1 |
Park, Jin-Hyoung, and Lee Soon-Bok, 'Evaluation of Thermal Deformation Behavior in Electronic Package Using UV Moire Interferometry,' 2005 Electronic Materials and Packaging, Proceedings of the 7th International Symposium, pp. 209-214
|
2 |
Xie, H., Asundi, A., Boay, C. G., Yunguang, L., Yu, J., Zhaowei, Z. and Ngoi, K. A., 2002, 'High Resolution AFM Scanning Moiree Method and Its Application to the Micro-Deformation in the BGA Electronic Package,' Microelectronics Reliabilitl, Vol. 42, pp. 1219-1227
DOI
ScienceOn
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3 |
Daniel, Post, Bongtae, Han and Peter, Ifju, 1994, 'High Sensitivity Moire,' Spring-Verlag, NY, pp. 50-53
|
4 |
Yang, Se Young, Lee, Soon-Bok, Kwon, Woon- Seong, and Paik, Kyung-Wook, 2002, 'Analytical Approach to Evaluate Shear Stress in Flip Chip Interconnection Using NCA/ACF,' 2002 Electronic Materials and Packaging, Proceedings of the 4th International Symposium, pp. 204-209
|
5 |
Yang, Se Young, Kwon, Woon-Seong, Lee, Soon- Bok, and Paik, Kyoung-Wook, 2005, 'Chip Warpage Damage Model for ACA/NCA Flim Type Electonic Packages,' Key Engineering Materials, Vol. 297-300, pp. 887-892
|
6 |
Zhong, Z. W. and Lu, Y. G., 2004, 'An AFM Scanning Moiré Technique for the Inspection of Surface Deformations,' Int J Adv Manuf Technol, Vol. 23, pp. 462-466
DOI
|
7 |
Oh, Kihwan, and Joo, Jinwon, 2004, 'Submicro- Displacement Measuring System with Moire Interferometer and Application to the Thermal Deformation of PBGA Package,' Trans. of the KSME(A), Vol. 28, No. 11, pp. 1646-1655
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DOI
ScienceOn
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