1 |
Solder Joint Fatigue Life Model
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[
Darveaux,R.
] /
Proc. The Metallugical Society Annual Meeting, Orando
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2 |
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[
T.Chung;G.Haskell
] /
Trends in Microelectronics Packaging and Interconnection
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3 |
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[
John H. Lau
] /
Solder Joint Reliability of BGA. CSP, Flip Chip, and Fine Pitch SMT Assemblies
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4 |
Current Underfills for CSP and BGA
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[
T.Doba
] /
IEEE Int'l Symp on Electronic Materials & Packaging
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5 |
Effect of Strain Rate
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[
Y.Kariya;H.Kagawa;M.Otsuka
] /
Hold Time and Third Element on The Fatigue
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6 |
Underfilled BGAs for ceramic BGA Packages and Board-Level Reliability
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[
T.Burnette;Z.John;T.Koschmieder;W.Oyler
] /
IEEE Electronic Components and Technology Conference
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7 |
Effect of Fiiler of Underfill Encapsulant on Reliability Performance
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[
L.Fan;Z.Zhang;C.P.Wong
] /
IEEE Int'l Symp on Advanced Packaging Materials
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8 |
클래드 다이패드를 이용한 TSOP 솔더접합부의 수명예측 및 품질 향상에 관한 연구
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[
김종민
] /
중앙대학교 석사학위 논문
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