• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.30-34
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• 2023

Since dishing in the CMP process is a major factor that hinders the uniformity of the semiconductor thin film, many studies have focused this issue to improve the non-uniformity of the film due to dishing. In the metal layer, the dishing mainly occurs in the central part of the metal due to a difference in a selection ratio between the metal and the dielectric, thereby generating a step on the surface of the metal layer. Factors that cause dishing include the shape of the thin film, the chemical reaction of the slurry, thermal deformation, and the rotational speed of the pad and head, and dishing occurs due to complex interactions between them. This study analyzed the stress generated on the metal layer surface in the CMP process using ANSYS software, a commercial structure analysis program. The stress caused by the vertical load applied from the pad was analyzed by changing the area density and line width of the dummy metal. As a result of the analysis, the stress in the active region decreased as the pattern density and line width of the dummy metal increased, and it was verified that it was valid compared with the previous study that studied the dishing according to the dummy pattern density and line width of the metal layer. In conclusion, it was confirmed that there is a relationship between dishing and normal stress.

• Fashion & Textile Research Journal
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• v.16 no.6
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• pp.954-960
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• 2014

This study surveyed high school girls in the Busan, Ulsan, and Gyeongnam areas to study how they wear school uniforms along with their satisfaction levels and demands in regards to functional school uniforms. This study presents data on the requirements for the development of winter school uniforms for high school girls with improved warmth functions. The findings are: First, high school girls purchased school uniforms of different brands and the purchase rates for three brands were 25% to 30% approximately. Most of them spent more than 300,000 KRW and less than 400,000 KRW on school uniforms purchases. Second, the greatest complaints by students about winter school uniforms were the ability to conduct routine activities and poor thermal insulation. The most popular bottom underwear for girls was underpants and leggings. The most popular top underwear was half-sleeved round neck t-shirts and running shirts. Third, a survey about uniform functionality showed that most students used and 'arm pit sweat absorbing pad', 'Waist size adjusting function, and 'inside pockets with zippers'. Satisfaction with functional uniforms was low: less than 3.5 in all questions. Fourth, students were favorable to develop functional uniforms to keep warm in the winter. The bottom needs to be warmer than the top and it is necessary to keep legs warm, especially the thighs and calves.

• Archives of Plastic Surgery
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• v.32 no.4
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• pp.408-415
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• 2005

Following a transverse rectus abdominis musculocutaneous(TRAM) flap breast reconstruction, denervated state of the flap causes the flap skin prone to thermal injury, calling for special attention. During the last 5 years, 69 breast reconstruction with 72 free TRAM flaps, were performed. Four out of thesse 69 patients sustained burn injury. Heat sources were a warm bag(n=2), heating pad(n=1) and warming light (n=1). The thermal injuries occured from 2 days to 3 months following the reconstruction. Three patients healed with conservative treatment, but one patient required debridement and skin graft. Initially 3 out of 4 patients with the burn had shown superficial 2nd degree burn with small blebs or bullae. However all 4 patients healed with scars. Mechanism of burn injuries of the denervated flap are known to be resulting from; 1) loss of behavioral protection due to denervation of flap with flap elevation and transfer, 2) loss of autonomic thermoregulatory control with heat dissipation on skin flap vasculature contributing to susceptibility of burn injury. 3) changes of immunologic and normal inflammatory response increasing thromboxane, and a fall in substance P & NGF (nerve growth factor). Including the abdominal flap donor site, sensory recovery of the reconstructed breast varies individually from 6 month even to 5 years postoperatively. During this period, wound healing is delayed, resulting in easier scarring compared to that observed in the sensate skin. Patients should be carefully informed and warned of possible burn injuries and taught to avoid exposure to heat source at least until 3 years postoperatively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.4
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• pp.425-431
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• 2011

Thermal energy generated because of the friction between the disc and pad is transferred to both sides and causes thermal expansion of the material, which affects the contact pressure distribution. This phenomenon, which is called thermoelastic instability (TEI), is affected by the natural mode of a disc. TEI results in the formation of a hot spot and causes hot judder vibrations. In this study, three-dimensional analysis of the hot judder of a ventilated disc for automotives was performed by using the commercial finite element analysis program, SAMCEF. The intermediate processor based on a staggered approach was used to exchange the result data of the mechanical and thermal model. The hot spot was formed on the surface of the disc, and the number of hot spots was compared with the natural mode of the disc.

