• Title/Summary/Keyword: Thermal Cycling Test

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Comparison of fracture strength, surface hardness, and color stain of conventionally fabricated, 3D printed, and CAD-CAM milled interim prosthodontic materials after thermocycling

  • Mesut Yildirim;Filiz Aykent;Mahmut Sertac Ozdogan
    • The Journal of Advanced Prosthodontics
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    • v.16 no.2
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    • pp.115-125
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    • 2024
  • PURPOSE. The purpose of this in vitro study was to investigate the fracture resistance, surface hardness, and color stain of 3D printed, CAD-CAM milled, and conventional interim materials. MATERIALS AND METHODS. A total of 80 specimens were fabricated from auto polymerizing polymethyl methacrylate (PMMA), bis-acryl composite resin, CAD-CAM polymethyl methacrylate resin (milled), and 3D printed composite resin (printed) (n = 20). Forty of them were crown-shaped, on which fracture strength test was performed (n = 10). The others were disc-shaped specimens (10 mm × 2 mm) and divided into two groups for surface hardness and color stainability tests before and after thermal cycling in coffee solution (n = 10). Color parameters were measured with a spectrophotometer before and after each storage period, and color differences (CIEDE2000 [DE00]) were calculated. The distribution of variables was measured with the Kolmogorov Smirnov test, and one-way analysis of variance (ANOVA), Tukey HSD, Kruskal-Wallis, Mann-Whitney U tests were used in the analysis of quantitative independent data. Paired sample t-test was used in the analysis of dependent quantitative data (P < .05). RESULTS. The highest crown fracture resistance values were determined for the 3D printed composite resin (P < .05), and the lowest were observed in the bis-acryl composite resin (P < .05). Before and after thermal cycling, increase in mean hardness values were observed only in 3D printed composite resin (P < .05) and the highest ΔE00 value were observed in PMMA resin for all materials (P < .05). CONCLUSION. 3D printing and CAD-CAM milled interim materials showed better fracture strength. After the coffee thermal cycle, the highest surface hardness value was again found in 3D printing and CAD-CAM milled interim samples and the color change of the bis-acryl resin-based samples and the additive production technique was higher than the PMMA resin and CAD-CAM milled resin samples.

Practical Application of Lead-free Solder in Electronic Products

  • Cho Il-Je;Chae Kyu-Sang;Min Jae-Sang;Kim Ik-Joo
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2004.09a
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    • pp.93-99
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    • 2004
  • At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

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Determination of Optimum Condition in Plasma Spraying Process (플라즈마용사공정에서의 최적 조건 결정에 관한 연구)

  • 최경수;박동화
    • Journal of the Korean Ceramic Society
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    • v.33 no.2
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    • pp.155-162
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    • 1996
  • A Taguchi methodology study of the plasma spraying thermal barrier coating (TBC) layer is presented. The experiment parameters were designed by a L8-style orthogonal arrays approach. A Taguchi analysis was conduc-ted through the results of the coating properties which were affected by plasma spraying parameters. Zirconia (partially stbilized with ytrria: PSZ) was sprayed on TiAl intermetallic compound substrates, The coating layer was characterized by thickness microstructure and porosity using SEM and Image analyzer. The coating quali-ties are discussed with respect to thermal barrier effect thermal cycling test6 and adhesion strength test. An optimum condition of plasma spraying process which are derived from the Taguchi analysis could be found for high quality TBC.

