• Proceedings of the KSME Conference
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• 2004.04a
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• pp.210-215
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• 2004

: A DNA analysis system based on fluorescence analysis has to have a DNA amplifying thermal cycle system. DNA amplification is executed by the temperature control. Accuracy of fluorescence analysis is influenced by the temperature control technology. For that reason, the temperature control is core technology in developing the DNA analysis system. Therefore, the objective of this paper is to develop the hardware to apply thermoelectric module to the DNA amplifying thermal cycle system. In order to verify the developed hardware for controlling the temperature of thermoelectric module, a DNA amplifying thermal cycle test was performed. From the test, the developed hardware controlled the temperature of thermoelectric module successfully. Therefore, it is expected that the developed hardware can be applied to the DNA amplifying thermal cycle system.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1312-1314
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• 1998

SOFC system is often subject to thermal cycle condition during normal start/stop, shutdown, and emergence state. Under the thermal cycle condition of heating and cooling, the SOFC components expand or shrink, which produces thermal stress and thermal shock. The SOFC performance is degraded by the thermal factors. To protect SOFC system from the thermal degradation, the optimum thermal condition must be clarified. In this study, to examine the thermal cycle characteristics, we fabricated single cells of planar SOFC with an area of $5{\times}5cm$. The electrolyte and PEN were tested under thermal cycle conditions in the range of$ 2-8^{\circ}C/min$. After thermal cycle test. crack creation of the components were examined using ultraviolet apparatus. No crack in the electrolyte and PEN were observed. The single cell system with alumina frame were also tested under thermal cycle conditions of 2, 3, $4^{\circ}C/min$. The single cell was fractured at the thermal cycle of 3 and $4^{\circ}C/min$ and the optimum condition of the thermal cycle to be found below $2^{\circ}C/min$.

• Journal of Ocean Engineering and Technology
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• v.22 no.6
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• pp.27-34
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• 2008

The temperature distribution in the weldment is not uniform because a weldment is locally heated. Thermal plastic deformation results from the local expansion and shrinkage by the heating and cooling of metal. Therefore, residual stresses and distortion occur in the weldment. In this study, we had conducted on the weld thermal cycle simulation that is supposed as the HAZ on SS400 steel and STS304 steel. The residual stresses that were obtained from the drawing and the weld thermal cycle simulation were estimated by X-ray diffraction. We also carried out ultrasonic test for the weld thermal cycle simulated specimens, and then conducted on nondestructive evaluation by the ultrasonic parameters obtained ultrasonic test. From the results, residual stresses of weld thermal cycle simulated specimens after the residual stress removal heat treatment are lower than that of the drawing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.242-242
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• 2007

To verify the applicability of High Temperature Superconducting (HTS) cable system into the real grid, the HTS cable system with the specification of 22.9 kV, 1250 A, 100 m long was installed in the second quarter of 2006, and the long term field test has been in progress at the KEPCO's Gochang power testing yard. Apart from the conventional power cable, HTS cable system requires sufficient thermo-mechanical strength to endure a large temperature difference. To date, the KEPCO HTS cable system was cooled down and warmed to the room temperature several times to investigate the influence of thermal cycles experimentally. Dielectric properties, critical current dependance and heat losses were evaluated at each step of thermal cycle. The test results showed that thermal cycle did not induce the degradation of dielectric properties, and the critical current decreased to 5 % of the initial value.

• International Journal of Automotive Technology
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• v.5 no.4
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• pp.297-302
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• 2004

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermo-mechanical cyclic loading. As a failure of the exhaust manifold is mainly caused by geometric constraints of the less expanded inlet flange and cylinder head, the analysis is based on the exhaust system model with three-dimensional temperature distribution and temperature dependent material properties. The result show that large compressive plastic deformations are generated at an elevated temperature of the exhaust manifold and tensile stresses are remained in several critical zones at a cold condition. From the repetition of these thermal shock cycles, maximum plastic strain range (0.454%) could be estimated by the stabilized stress-strain hysteresis loops. It is used to predict the low cycle thermal fatigue life of the exhaust manifold for the thermal shock test.

• Journal of Ocean Engineering and Technology
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• v.21 no.5
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• pp.33-38
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• 2007

The welding methods have been applied in the most structural products from multi-field of automobile, ship construction and construction, and so on. The structure steel must have enough strength of structure. In this study, SS400 steel and STS304 steel were used to estimate the corrosion characteristics of the weld thermal cycle simulated HAZ. To evaluate the corrosion characteristics, also, the materials with two conditions were used in 3.5% NaCl. The one is to the drawing with diameter of ${\Phi}10$ and the other is to the residual stress removal treatment. The electrochemical polarization test and immersion test were carried out. From test results, corrosion potential, corrosion current density, weight loss ratio and corrosion rate were measured. In the kinds of SS400 steels, corrosion potential of weld thermal cycle simulated specimens after the heat treatment showed somewhat the direction of noble potential. And in the base metal to be drawing weight loss ratio and corrosion rate occurred higher than the other kinds. In the kinds of STS304 steels, the result of base metal to be drawing was similar to results of SS400 steels, too. Two kinds of $750^{\circ}C$ and $1300^{\circ}C$ of weld thermal cycle simulation after the heat treatment were rather higher than the other kinds in weight loss ratio and corrosion rate.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Journal of the Korean Magnetics Society
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• v.16 no.3
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• pp.182-185
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• 2006

In this work, we have constructed 3-axis flux-gate magnetometer for the attitude control of satellite. The constructed magnetometer shows uncertainty of ${\pm}1%$, noise level of $0.2nT/\sqrt{Hz}$ at 1 Hz under 1W power consumption. Environment test for satellite component, acceleration test and thermal cycle test were carried out. For the acceleration test, magnetometer was vibrated frequency ranging from 10 Hz to 1 kHz at 15 g (g : gravitational acceleration at earth), and for thermal cycle test, 4 times of thermal cycle were carried out temperature ranging from $-55^{\circ}C\;to\;+80^{\circ}C$ under vacuum of $1x10^{-6}Torr$.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.45-50
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• 2014

Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

• Journal of Mechanical Science and Technology
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• v.20 no.1
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• pp.59-65
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• 2006

A half-scaled large test model for the main components of the real annular structure was built and the thermal behaviors were experimented and obtained by thermal cyclic loads. The model design and the test conditions for the thermal loads were determined to take into consideration the thermal and mechanical loads acting on the real annular structure by finite element analyses. Temperature profiles and strains of the main components of the model were measured at an early stage of the test and periodically throughout the test in the given test conditions. After completion of the thermal cyclic tests, no evidence of crack initiation and propagation were identified by a dye penetration test. The measured strains at the critical parts were slightly increased proportionally with the increase in the number of the thermal cycles.