• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1999.06a
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• pp.220-224
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• 1999

Sliding wear test was employed to determine the effect of whisker content and orientation on the firiction and wear behavior of SiC whisker reinforced alumina. Composites containing unidirectionally oriented whiskers were prepared by a modified tape casting followed by lamination, binder removal and hot pressing in order to align the whiskers in the tape casting direction. Wear coefficients on three directions were measured; parallel and normal to the tape casting direction on the tape casting surface and normal to lamination direction on surfnce normal to the tape casting direction. In the effect of whisker orientation, the highest wear rate was obtained in the direction parallel tape casting direction and the lowest in the direction normal to lamination direction at all temperatures. Silicon oxide layer amoothing the surface was detected by energy dispersive X-ray analysis on the worn surface.

• Journal of the Korean Ceramic Society
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• v.31 no.6
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• pp.595-600
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• 1994

Ni0.3Zn0.7Fe2O4 ferrite specimens were fabricated by dry pressing and tape casting method. The properties of each specimen were measured and compared. In order to design and manufacture the chip devices effectively, one important criterion can be that the sintered density of the laminated body should approach close to that of the dry pressed body which is regarded as standard. This requirement could be satisfied by controlling the solid loading of the ferrite sheet, lamination temperature and pressure. Using the optimum conditions (solid loading 55 wt%, lamination temperature 6$0^{\circ}C$, lamination pressure 400 kg/$\textrm{cm}^2$, sintered at 125$0^{\circ}C$ 2h) a sintered ferrite, with the density of 5.18g/㎤ and permeability of 1390 at 0.5 MHz, were obtained.

• Proceedings of the KIEE Conference
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• 1999.11b
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• pp.446-449
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• 1999

본 연구에서는 기존의 자성 웨지의 제조공정을 대체하여 제조 공정이 단순하고, 그의 정밀성이 우수한 tape casting-lamination법에 의한 자성 웨지의 제조 공정의 적용 가능성에 대한 연구를 수행하였다. 철 분말과 에폭시 slurry는 우수한 tape casting 특성을 보여주었으며, 이렇게 얻어진 green tape과 유리 섬유를 적층하여 자성 웨지를 얻었다. 이러한 과정을 거쳐서 얻어진 제품의 품질 특성을 평가한 결과, 기존의 제조 공정으로 얻어진 제품에 비하여 품질의 균일성이 우수하며, 제조 공정을 혁신적으로 단축하는 것이 가능한 것을 보여주고 있다.

• Progress in Superconductivity and Cryogenics
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• v.18 no.3
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• pp.6-9
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• 2016

The enhancement of mechanical properties of coated conductor (CC) tapes in practical application are usually achieved by reinforcing through lamination or electroplating metal layers on either sides of the CC tape. Mechanical or electromechanical properties of the CC tapes have been largely affected by the lamination structure under various loading modes such as tension, bending or even cyclic. In this study, the influence of brass laminate volume fraction on electromechanical properties of RCE-DR processed Gadolinium-barium-copper-oxide (GdBCO) CC tapes was investigated. The samples used were composed of single-side and both-side laminate of brass layer to the Cu-stabilized CC tape and their $I_c$ behaviors were compared to those of the Cu-stabilized CC tape without external lamination. The stress/strain dependences of $I_c$ in laminated CC tapes under uniaxial tension were analyzed and the irreversible stress/strain limits were determined. As a result, the increase of brass laminate volume fraction initially increased the irreversible strain limit and became gradual. The corresponding irreversible stress limit, however, showed no difference even though the brass laminate volume fraction increased to 3.4. But the irreversible load limit linearly increased with the brass laminate volume fraction.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

• Progress in Superconductivity and Cryogenics
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• v.12 no.2
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• pp.9-12
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• 2010

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1112-1117
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• 2006

The properties of LTCC green tape with addition of binder were investigated in order to understand an effects of binder on multilayer processing. A green sheet form was fabricated through tape casting method with the MLS-22 powder. The lamination density increased with increasing amount of binder and lamination pressure. With increasing amount of binder, the elongation of ceramic sheets increased but the tensile stress and air-permeability decreased. The addition of excessive binder is caused defects in the green sheet during via hole punching. The optimum condition of the via hole without defects was observed from amount of the binder 10 wt%.

• Journal of the Korean Ceramic Society
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• v.44 no.1 s.296
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• pp.58-64
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• 2007

In this study, we investigated $Li_2ZrO_3$ membrane as a candidate material for high-temperature $CO_2$ separation and evaluated mechanical property. $Li_2ZrO_3$ powder was synthesized by solid state reaction of $Li_2CO_3\;and\;ZrO_2$. Then we fabricated $Li_2ZrO_3$ tape using tape casting method. Dense $Li_2ZrO_3$ membrane prepared by sintering at $1600^{\circ}C$ for 2 h after pressing $Li_2ZrO_3$ tape using lamination machine. Mechanical properties before and after $CO_2$ absorption of fabricated $Li_2ZrO_3$ membrane such as Hertzian indentation, Victors hardness and 3-point bending testing were evaluated.

• Journal of the Korean Ceramic Society
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• v.33 no.11
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• pp.1267-1275
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• 1996

Green sheet was prepared by tape casting in the composition of (1-x)Pb(Mg1/3Nb2/3)O3-PbTiO3 system using Pb(Mg1/3Nb2/3)O3 and PbTiO3 synthesized with PbO, Nb2O5 MgO and TiO2 The densest green sheet was obtained in the weight ratio 70:30 of powder to binder. Green sheet wasmultilayered in metal mould and formed into lamination at 7$0^{\circ}C$, 300kg/cm2 The lamination was sintered at 110$0^{\circ}C$ 2hr, Dielectric constant and Curie temperature of disc type sintered body was highered with increasing the amount of PbTiO3 and was in the range of 19000-21000, -7~45$^{\circ}C$ respectively. Green and sintered relative density of lamination was 61% and 95% respectively.

• Progress in Superconductivity and Cryogenics
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• v.9 no.3
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• pp.9-12
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• 2007

In this study. we searched for the mechanical and electrical properties of laminated coated conductors with stabilizer tape. Stabilizer tape plays a role for mechanical and electrical stability and environmental protection. Cu material stabilizer was laminated to Ag capping layer on SmBCO conductor layer. This architecture allows the wire to meet operational requirements including the stressless at cryogenic temperature and winding tension as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. First, we have experimentally studied mechanical bonding properties of the laminated Cu stabilizers on SmBCO coated conductors. We have laminated SmBCO coated conductors by continuous dipping soldering process, Second, we have investigated electrical properties of the SmBCO coated conductors with stabilizer lamination. We evaluated bonding properties, peeling strength and critical current for laminated SmBCO coated conductors with Cu stabilizers.