• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.10
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• pp.667-673
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• 2017

We investigated the temperature uniformity in an anode-supported solid oxide fuel cell, using the open source computational fluid dynamics (CFD) toolbox, OpenFOAM. Numerical simulation was performed in three different flow paths, i.e., co-flow, counter-flow, and cross-flow paths. Gas flow in a porous electrode was calculated using effective diffusivity while considering the effect of interconnect rib. A lumped internal resistance model derived from a semi-empirical correlation was implemented for the calculation of electrochemical reaction. The result showed that the counter-flow path displayed the most uniform temperature distribution.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.9
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• pp.831-835
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• 2000

The uniformity of themperature on a wafer is a wafer is one the most important parameters to conterol the RTF(Rapid Thermal Process) with proper input signals. It is impossible to achieve the uniformity of temperature without the exact estimation of temperature ar all points on the wafer. There fore, it is difficult to understand the internal dynamics as well as the structural complexities of the RTP, which is aprimary obstacle to measure the distributed temperatures on the wafer accurately. Furthermore, it is also hard to accomplish desirable estimation because only a few pyrometers are available in the general equipments. In the paper, a thermal model based on the chamber grometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through simulation and experiments. The proposed work can be utilized to building a run-by -run or a real-time control of the RTP.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.2
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• pp.91-95
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• 2000

The effects of argon gas flow on the axial temperature gradient near the interface, the oxygen concentration, and the radial oxygen uniformity was investigated for 8-inch CZ silicon growth. As argon flow rate was increased, the temperature gradient was increased in the crystal near the crystavmelt interface and the oxygen content in the crystal was decreased. But the radial oxygen uniformity was deteriorated. It was found that argon flow is one of the important growing parameters to affect the quality of crystals such as oxygen content and uniformity.

• Transactions of the Korean Society of Automotive Engineers
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• v.8 no.3
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• pp.46-55
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• 2000

Four types of different flow inlet models were tested to improve the flow uniformity at the inlet of the radiator and to prevent thermal damages of auxiliary units from the hot air in the bus engine room. Measurements and numerical calculations were performed and their results were in a good agreement with each other. Simultaneously temperature measurements were carried out under the conditions of actual bus driving. As designing the new flow inlet at the partition board which seperates the engine space and radiator space, flow circulation can be achieved and fresh air comes into the engine room from the bottom. It was proved that new inlet makes the one air temperature cooling down in the engine room, the other uniformity improvement.

• Journal of the Korean institute of surface engineering
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• v.46 no.6
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• pp.283-289
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• 2013

The experimental study for the temperature uniformity on the wafer using liquid-vapor phase heat transfer mechanism is performed. For the experiment, the heater plate which is consist of stainless steel container, working fluid and electrical heater is designed, manufactured and tested at the range of 600 to $850^{\circ}C$. The results showed that the phase change type heater plate was much more uniform and stable temperature on the heater plate surface and wafer than the uniform heat flux type heater plate at the atmospheric condition. Also, the results of 300 mm outer diameter of heater plate showed that the same temperature uniformity compared with 230 mm.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.311-318
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• 2001

A three-dimensional numerical analysis of the flow and heat transfer characteristic of wood-flour-filled polypropylene melt in an extrusion die was carried out Used for this analysis were Finite Concept Method based on FVM, unstructured grid and non-Newtonian fluid viscosity model. Temperature and flow fields are closely coupled through temperature dependent viscosity and viscous dissipation. With large Peclet, Nahme, Brinkman numbers, viscous heating caused high temperature belt near die housing, Changing taper plate thickness and examining some predefined parameters at die exit investigated the effect of taper plate on velocity and temperature uniformities. In the presence of taper plate, uniformity at die exit could be improved and there existed an optimum thickness to maximize it.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.278-283
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• 2003

Analysis has been carried out to investigate the temperature variation and the uniformity of the temperature distribution of the glass panel by infrared radiant heating. Halogen lamps are used to heat the panel and located near the top and bottom of the rectangular chamber. The thermal energy is transfered only by radiation and the radiation exchange occurs only on the solid surfaces and is considered by using the view factor. The results show that the uniformity of the temperature distribution of the panel is improved but the time for heating increases as the wall reflectivity is large. The temperature difference reaches a maximum in the early stage of the heating process and then decreases until it reaches the uniform steady-state value.

• Journal of the Korean Society for Heat Treatment
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• v.21 no.6
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• pp.300-306
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• 2008

Solid state diffusion brazing of aluminum castings (AC4C) and wrought alloys (Al6061) was conducted in order to improve thermal conductivity and temperature uniformity of the aluminum heater which was generally fabricated by casting method. Tensile strength and thermal conductivity are raised with increasing brazing temperature, obtaining 122.5 MPa and $206W/m{\cdot}K$ at $540^{\circ}C$ 5hrs brazing conditions, respectively. The diffusion brazed heater, shows maximum temperature difference of $4^{\circ}C$, exhibits a enhanced temperature uniformity compared with the cast heater having the maximum temperature difference of $11^{\circ}C$.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.72-77
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• 2016

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.85-89
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• 2018

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials and inner coolant path on the chuck surface. Finally this study suggests the best cooling condition of electrostatic chuck.