• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.6 s.261
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• pp.659-664
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• 2007

$Moire\'{e}$ interferometry is a useful technique to assess the reliability of electronic package because $Moire\'{e}$ interferometry can measure the whole-field and real-time deformations. The shear strain of a small crack site is important to the reliability assessment of electronic package. The optical limitation of $Moire\'{e}$ interferometry makes ambiguous the shear strain of a small area. An atomic force microscope (AFM) is used to measure the profile of a micro site. High resolution of AFM can apply to the $Moire\'{e}$ technique. AFM $Moire\'{e}$ technique is useful to measure the shear strain of a small area. In this research, the method to accurately measure the deformation of a small area by using AFM $Moire\'{e}$ is proposed. A phase-shifting method is applied to improve the resolution of AFM $Moire\'{e}$.

• The KIPS Transactions:PartB
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• v.9B no.2
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• pp.245-254
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• 2002

IC package marking inspection system using machine vision locates and identifies the target elements from input image, and decides the quality of marking by comparing the extracted target elements with the standard patterns. This paper proposes an adaptive multi-level thresholding (AMLT) method which is suitable for a series of operations such as locating the target IC package, extracting the characters, and detecting the Pinl dimple. It also proposes a dynamic matching unit selection (DMUS) method which is robust to noises as well as effective to catch out the local marking errors. The main idea of the AMLT method is to restrict the inputs of Otsu's thresholding algorithm within a specified area and a partial range of gray values. Doing so, it can adapt to the specific domain. The DMUS method dynamically selects the matching unit according to the result of character extraction and layout analysis. Therefore, in spite of the various erroneous situation occurred in the process of character extraction and layout analysis, it can select minimal matching unit in any environment. In an experiment with 280 IC package images of eight types, the correct extracting rate of IC package and Pinl dimple was 100% and the correct decision rate of marking quality was 98.8%. This result shows that the proposed methods are effective to IC package marking inspection.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.1
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• pp.85-93
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• 2022

This paper contains the design and implementation results of a package tour management application using a Geofence technology as well as the performance evaluation. This application ables the tour guide to monitor the tourist movement in real-time whether the tourists are inside the virtual polygonal Geofence set by the tour guide. Even when the tour is moving between travel destinations, a virtual circular Geofence can be set by the tour guide to monitoring the tourist movement while on the move. The application includes tour guide's and tourist's locations, schedule and participant management. To evaluate the performance, average response time and accuracy is measured, resulting in satisfactory performance. The average response time ranged from 0.0047 seconds to 7.3 seconds in various cases and for accuracy, it scored 100% in various cases. It is expected that implementing Geofence technology to package tour management applications will help tour guides to perform more productive package tours by reducing the burden of managing tourists.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.8-13
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• 2006

Recent RF SAW filters are made using a HTCC package with a CSP(chip scale Package) technology. This paper describes a development of a new $1.4{\times}1.1\;and\;2.0{\times}1.4mm$ RF SAW liters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.

• Journal of the Korean Data and Information Science Society
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• v.17 no.2
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• pp.395-400
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• 2006

For lab statistics the statistical package SAS is usually used in PC environment. But most Universities in Korea have bought 'Academic Initiative Package chair licence', which allows to install SAS to student lab PCs only. Most students are hardly able to afford to purchase a licence for use of SAS in their PCs at home or other places than school. It would be very convenient to have a web-based SAS system, physically located inside a campus, which university students can use through internet. In this paper we report the web-based SAS system implemented for the lab purpose of Yeungnam University using SAS/Intrnet module. We overcome some Server-Client environmental difficulties not allowing use of the SAS command 'infile' by implementing modules with PHP language. In the system, users can see and execute some basic SAS sample codes by clicking buttons, which makes students feel comfy in SAS programming.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• Archives of design research
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• v.20
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• pp.219-229
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• 1997

Today seafoods, such as fisheries and clams, have become an important part of our diet. But processing and storing these perishable seafoods for a long period of time present a serious problem. Only a few years ago, the seafood consumption was minimal. However, an improvement in our diet has enabled us to enjoy seafoods more often than before. Moreover, the recent trend toward the concentration of the popuration to the metropolitan area and the improvement in the standards of living have accelerated a change in our food consumption pattern-preference for the convenient foods over time consuming cooking. Judging from these changes, we can easily predict that the demand for the covenient, dried seafoods will rise sharply in the coming days. The development for an innovative and attractive way to package and market these products are on the way. Research and development of the distribution channel and package design of the dried seafoods will offer a wide array of opportunities to increase the sales volume of the dried seafoods. In addition, by associating the image of Pusan, as a prime oceanic city, with the dried seafoods on the package will certainly draw the attention of many prospective consumers. Consequently it will make the dried seafoods special products of Pusan, and eventually contribute to the prosperity of the city.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.139-144
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• 2009

The generation of small hydropower as compared to other different developed environmental methods produces one of the clean energies. In such manner, various application system development through IT technique is being developed for an advanced small hydropower energy resources data mining. However, existing data analysis of New & Renewable Information System for small hydropower resources application is incomplete therefore it limits expressing these information on the Web. Thus for positive usage of small hydropower resources, a more systematic and precise analysis system should be built. This study seeks to develop a map of the domestic small hydropower resources problems to further improve small hydropower resources, developed through Package Tool which can accurately evaluate a wide range of small hydropower basin in a short period of time. Small hydropower Package Tool was calculated using existing Analysis System small hydropower resources which did not provide diverse capabilities resulting to 840 standard basin classified by A and facility capacity, etc., and to assume a 40% annual capacity, expected annual electricity production was calculated. Small hydropower for the national water system of small hydropower resources potential calculated in terms of resources for the development of small hydropower will be utilized as basic data.