Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
권호 표지
DOI QR코드

DOI QR Code

Measurement of Deformations in Micro-Area Using High Resolution AFM Scanning Moiré Technique

고분해능 원자 현미경 스캐닝 무아레 기법을 이용한 미소 영역의 변형량 측정

  • 박진형 (한국과학기술원 기계공학과) ;
  • 이순복 (한국과학기술원 기계공학과)
  • Published : 2007.06.01
Download PDF
⟨ Previous Next ⟩

Abstract

$Moire\'{e}$ interferometry is a useful technique to assess the reliability of electronic package because $Moire\'{e}$ interferometry can measure the whole-field and real-time deformations. The shear strain of a small crack site is important to the reliability assessment of electronic package. The optical limitation of $Moire\'{e}$ interferometry makes ambiguous the shear strain of a small area. An atomic force microscope (AFM) is used to measure the profile of a micro site. High resolution of AFM can apply to the $Moire\'{e}$ technique. AFM $Moire\'{e}$ technique is useful to measure the shear strain of a small area. In this research, the method to accurately measure the deformation of a small area by using AFM $Moire\'{e}$ is proposed. A phase-shifting method is applied to improve the resolution of AFM $Moire\'{e}$.

Keywords

References

  1. Park, Jin-Hyoung, and Lee Soon-Bok, 'Evaluation of Thermal Deformation Behavior in Electronic Package Using UV Moire Interferometry,' 2005 Electronic Materials and Packaging, Proceedings of the 7th International Symposium, pp. 209-214
  2. Zhong, Z. W. and Lu, Y. G., 2004, 'An AFM Scanning Moiré Technique for the Inspection of Surface Deformations,' Int J Adv Manuf Technol, Vol. 23, pp. 462-466 https://doi.org/10.1007/s00170-003-1770-3
  3. Xie, H., Asundi, A., Boay, C. G., Yunguang, L., Yu, J., Zhaowei, Z. and Ngoi, K. A., 2002, 'High Resolution AFM Scanning Moiree Method and Its Application to the Micro-Deformation in the BGA Electronic Package,' Microelectronics Reliabilitl, Vol. 42, pp. 1219-1227 https://doi.org/10.1016/S0026-2714(02)00084-7
  4. Daniel, Post, Bongtae, Han and Peter, Ifju, 1994, 'High Sensitivity Moire,' Spring-Verlag, NY, pp. 50-53
  5. Oh, Kihwan, and Joo, Jinwon, 2004, 'Submicro- Displacement Measuring System with Moire Interferometer and Application to the Thermal Deformation of PBGA Package,' Trans. of the KSME(A), Vol. 28, No. 11, pp. 1646-1655 https://doi.org/10.3795/KSME-A.2004.28.11.1646
  6. Yang, Se Young, Lee, Soon-Bok, Kwon, Woon- Seong, and Paik, Kyung-Wook, 2002, 'Analytical Approach to Evaluate Shear Stress in Flip Chip Interconnection Using NCA/ACF,' 2002 Electronic Materials and Packaging, Proceedings of the 4th International Symposium, pp. 204-209
  7. Yang, Se Young, Kwon, Woon-Seong, Lee, Soon- Bok, and Paik, Kyoung-Wook, 2005, 'Chip Warpage Damage Model for ACA/NCA Flim Type Electonic Packages,' Key Engineering Materials, Vol. 297-300, pp. 887-892

Cited by

  1. In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moiré Method With a Pseudo-Phase-Shifting Technique vol.2, pp.12, 2012, https://doi.org/10.1109/TCPMT.2012.2209426