• The Journal of Advanced Prosthodontics
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• 제16권2호
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• pp.115-125
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• 2024

PURPOSE. The purpose of this in vitro study was to investigate the fracture resistance, surface hardness, and color stain of 3D printed, CAD-CAM milled, and conventional interim materials. MATERIALS AND METHODS. A total of 80 specimens were fabricated from auto polymerizing polymethyl methacrylate (PMMA), bis-acryl composite resin, CAD-CAM polymethyl methacrylate resin (milled), and 3D printed composite resin (printed) (n = 20). Forty of them were crown-shaped, on which fracture strength test was performed (n = 10). The others were disc-shaped specimens (10 mm × 2 mm) and divided into two groups for surface hardness and color stainability tests before and after thermal cycling in coffee solution (n = 10). Color parameters were measured with a spectrophotometer before and after each storage period, and color differences (CIEDE2000 [DE00]) were calculated. The distribution of variables was measured with the Kolmogorov Smirnov test, and one-way analysis of variance (ANOVA), Tukey HSD, Kruskal-Wallis, Mann-Whitney U tests were used in the analysis of quantitative independent data. Paired sample t-test was used in the analysis of dependent quantitative data (P < .05). RESULTS. The highest crown fracture resistance values were determined for the 3D printed composite resin (P < .05), and the lowest were observed in the bis-acryl composite resin (P < .05). Before and after thermal cycling, increase in mean hardness values were observed only in 3D printed composite resin (P < .05) and the highest ΔE₀₀ value were observed in PMMA resin for all materials (P < .05). CONCLUSION. 3D printing and CAD-CAM milled interim materials showed better fracture strength. After the coffee thermal cycle, the highest surface hardness value was again found in 3D printing and CAD-CAM milled interim samples and the color change of the bis-acryl resin-based samples and the additive production technique was higher than the PMMA resin and CAD-CAM milled resin samples.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• 한국세라믹학회지
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• 제33권2호
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• pp.155-162
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• 1996

A Taguchi methodology study of the plasma spraying thermal barrier coating (TBC) layer is presented. The experiment parameters were designed by a L8-style orthogonal arrays approach. A Taguchi analysis was conduc-ted through the results of the coating properties which were affected by plasma spraying parameters. Zirconia (partially stbilized with ytrria: PSZ) was sprayed on TiAl intermetallic compound substrates, The coating layer was characterized by thickness microstructure and porosity using SEM and Image analyzer. The coating quali-ties are discussed with respect to thermal barrier effect thermal cycling test6 and adhesion strength test. An optimum condition of plasma spraying process which are derived from the Taguchi analysis could be found for high quality TBC.

• 한국항공우주학회지
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• 제36권12호
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• pp.1222-1228
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• 2008

㈜쎄트렉아이는 UAE의 EIAST와 함께 2008년 발사를 목표로 SI-200 표준버스시스템을 기반으로 하는 DubaiSat-1 비행모델을 개발하였다. DubaiSat-1 비행모델의 열제어계는 전력 소비의 최소화를 위해 수동 열제어를 기반으로 하되, 주요 부품에는 히터를 이용한 능동 열제어가 이뤄지도록 설계되었다. 또한 열해석 모델을 작성하여 DubaiSat-1의 임무궤도에 대해 열해석을 수행하였으며, 해석 결과를 토대로 모든 구성품이 설계 요구조건을 만족시킬 수 있도록 설계 보정 작업을 진행하였다. 또한 우주환경을 모사한 열진공시험을 수행하여 DubaiSat-1 비행모델의 열제어 성능에 대해 검토하였으며, 시험 결과와 해석 결과의 비교를 통한 열해석 모델의 보정 작업을 완료하였다.

• 전기학회논문지
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• 제57권7호
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• pp.1229-1234
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• 2008

In this work, ultra high-voltage (17 - 50 kV AC), reliable 80 pF mica capacitors for partial discharge system application were investigated. Mica was used as the dielectric of the capacitors. Using the conservative design rule, over 3 individual $50\;{\mu}m$ thick mica sheets with a size of 30mm{\times}35mm were used with lead foils to form a parallel capacitor element and 20 mica sheets were interleaved with lead foils to form a series stack of parallel capacitor element to meet the requirements of the capacitors. The dimensions of the fabricated 80 pF capacitors for 17 kV AC and 50 kV AC were $90\;mm{\times}90\;mm$ and $95\;mm{\times}180\;mm$, respectively. The high-frequency characteristics of the capacitance (C) and dissipation factor (D) of the developed capacitors were measured using a capacitance meter. The developed capacitors exhibited C of 79.5 - 87.5 pF, had D of 0.001% over the frequency ranges of 150 kHz to 50 MHz, had a self-resonant frequency of 65 MHz, and showed results comparable to those measured for the capacitors prepared recently by $Adwel^{Tm}$. The developed capacitors also showed excellent characteristics for thermal shock test and temperature cycling test.