• Fashion & Textile Research Journal
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• v.25 no.4
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• pp.497-507
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• 2023

This study measured the effect 3D printing products comprised of different materials and shapes on heat transfer in clothing to derive fundamental data on thermal comfort among clothing comfort. The variables were three types of material (EVA foam, TPU-10%, TPU-10%+EVA), two types of shape (without holes, with holes), and two types of covers(without cover, with cover). All samples (12 types) prepared by combining these variables were placed on the hot plate set at 36℃, and the surface temperature was measured at three points for 10 minutes. The surface temperature change was dependent on the material, shape, and cover of the sample. The sample printed with TPU exhibited higher temperature transfer compared to the EVA foam sample after 10 mins. In addition, the temperature transfer was better when there were holes, and rate decreased when the sample was covered with fabric. We confirmed that material selection of the pad and thermal conductivity of the cover are extremely important in solving thermal stress to the human body caused by functional clothing with protectors. Additionally, as the protector, it is recommended to design the outer shell with a passage, such as a hole, to allow the rapid transfer of heat to the external environment.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.1
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• pp.13-22
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• 2001

This paper presents three dimensional structure of RF packages and the improvement effect of its electrical characteristics when implementing RF transceivers. We divided RF modules into several subunits following each subunit function based on the partitioning algorithm which suggests a method of three dimension stacking interconnection, PAA(pad area array) interconnection and stacking of three dimensional RF package structures. 224MHz ITS(Intelligent Transportation System) RF module subdivided into subunits of functional blocks of a receiver(RX), a transmitter(TX), a phase locked loop(PLL) and power(PWR) unit, simultaneously meeting the requirements of impedance characteristic and system stability. Each sub­functional unit has its own frequency region of 224MHz, 21.4MHz, and 450KHz~DC. The signal gain of receiver and transmitter unit showed 18.9㏈, 23.9㏈. PLL and PWR modules also provided stable phase locking, constant voltages which agree with design specifications and maximize their characteristics. The RF module of three dimension stacking structure showed $48cm^3$, 76.9％ reduction in volume and 4.8cm, 28.4％ in net length, 41.8$^{\circ}C$, 37% in maximum operating temperature, respectively. We have found that three dimensional PAA package structure is able to produce high speed, high density, low power characteristics and to improve its functional characteristics by subdividing RF modules according to the subunit function and the operating frequency, and the features of physical volume, electrical characteristics, and thermal conditions compared to two dimensional RF circuit modules.

• Journal of Bio-Environment Control
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• v.5 no.2
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• pp.215-235
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• 1996

