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Performance Test for the Performance Reliability of the Heat Pipe for Cooling Power Semiconductors  

강환국 (㈜대홍기업 기술연구소)
Publication Information
The Transactions of the Korean Institute of Power Electronics / v.9, no.3, 2004 , pp. 203-212 More about this Journal
Abstract
The heat pipe for cooling power semiconductor is required no performance changing during the life cycle up to 20 years. For the long reliable performance of the heat pipe, my reasons that has possibility to generate non condensable gases we not allowed. In this research, the maximum heat transport rate and operation characteristics that are related to various geometric and thermal conditions are carried out. Also the test items, specifications and methods to guarantee the long life cycle of the heat pipe for power semiconductor cooling device are provided and the tests are performed.
Keywords
Heat pipe; Maximum heat transport rate; Thermal resistance; Heat pipe heat sink; Flooding;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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