• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.210-215
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• 2004

: A DNA analysis system based on fluorescence analysis has to have a DNA amplifying thermal cycle system. DNA amplification is executed by the temperature control. Accuracy of fluorescence analysis is influenced by the temperature control technology. For that reason, the temperature control is core technology in developing the DNA analysis system. Therefore, the objective of this paper is to develop the hardware to apply thermoelectric module to the DNA amplifying thermal cycle system. In order to verify the developed hardware for controlling the temperature of thermoelectric module, a DNA amplifying thermal cycle test was performed. From the test, the developed hardware controlled the temperature of thermoelectric module successfully. Therefore, it is expected that the developed hardware can be applied to the DNA amplifying thermal cycle system.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1312-1314
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• 1998

SOFC system is often subject to thermal cycle condition during normal start/stop, shutdown, and emergence state. Under the thermal cycle condition of heating and cooling, the SOFC components expand or shrink, which produces thermal stress and thermal shock. The SOFC performance is degraded by the thermal factors. To protect SOFC system from the thermal degradation, the optimum thermal condition must be clarified. In this study, to examine the thermal cycle characteristics, we fabricated single cells of planar SOFC with an area of $5{\times}5cm$. The electrolyte and PEN were tested under thermal cycle conditions in the range of$ 2-8^{\circ}C/min$. After thermal cycle test. crack creation of the components were examined using ultraviolet apparatus. No crack in the electrolyte and PEN were observed. The single cell system with alumina frame were also tested under thermal cycle conditions of 2, 3, $4^{\circ}C/min$. The single cell was fractured at the thermal cycle of 3 and $4^{\circ}C/min$ and the optimum condition of the thermal cycle to be found below $2^{\circ}C/min$.

• 한국해양공학회지
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• 제22권6호
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• pp.27-34
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• 2008

The temperature distribution in the weldment is not uniform because a weldment is locally heated. Thermal plastic deformation results from the local expansion and shrinkage by the heating and cooling of metal. Therefore, residual stresses and distortion occur in the weldment. In this study, we had conducted on the weld thermal cycle simulation that is supposed as the HAZ on SS400 steel and STS304 steel. The residual stresses that were obtained from the drawing and the weld thermal cycle simulation were estimated by X-ray diffraction. We also carried out ultrasonic test for the weld thermal cycle simulated specimens, and then conducted on nondestructive evaluation by the ultrasonic parameters obtained ultrasonic test. From the results, residual stresses of weld thermal cycle simulated specimens after the residual stress removal heat treatment are lower than that of the drawing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.242-242
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• 2007

To verify the applicability of High Temperature Superconducting (HTS) cable system into the real grid, the HTS cable system with the specification of 22.9 kV, 1250 A, 100 m long was installed in the second quarter of 2006, and the long term field test has been in progress at the KEPCO's Gochang power testing yard. Apart from the conventional power cable, HTS cable system requires sufficient thermo-mechanical strength to endure a large temperature difference. To date, the KEPCO HTS cable system was cooled down and warmed to the room temperature several times to investigate the influence of thermal cycles experimentally. Dielectric properties, critical current dependance and heat losses were evaluated at each step of thermal cycle. The test results showed that thermal cycle did not induce the degradation of dielectric properties, and the critical current decreased to 5 % of the initial value.

• International Journal of Automotive Technology
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• 제5권4호
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• pp.297-302
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• 2004

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermo-mechanical cyclic loading. As a failure of the exhaust manifold is mainly caused by geometric constraints of the less expanded inlet flange and cylinder head, the analysis is based on the exhaust system model with three-dimensional temperature distribution and temperature dependent material properties. The result show that large compressive plastic deformations are generated at an elevated temperature of the exhaust manifold and tensile stresses are remained in several critical zones at a cold condition. From the repetition of these thermal shock cycles, maximum plastic strain range (0.454%) could be estimated by the stabilized stress-strain hysteresis loops. It is used to predict the low cycle thermal fatigue life of the exhaust manifold for the thermal shock test.

