Browse > Article

Development of the RF SAW filters based on PCB substrate  

Lee, Young-Jin (Korea Institute of Ceramic Eng., & Tech)
Im, Jong-In (Korea Institute of Ceramic Eng., & Tech)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.43, no.11, 2006 , pp. 8-13 More about this Journal
Abstract
Recent RF SAW filters are made using a HTCC package with a CSP(chip scale Package) technology. This paper describes a development of a new $1.4{\times}1.1\;and\;2.0{\times}1.4mm$ RF SAW liters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.
Keywords
PCB; Surface Acoustic Wave; SAW; Chip Scale Package; CSP;
Citations & Related Records
연도 인용수 순위
  • Reference
1 R. E. Jones, C. Ramiah, T. Kamgaing, S. K. Banerjee, C. Tsai, H. G. Hughes, A. P. De Silva, J. Drye, L. Li, W. Blood, Q. Li, C. R. Vaughan, R. Miglore, D. Penunuri, R. Lucero, D. R. Frear, and M. F. Miller, 'System-in-a-Package Integration of SAW RF Rx Filter Stacked on a Transceiver Chip', IEEE trans. on Advanced Packaging, Vol. 28, No.2, pp. 310-319, 2005   DOI   ScienceOn
2 S. Yoshimoto, Y. Yamamoto, Y. Takahashi and E. Otsuka, 'Multi-Band RF SAW Filter for Mobile Phone using Surface Mount Plastic Package', IEEE Ultras. Symp. Proc., pp. 113-118, 2002
3 P. Selmeier, R. Grunwald, A. Przadka, H. Kruger, G. Feiertag and C. Ruppel, 'Recent and Advances in SAW Packaging', IEEE Ultras. Symp. Proc., pp. 283-292, 2001   DOI
4 M. Goetz and C. Jones, 'Chip Scale Packaging Technology for RF SAW Devices', IEEE Semi Tech / IEMT Symp. pp. 63-66, 2002   DOI
5 M. L. Ha, J. S. Lee and Y. S. Kwon, 'Chip Scale Package for SAW Filter on the Oxidized Porous Silicon using Flip-chip Bonding and Cu Plated Metal Wall', IEEE Electronic Components and Technology Conference, pp. 372-377, 2002   DOI
6 M. Kosho, M. Kawase, Y. Kuroda, N. Mishima, T. Takagi, K. Salanada, Y. Ebata and S. Kimura, 'Small-sized Dual-band SAW Filters using Flip-chip Bonding Technology', IEEE Ultras. Symp. Proc., pp. 341-342, 1999   DOI