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Development and Performance Validation of Thermal Control Subsystem for Earth Observation Small Satellite Flight Model (지구관측 소형위성 비행모델의 열제어계 개발 및 성능 검증)

  • Chang, Jin-Soo;Jeong, Yun-Hwang;Kim, Byung-Jin
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.36 no.12
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    • pp.1222-1228
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    • 2008
  • A small satellite, DubaiSat-1 FM(Flight Model), which is based on SI-200 standard bus platform and scheduled to be launched in 2008, is being developed by Satrec Initiative and EIAST(Emirates Institution for Advanced Science and Technology). The TCS(Thermal Control Subsystem) of DubaiSat-1 FM has been designed to mainly utilize passive thermal control in order to minimize power consumption, but the active control method using heaters has been applied to some critical parts. Also, thermal analysis has been performed for DubaiSat-1's mission orbit using a thermal analysis model. The thermal design is modified and optimized to satisfy the design temperature requirements for all parts according to the analysis result. The thermal control performance of DubaiSat-1 FM is verified by thermal vacuum space simulation, consisting of thermal cycling and thermal balance test. Also, to validate the thermal modeling of DubaiSat-1 FM, comparison of test results with analysis has been performed and model calibration has been completed.

A Study on Development of High Voltage Mica Capacitors (고전압 마이카 커패시터 개발에 관한 연구)

  • Yun, Eui-Jung;Choi, Cheal-Soon;Kim, Jae-Wook;Lee, Dong-Hyuk
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.57 no.7
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    • pp.1229-1234
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    • 2008
  • In this work, ultra high-voltage (17 - 50 kV AC), reliable 80 pF mica capacitors for partial discharge system application were investigated. Mica was used as the dielectric of the capacitors. Using the conservative design rule, over 3 individual $50\;{\mu}m$ thick mica sheets with a size of 30mm{\times}35mm were used with lead foils to form a parallel capacitor element and 20 mica sheets were interleaved with lead foils to form a series stack of parallel capacitor element to meet the requirements of the capacitors. The dimensions of the fabricated 80 pF capacitors for 17 kV AC and 50 kV AC were $90\;mm{\times}90\;mm$ and $95\;mm{\times}180\;mm$, respectively. The high-frequency characteristics of the capacitance (C) and dissipation factor (D) of the developed capacitors were measured using a capacitance meter. The developed capacitors exhibited C of 79.5 - 87.5 pF, had D of 0.001% over the frequency ranges of 150 kHz to 50 MHz, had a self-resonant frequency of 65 MHz, and showed results comparable to those measured for the capacitors prepared recently by $Adwel^{Tm}$. The developed capacitors also showed excellent characteristics for thermal shock test and temperature cycling test.

Detection of Fragment Length Polymorphism of the VNTR Loci D1S80 and D2S123 by PCR Amplification, PAGE and Silver Staining

  • Nam, Hyun-Suk;Kim, Eun-Hee;Yoon, Wan-Hee;Lee, Kong-Joo
    • BMB Reports
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    • v.28 no.4
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    • pp.359-362
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    • 1995
  • The highly polymorphic variable number of tandem repeat (VNTR) loci in the human genome are informative markers for the genetic characterization of individuals in the paternity test and forensic science as well as for the study of human disease. In this study, VNTR loci D1S80 and D2S123 have been amplified by PCR and the amplified length polymorphic alleles were detected with a discontinuous vertical PAGE system and silver staining. For explicit DNA typing, PCR optimization, in which amplification efficiencies are similar over a wide range of allele sizes, non-specific amplifications are minimal, and new longer alleles have high amplification efficiency, has been performed by changing the PCR reaction buffer composition and thermal cycling conditions. It turned out that adding an appropriate amount of Tween 20 and NP40 to the PCR reaction buffer and raising the annealing temperature to $68^{\circ}C$ in thermal cycling made it possible for optimal VNTR loci amplification. A modified PAGE system for VNTR separation was established. Under these conditions, new longer alleles in the 01580 locus were discovered and 025123 pattern changes in colorectal tumors were observed. These technical tips are valuable for detecting various amplified fragment length polymorphisms.