• 한국해양공학회지
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• 제21권5호
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• pp.33-38
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• 2007

The welding methods have been applied in the most structural products from multi-field of automobile, ship construction and construction, and so on. The structure steel must have enough strength of structure. In this study, SS400 steel and STS304 steel were used to estimate the corrosion characteristics of the weld thermal cycle simulated HAZ. To evaluate the corrosion characteristics, also, the materials with two conditions were used in 3.5% NaCl. The one is to the drawing with diameter of ${\Phi}10$ and the other is to the residual stress removal treatment. The electrochemical polarization test and immersion test were carried out. From test results, corrosion potential, corrosion current density, weight loss ratio and corrosion rate were measured. In the kinds of SS400 steels, corrosion potential of weld thermal cycle simulated specimens after the heat treatment showed somewhat the direction of noble potential. And in the base metal to be drawing weight loss ratio and corrosion rate occurred higher than the other kinds. In the kinds of STS304 steels, the result of base metal to be drawing was similar to results of SS400 steels, too. Two kinds of $750^{\circ}C$ and $1300^{\circ}C$ of weld thermal cycle simulation after the heat treatment were rather higher than the other kinds in weight loss ratio and corrosion rate.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• 한국자기학회지
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• 제16권3호
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• pp.182-185
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• 2006

본 연구에서는 인공위성의 자세제어용으로 사용될 3-축 flux-gate 마그네토 미터를 개발 제작하였다. 제작된 3-축의 flux-gate 마그네토 미터는 소비전력이 1W 미만에서 정확도는 ${\pm}1%$ 이내였으며 noise는 1Hz에서 $0.2nT/\sqrt{Hz}$이였다. 또한 제작된 마그네토미터를 인공위성에 적용하기 위한 환경시험을 수행하였다. 환경시험으로 가속도시험은 진동주파수의 범위가 $10Hz{\sim}1000Hz$에서 15g(g : 지구의 중력가속도)의 가속도에서 수행하였고, themal cycle 시험은 $1x10^{-6}$ Torr의 진공에서 $-55^{\circ}C{\sim}80^{\circ}C$의 온도 사이에서 24시간 동안 4회의 thermal cycle 시험을 한 결과 모두 정상 작동 되었다.

• 마이크로전자및패키징학회지
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• 제21권1호
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• pp.45-50
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• 2014

반도체 미세구리배선 적용을 위하여 구리배선의 습식 표면처리 및 열 사이클에 따른 구리 박막과 실리콘질화막 도포층 사이의 계면접착에너지를 4점굽힘시험을 통해 정량적으로 평가하였다. 구리배선을 화학적 기계적 연마한 후 습식 표면처리를 통하여 구리 박막과 실리콘질화막의 계면접착에너지는 $10.57J/m^2$에서 $14.87J/m^2$로 증가하였다. $-45{\sim}175^{\circ}C$범위에서 250사이클 후, 표면처리를 하지 않은 시편의 계면접착에너지는 $5.64J/m^2$으로, 표면처리를 한 시편은 $7.34J/m^2$으로 감소하였으며, 모든 시편의 박리계면은 구리 박막과 실리콘질화막 계면으로 확인되었다. X-선 광전자 분광법으로 계면 결합 상태를 분석한 결과, 화학적 기계적 연마 공정 후 구리배선의 표면 산화물이 습식표면처리에 의해 효과적으로 제거된 것을 확인하였다. 또한, 열 사이클 처리동안, 구리 박막과 실리콘질화막의 큰 열 팽창 계수 차이로 인한 열응력으로 인하여 구리 박막과 실리콘질화막 계면이 취약해지고, 계면을 통한 산소유입에 따른 구리 산화층이 증가하여 계면접착에너지가 저하된 것으로 판단된다.

• Journal of Mechanical Science and Technology
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• 제20권1호
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• pp.59-65
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• 2006

A half-scaled large test model for the main components of the real annular structure was built and the thermal behaviors were experimented and obtained by thermal cyclic loads. The model design and the test conditions for the thermal loads were determined to take into consideration the thermal and mechanical loads acting on the real annular structure by finite element analyses. Temperature profiles and strains of the main components of the model were measured at an early stage of the test and periodically throughout the test in the given test conditions. After completion of the thermal cyclic tests, no evidence of crack initiation and propagation were identified by a dye penetration test. The measured strains at the critical parts were slightly increased proportionally with the increase in the number of the thermal cycles.