• Journal of the Korean Society of Clothing and Textiles
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• v.25 no.2
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• pp.287-292
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• 2001

This study was conducted to investigate preferred clothing selected by females for thermal comfort in follicular phase (FP) and luteal phase (LP) of the menstrual cycle. Eight healthy college students volunteered as subjects. They stayed for 60 minutes at $25^{\circ}C$, 55%RH (stage 1) for baseline followed by a 60 minute stay at 2$0^{\circ}C$, 55%RH (stage 2) in a climatic chamber. Obtained results were analyzed using paired t-test and repeated measures of ANOVA. Arm and hand skin temperatures were maintained higher in FP than in LP, while mean skin temperature did not show any significant difference between FP and LP. The subjects selected additional clothing faster in FP than in LP. Six of the subjects wore heavier clothing in FP than in LP, while two of them wore heavier in LP than in FP.

• Journal of Welding and Joining
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• v.21 no.4
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.10
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• pp.1541-1550
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• 1997

Since the ceramic/metal joint material is made at a high temperature, the residual stress develops when it is cooled from bonding temperature to room temperature due to remarkable difference of thermal expansion coefficient between ceramic and metal. As residual stress at ceramic/metal joints influences the strength of joints, it is important to estimate residual stress quantitatively. In this study, it is attempted to estimate joint residual stress of Si$_3$N$_4$STS304 joints quantitatively and to compare the strength of joints. The difference of residual stress is measured when repeated thermal cycl is loaded, under the conditions of the practical use of the ceramic/metal joint. The residual stress increases at 1 cycle of thermal load but decreases in 3 cycles to 10 cycles of thermal load. And 4-point bending test is performed to examine the influence of residual stress on fracture strength. As a result, it is known that the stress of joint decreases as the number of thermal cycle increases.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.8
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• pp.1141-1148
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• 2008

One of the methods to increase the efficiency of an engine is to expand pressures obtained from combustions equal to the pressure of atmosphere as much as possible and then convert thermal energy into mechanical energy also as much as possible. In this research, the Diesel cycle was thermodynamically interpreted to evaluate the possibility of high efficiency by converting Diesel engines to the Atkinson cycle, and general cycle features were analyzed after comparing these two cycles. In the case of fuel air the Diesel-Atkinson cycle considering intake and exhaust similar to real cycles, the value of thermal efficiency and average effective pressure increased, though their values were smaller than those of standard air amount cycle, when expansion compression ratio increased. When normal Diesel engines of which compression stroke and expansion stroke are all the same, was converted to the Atkinson cycle by changing the time of intake value close, combustion pressure reduced due to reduced expansion compression ratio and intake air amount due to decreased effective cycle volume.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1349-1352
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• 2005

This paper is to investigate a defect for thermal barrier coating layers by acoustic emission method in 4-point bending test. The two-layer thermal barrier coating is composed of $150\mu{m}\;CoNiCrAlY\;bond\;coating\;by\;vacuum\;plasma\;spray(VPS)\;process\;and\;250\mu{m}\;ZrO_2-8wt%Y_2O_3$ ceramic coating layer by air plasma spray(APS) process on Inconel-718. The specimen prepared by cyclic thermal test(500, 1000, 2000cycle) at $1050^{\circ}C$ The AE monitoring system is composed of PICO type sensor, a wide band pre-amplifier(40dB), PC and AE DSP(16/32 PAC) board. The AE event, amplitude, Cumulative energy and count of coating specimens is evaluated according to cyclic thermal test.

• Proceedings of the KSR Conference
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• 2003.10c
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• pp.606-610
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• 2003

The 200 class insulation system which adopted to traction motor have excellent dielectric strength but weaken to thermal stress therefore deterioration phenomena analysis according to thermal stress is necessary. Accelerated thermal aging tests have been used to determine thermal reliability of stator coils used as traction motor in electric multiple unit. The conventional aging test is carried on according to IEC 60034-18-31 and IEEE Std. 275-1992. Variation in insulation resistance, P.I, capacitance, dielectric loss($tan{\delta}$) and partial discharge are measured during the aging cycle. Sample coils for traction motor were tested by accelerated aging test which composed of heat, vibration and moisture. Reliability and expected life were evaluated on the insulation system for traction motor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.11 no.2
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• pp.40-44
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• 2015

The fatigue behavior of thermal butt fusion in safety class III high-density polyethylene (HDPE) buried piping for nuclear power plants was investigated using load-controlled bending fatigue on four-point bend test specimens. Based on the results, the presence of thermal butt fusion beads was confirmed to reduce the fatigue lifetime in the low- and medium-cycle fatigue regions while having a negligible effect in the high-cycle fatigue regions.

• The Transactions of the Korean Institute of Power Electronics
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• v.9 no.3
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• pp.203-212
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• 2004

The heat pipe for cooling power semiconductor is required no performance changing during the life cycle up to 20 years. For the long reliable performance of the heat pipe, my reasons that has possibility to generate non condensable gases we not allowed. In this research, the maximum heat transport rate and operation characteristics that are related to various geometric and thermal conditions are carried out. Also the test items, specifications and methods to guarantee the long life cycle of the heat pipe for power semiconductor cooling device are provided and the tests are performed.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.13 no.2
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• pp.99-112
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• 2015

In this study, laboratory test equipment was designed and installed to evaluate the thermal behavior of bentonite, which is used as a buffer in high-level waste disposal systems. The thermal analysis was conducted to verify the test results using ABAQUS, a finite element analysis code. In view of the seasonal changes seen during the test, the thermal behavior of bentonite with a temperature of outside air was evaluated. Of the cases examined, the results of the analysis model using stainless steel (Case 3) approximates to the test results, showing an error of about 1℃. The results of the thermal analysis into seasonal temperature distributions are consistent with trends seen in lab-test results. These analyses show that the effects of the thermal conductivity of the material surrounding the buffer and outside air temperature, are very important factors in the thermal behavior of bentonite. In the future, it is expected that a moisture saturation test of a bentonite buffer containing a heat source will be carried out. Therefore, the development of a numerical analysis model is required for the prediction and verification of the laboratory test results.