The thermal analysis by mathematical model simulation makes it possible to reasonably predict heating and/or cooling requirements of certain greenhouses located under various geographical and climatic environment. It is another advantages of model simulation technique to be able to make it possible to select appropriate heating system, to set up energy utilization strategy, to schedule seasonal crop pattern, as well as to determine new greenhouse ranges. In this study, the control pattern for greenhouse microclimate is categorized as cooling and heating. Dynamic model was adopted to simulate heating requirements and/or energy conservation effectiveness such as energy saving by night-time thermal curtain, estimation of Heating Degree-Hours(HDH), long time prediction of greenhouse thermal behavior, etc. On the other hand, the cooling effects of ventilation, shading, and pad ||||&|||| fan system were partly analyzed by static model. By the experimental work with small size model greenhouse of 1.2m$\times$2.4m, it was found that cooling the greenhouse by spraying cold water directly on greenhouse cover surface or by recirculating cold water through heat exchangers would be effective in greenhouse summer cooling. The mathematical model developed for greenhouse model simulation is highly applicable because it can reflects various climatic factors like temperature, humidity, beam and diffuse solar radiation, wind velocity, etc. This model was closely verified by various weather data obtained through long period greenhouse experiment. Most of the materials relating with greenhouse heating or cooling components were obtained from model greenhouse simulated mathematically by using typical year(1987) data of Jinju Gyeongnam. But some of the materials relating with greenhouse cooling was obtained by performing model experiments which include analyzing cooling effect of water sprayed directly on greenhouse roof surface. The results are summarized as follows : 1. The heating requirements of model greenhouse were highly related with the minimum temperature set for given greenhouse. The setting temperature at night-time is much more influential on heating energy requirement than that at day-time. Therefore It is highly recommended that night- time setting temperature should be carefully determined and controlled. 2. The HDH data obtained by conventional method were estimated on the basis of considerably long term average weather temperature together with the standard base temperature(usually 18.3$^{\circ}C$). This kind of data can merely be used as a relative comparison criteria about heating load, but is not applicable in the calculation of greenhouse heating requirements because of the limited consideration of climatic factors and inappropriate base temperature. By comparing the HDM data with the results of simulation, it is found that the heating system design by HDH data will probably overshoot the actual heating requirement. 3. The energy saving effect of night-time thermal curtain as well as estimated heating requirement is found to be sensitively related with weather condition: Thermal curtain adopted for simulation showed high effectiveness in energy saving which amounts to more than 50% of annual heating requirement. 4. The ventilation performances doting warm seasons are mainly influenced by air exchange rate even though there are some variations depending on greenhouse structural difference, weather and cropping conditions. For air exchanges above 1 volume per minute, the reduction rate of temperature rise on both types of considered greenhouse becomes modest with the additional increase of ventilation capacity. Therefore the desirable ventilation capacity is assumed to be 1 air change per minute, which is the recommended ventilation rate in common greenhouse. 5. In glass covered greenhouse with full production, under clear weather of 50% RH, and continuous 1 air change per minute, the temperature drop in 50% shaded greenhouse and pad ＆ fan systemed greenhouse is 2.6$^{\circ}C$ and.6.1$^{\circ}C$ respectively. The temperature in control greenhouse under continuous air change at this time was 36.6$^{\circ}C$ which was 5.3$^{\circ}C$ above ambient temperature. As a result the greenhouse temperature can be maintained 3$^{\circ}C$ below ambient temperature. But when RH is 80%, it was impossible to drop greenhouse temperature below ambient temperature because possible temperature reduction by pad ||||&|||| fan system at this time is not more than 2.4$^{\circ}C$. 6. During 3 months of hot summer season if the greenhouse is assumed to be cooled only when greenhouse temperature rise above 27$^{\circ}C$, the relationship between RH of ambient air and greenhouse temperature drop($\Delta$T) was formulated as follows : $\Delta$T= -0.077RH＋7.7 7. Time dependent cooling effects performed by operation of each or combination of ventilation, 50% shading, pad ＆ fan of 80% efficiency, were continuously predicted for one typical summer day long. When the greenhouse was cooled only by 1 air change per minute, greenhouse air temperature was 5$^{\circ}C$ above outdoor temperature. Either method alone can not drop greenhouse air temperature below outdoor temperature even under the fully cropped situations. But when both systems were operated together, greenhouse air temperature can be controlled to about 2.0-2.3$^{\circ}C$ below ambient temperature. 8. When the cool water of 6.5-8.5$^{\circ}C$ was sprayed on greenhouse roof surface with the water flow rate of 1.3 liter/min per unit greenhouse floor area, greenhouse air temperature could be dropped down to 16.5-18.$0^{\circ}C$, whlch is about 1$0^{\circ}C$ below the ambient temperature of 26.5-28.$0^{\circ}C$ at that time. The most important thing in cooling greenhouse air effectively with water spray may be obtaining plenty of cool water source like ground water itself or cold water produced by heat-pump. Future work is focused on not only analyzing the feasibility of heat pump operation but also finding the relationships between greenhouse air temperature(T$_{g}$ ), spraying water temperature(T$_{w}$ ), water flow rate(Q), and ambient temperature(T$_{o}$).

• Journal of Welding and Joining
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• v.30 no.2
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• Journal of the Korea Convergence Society
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• v.11 no.11
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• pp.233-237
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• 2020

In this study, the thermal analysis on the brake disc of electric kickboard was analyzed. The different heat is transmitted depending on the pad contact surface of brake disc. The trend that the temperature decreases at the part away from the contact surface was almost constant. And model A showed a slightly lower temperature distribution than model B. Model A has a maximum equivalent stress of 7% higher than model B. By being applied with the higher heat transfer above the contact surface, it is thought that model B has a greater strength than model A if the design takes into account the corner of the brake disc. If this study result is utilized to the design of electric kickboard, the design of brake disc with better strength is considered to be established. The durability of brake against the heat can be evaluated by applying this study result to the brake disc of electric kickboard. And it is seen that the result can be the design of brake with strength and the aesthetic convergence.