• BMB Reports
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• 제28권4호
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• pp.359-362
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• 1995

The highly polymorphic variable number of tandem repeat (VNTR) loci in the human genome are informative markers for the genetic characterization of individuals in the paternity test and forensic science as well as for the study of human disease. In this study, VNTR loci D1S80 and D2S123 have been amplified by PCR and the amplified length polymorphic alleles were detected with a discontinuous vertical PAGE system and silver staining. For explicit DNA typing, PCR optimization, in which amplification efficiencies are similar over a wide range of allele sizes, non-specific amplifications are minimal, and new longer alleles have high amplification efficiency, has been performed by changing the PCR reaction buffer composition and thermal cycling conditions. It turned out that adding an appropriate amount of Tween 20 and NP40 to the PCR reaction buffer and raising the annealing temperature to $68^{\circ}C$ in thermal cycling made it possible for optimal VNTR loci amplification. A modified PAGE system for VNTR separation was established. Under these conditions, new longer alleles in the 01580 locus were discovered and 025123 pattern changes in colorectal tumors were observed. These technical tips are valuable for detecting various amplified fragment length polymorphisms.

• Journal of Welding and Joining
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• 제20권2호
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• 한국재료학회지
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• 제27권1호
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• pp.25-31
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• 2017

This study investigates changes in the mechanical behaviors, especially hardness and indentation load-displacement curves, of thermal barrier coatings (TBCs) brought about by thermal shock. The TBCs on the Nickel-based bondcoat/superalloy was prepared with diameters of 25.4 mm and $600{\mu}m$ thickness. The results of thermal shock cycling test from $1100^{\circ}C$ of the highest temperature indicate that the thermal shock do not influence on the mechanical behavior, but a continuous decrease in porosity and increase in hardness were observed after 1200 thermal shock cycles; these changes are believed to be due to sintering of thermal barrier coating materials. The results that no degradation in the indentation load-displacement curves indicate that the coating shows good thermal shock resistance up to 1200 cycles at $1100^{\circ}C$ in air.

• 소성∙가공
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• 제26권6호
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• pp.356-364
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• 2017

In this study, submerged arc cladded Fe-Cr-Ni-Mo-CuWNbV-C stainless steels containing various Cr contents between 11.2 wt.% and 16.7 wt.% were prepared with fixed C content at about 0.14 wt.%. Using these alloys, changes in microstructure, tensile property, and thermal fatigue property were investigated. Phase fraction of delta-ferrite was increased gradually with increasing Cr content. However, tensile strength, hardness, and thermal fatigue resistance appeared to be decreased. When the microstructure of delta-ferrite was observed, it was revealed that the mesh structure retained up to about 15% Cr content. Although thermal fatigue resistance was almost the same for Cr contents between 11.0 and 14.5 wt.%, it was significantly decreased at higher Cr contents. This was evident from mean value of crack lengths of 10 largest ones. Evaluation of thermal fatigue resistance on alloys with various Cr contents revealed the following important results. First, the reproducibility of ranking test was excellent regardless of the number of cycles. Second, thermal fatigue resistance was increased in proportion to true tensile fracture strength values of overlay materials. Finally, the number of thermal fatigue cracks per unit length was increased with increasing true tensile fracture strength.

• 한국정밀공학회지
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• 제24권5호
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• pp.82-88
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• 2007

This work is to fabricate a precise optical fiber array using polymer composite for optical interconnection. Optical fiber array has to satisfy low optical loss requirement less than 0.4 dB according to temperature change. For this purpose, design criteria for an optical fiber array was derived. The coefficient of thermal expansion of silica particulate epoxy composites was affected by volume fraction of silica particles. And also, elastic modulus of silica particulate epoxy composites was affected by volume fraction of silica particles. To obtain the coefficients of thermal expansion below $10{\times}10E-6/^{\circ}C$ and elastic modulus more than 20 GPa , we chose the volume fraction more than 76%. Using silica particulate epoxy composites with the volume fraction 76%, 8-channel optical fiber array with dimensional tolerances below $1\;{\mu}m$ was manufactured by transfer molding technique using dies with the uniquely-designed core pin and precisely-machined zirconia ceramic V block. These optical fiber arrays showed optical loss variations within 0.4 dB under thermal cycling test and high temperature test.