IGZO) receive great attention as a channel material for thin film transistors(TFTs) as next-generation display panel backplanes due to its superior electrical and physical properties such as a high mobility, low off-current, high sub-threshold slope, flexibility, and optical transparency. For the purpose of fabricating high performance IGZO TFTs, a thermal recovery process above a temperature of $300^{\circ}C$ is required for recovery or rearrangement of the ionic bonding structure. However diffused metal atoms from source/drain(S/D) electrodes increase the channel conductivity through the oxidation of diffused atoms and reduction of $In_2O_3$ during the thermal recovery process. Threshold voltage ($V_{TH}$) shift, one of the electrical instability, restricts actual applications of IGZO TFTs. Therefore, additional investigation of the electrical stability of IGZO TFTs is required. In this paper, we demonstrate the effect of Ti diffusion and modulation of interface traps by carrying out an annealing process on IGZO. In order to investigate the effect of diffused Ti atoms from the S/D electrode, we use secondary ion mass spectroscopy (SIMS), X-ray photoelectron spectroscopy, HSC chemistry simulation, and electrical measurements. By thermal annealing process, we demonstrate VTH shift as a function of the channel length and the gate stress. Furthermore, we enhance the electrical stability of the IGZO TFTs through a second thermal annealing process performed at temperature $50^{\circ}C$ lower than the first annealing step to diffuse Ti atoms in the lateral direction with minimal effects on the channel conductivity.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.1-4
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• 2009

This work shows how the adoption of a dual-dicing process for silicon wafer separation affects the thermal-cycling reliability (i.e. $-65^{\circ}C$ to $150^{\circ}C$) of the semiconductor devices utilizing lead-on-chip (LOC) die attach technique. In-situ examinations show that conventional single-dicing process directly attacks the edge region of diced devices but dual-dicing process effectively protects the edge region of diced devices from dicing-induced mechanical damage. Probably, this is because the preferential and sacrificial fracture of notched regions induced on the active surface of wafers saves the edge regions. It was also investigated through thermal-cycling tests that the number of thermal-cycling induced failures is much lower at the dual-dicing process than the single-dicing process.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.533-536
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• 2006

VIATRON TECHNOLOGIES has developed Field-Enhanced Rapid Thermal Processor (FERTP) system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The FE-RTP allows the diverse process options including crystallization, thermal oxidation of gate oxides and fast pre-compactions. The process and equipment compatibility with a-Si TFT lines is able to provide a viable solution to produce poly-Si TFTs using a-Si TFT lines.