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The Improvement of 2nd Level Solder Joint Reliability fur Flip Chip Ball Grid Array (플립 칩 BGA에서 2차 레벨 솔더접합부의 신뢰성 향상)

  • Kim, Kyung-Seob;Lee, Suk;Chang, Eui-Goo
    • Journal of Welding and Joining
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    • v.20 no.2
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    • pp.90-94
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    • 2002
  • FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

Changes in the Mechanical Behavior of Thermal Barrier Coatings Caused by Thermal Shock (열충격에 의한 열차폐 코팅재의 기계적 거동 변화)

  • Jang, Bin;Lee, Kee Sung;Kim, Tae Woo;Kim, Chul
    • Korean Journal of Materials Research
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    • v.27 no.1
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    • pp.25-31
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    • 2017
  • This study investigates changes in the mechanical behaviors, especially hardness and indentation load-displacement curves, of thermal barrier coatings (TBCs) brought about by thermal shock. The TBCs on the Nickel-based bondcoat/superalloy was prepared with diameters of 25.4 mm and $600{\mu}m$ thickness. The results of thermal shock cycling test from $1100^{\circ}C$ of the highest temperature indicate that the thermal shock do not influence on the mechanical behavior, but a continuous decrease in porosity and increase in hardness were observed after 1200 thermal shock cycles; these changes are believed to be due to sintering of thermal barrier coating materials. The results that no degradation in the indentation load-displacement curves indicate that the coating shows good thermal shock resistance up to 1200 cycles at $1100^{\circ}C$ in air.

Effects of Cr Content and Volume Fraction of δ-Ferrite on Thermal Cycling Fatigue Properties of Overlay Welded Heat-Resistant 12%Cr Stainless Steels (내열용 오버레이 12%Cr계 스테인레스강의 열피로 특성에 미치는 Cr 함량과 델타-페라이트의 영향)

  • Jung, J.Y.
    • Transactions of Materials Processing
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    • v.26 no.6
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    • pp.356-364
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    • 2017
  • In this study, submerged arc cladded Fe-Cr-Ni-Mo-CuWNbV-C stainless steels containing various Cr contents between 11.2 wt.% and 16.7 wt.% were prepared with fixed C content at about 0.14 wt.%. Using these alloys, changes in microstructure, tensile property, and thermal fatigue property were investigated. Phase fraction of delta-ferrite was increased gradually with increasing Cr content. However, tensile strength, hardness, and thermal fatigue resistance appeared to be decreased. When the microstructure of delta-ferrite was observed, it was revealed that the mesh structure retained up to about 15% Cr content. Although thermal fatigue resistance was almost the same for Cr contents between 11.0 and 14.5 wt.%, it was significantly decreased at higher Cr contents. This was evident from mean value of crack lengths of 10 largest ones. Evaluation of thermal fatigue resistance on alloys with various Cr contents revealed the following important results. First, the reproducibility of ranking test was excellent regardless of the number of cycles. Second, thermal fatigue resistance was increased in proportion to true tensile fracture strength values of overlay materials. Finally, the number of thermal fatigue cracks per unit length was increased with increasing true tensile fracture strength.

Fabrication of Polymeric Optical Fiber Array (정밀 고분자 광섬유 어레이 제작 연구)

  • Cho, Sang-Uk;Jeong, Myung-Yung;Kim, Chang-Seok;Ahn, Seung-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.5
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    • pp.82-88
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    • 2007
  • This work is to fabricate a precise optical fiber array using polymer composite for optical interconnection. Optical fiber array has to satisfy low optical loss requirement less than 0.4 dB according to temperature change. For this purpose, design criteria for an optical fiber array was derived. The coefficient of thermal expansion of silica particulate epoxy composites was affected by volume fraction of silica particles. And also, elastic modulus of silica particulate epoxy composites was affected by volume fraction of silica particles. To obtain the coefficients of thermal expansion below $10{\times}10E-6/^{\circ}C$ and elastic modulus more than 20 GPa , we chose the volume fraction more than 76%. Using silica particulate epoxy composites with the volume fraction 76%, 8-channel optical fiber array with dimensional tolerances below $1\;{\mu}m$ was manufactured by transfer molding technique using dies with the uniquely-designed core pin and precisely-machined zirconia ceramic V block. These optical fiber arrays showed optical loss variations within 0.4 dB under thermal cycling test and high temperature test.