• Journal of the Korean Electrochemical Society
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• v.11 no.4
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• pp.304-308
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• 2008

Noble Poly (lithium 2-acrylamido-2-methyl propane sulfonate) and its copolymer with N-vinyl formamide based on trihexyl (tetradecyl) phosphonium acetate [$(C_6H_{13})_3$ P ($C_{14}H_{29}$) $CH_3COO$; $P_{66614}$ $CH_3COO$] and trihexyl (tetradecyl)phosphonium bis(trifluoromethane sulfonyl) amide ([$(C_6H_{13})_3P(C_{14}H_{29})$] [TFSA];$P_{66614}TFSA$) were prepared and analyzed to determine their characteristics and properties. The ionic conductivity of a copolymer based $P_{66614}TFSA$ ionic liquid system exhibits a higher conductivity ($8.9{\times}10^{-5}Scm^{-1}$) than that of a copolymer based $P_{66614}CH_3COO$ system ($1.57{\times}10^{-5}Scm^{-1})$. The charge on the TFSA anion is spread very diffusely through the S-N-S core and particularly in the trifluoromethane groups, and this diffusion results in a decreased interaction between the cation and the anion. The viscosity of $P_{66614}TFSA$ (39 cP at 343 K) and $P_{66614}CH_3COO$ (124 cP at 343 K), which is very hydrophobic, was fairly high. High viscosity leads to a slow rate of diffusion of redox species. The ionic conductivity of copolymer of a phosphonium ionic liquid system also exhibits higher conductivity than that of a homopolymer system. Phosphonium ionic liquids were thermally stable at temperatures up to $400^{\circ}C$.

• Journal of the Korean Electrochemical Society
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• v.15 no.3
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• pp.135-148
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• 2012

Ionic liquids are steadily attracting interests throughout a recent decade and their application is expanding into various fields including electrochemistry due to their unique properties such as non-volatility, inflammability, low toxicity, good ionic conductivity, wide electrochemical potential window and so on. These features make ionic liquids become an alternative solution for electrodeposition of metals that cannot be electroplated in aqueous electrolytes. In this review, we classify investigated metals into three categories, which are light (Li, Mg), refractory (Ti, Ta) and noble (Pd, Pt, Au) metals, rather than covering the exhaustive list of metals and try to update the recent development in this area. In electrodeposition of light metals, granular fine Li particles were successfully obtained while the passivation of electrodeposited Mg layers is an obstacle to reversible deposition-dissolution process of Mg. In the case of refractory metals, the quality of Ta and Ti deposit particles was effectively improved with addition of LiF and pyrrole, respectively. In noble metal category, EMIM TFSA ionic liquid as an electrolyte for Au electrodeposition was proven to be effective and BMP TFSA ionic liquid developed a smooth Pd deposit. Pt nanoparticle production from ionic liquid droplet in aqueous solution can be cost-effective and display an excellent electrocatalytic activity.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.330-330
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• 2016

투명전극은 디스플레이, 터치스크린, 태양전지 등 폭넓은 분야에서 응용되고 있어 현재 각광 받는 연구 주제 중 하나이다. 특히, ITO(인듐산화물)을 이용한 투명전극은 뛰어난 효율성 때문에 가장 주목 받고 있는 전극 형태 중 하나이다. 그러나 ITO투명전극은 인듐 소재의 희소성으로 인한 자원고갈문제 및 복원력, 투명도 등에서 취약점을 지니고 있는 것으로 보고되어 있다. 이러한 ITO 투명전극의 취약점을 보완하고, 동시에 플렉서블 디스플레이(Flexible Display) 소자에 적용 가능한 대체 투명전극에 관한 연구는 현재 가장 주목할 만한 가치가 있는 연구분야로 부각되고 있다. 본 연구에서는 대체 투명전극 중 하나로 그래핀 투명전극(Graphene Transparent Electrode)을 주목했다. PEN(Polyethylene Naphthalate) 투명기판 상에 Wet-Transfer형식으로 그래핀을 전사하여 그래핀 투명전극을 구현했으며, 복원력 확인을 위해 그래핀에 2가지 (Compressive/Tensile) 압력을 가하며 구부러짐 실험(Bending Test)을 진행하며 그래핀 투명전극의 저항값을 측정했다. 일반 금속전극의 경우, 일정한 수준 이상의 압력 또는 구부러짐이 반복되는 실험의 횟수가 증가되면 원래의 복원력을 상실하며, 저항값이 상승하는 것으로 보고된바 있다. 그러나 이번 연구에서는 그래핀 투명전극을 사용해 PEN 기판 위에 투명전극을 제작한 경우, 일정한 수준의 구부러짐 반복횟수(~1,000회) 및 구부러짐 정도(~10%) 하에서 저항값이 일정하게 유지됨을 확인할 수 있었다. 별도로, 기존에 알려져 있던 순수 그래핀(Pristine Graphene)의 취약점 중 하나인 높은 저항값을 우려하여 본 연구에서는 그래핀에 도핑을 하고, 그 영향을 분석해 보았다. 그 동안 그래핀 도핑법에 대한 적지않은 연구들이 진행되었으며, 본 연구에서는 TFSA(Bis(trifluoromethanesulfonyl)amide)라는 물질을 이용한 그래핀 도핑법을 채택했다. 실험 결과, 도핑된 그래핀 투명전극은 위와 같은 수준의 그래핀 본연의 복원력을 유지하면서 저항값은 순수 그래핀 대비 약 70% 정도 낮아짐을 확인할 수 있었다. 본 연구를 통해 그래핀 투명전극이 그래핀 고유의 특성인 높은 투명도와 복원력, 도핑으로 인한 저항값 감소가능성을 확인함으로써, 그래핀 투명전극이 ITO 투명전극의 좋은 대체자가 될 수 있는 가능성을 확인할 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.23-30
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• 1999

The relationships between morphological structures and residual stress behaviors of polyimide thin films depending on isomeric diamines were investigated. For this study, Poly(phenylene biphenyltetracarboximide) (BPDA-PDA) and poly(oxydiphenylene biphenyltetracarboximide) (BPDA-ODA) films were prepared from their isomeric diamines: 1,3-phenylene diamine (1,3-PDA) 1,4-phenylene diamine (1.4-PDA), 3,4'-oxydiphenylene diamine (3,4'-ODA), and 4,4'-oxydiphenylene diamine (4,4'-ODA), respectively. For those films, residual stresses were detected in-situ during thermal imidization of the isomeric polyimide as a function of processing temperature over the range of 25~$400^{\circ}C$ using. Thin Film Stress Analyzer (TFSA). In comparison, residual stress of BPDA-1.4PDA having better in-plain orientation and chain order was the lowest value of 7MPa whereas those of BPDA-1,3-PDA, BPDA-3,4'-ODA, and BPDA-4,4'-ODA were in the range of 40-50MPa. Conclusively, the effect of morphological nature (chain rigidity, chain order, orientation) and chain mobility relating to the g1ass transition behavior on the residual stress of isomeric polyimide thin films wart analyzed.

• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.1014-1019
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• 1999

Copolyamic acid PMDA/6FDA-PDA(PAA) and homopolyamic acids PMDA-PDA(PAA) and 6FDA-PDA(PAA) were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride(PMDA) and 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride(6FDA) as the dianhydride and 1,4-phenylenediamine (PDA) as the diamine. Residual stresses were detected in-situ during thermal imidization of the co- and homopolyimide precursors as a function of processing temperature over the range of $25{\sim}400^{\circ}C$ using thin film stress analyzer(TFSA), and morphological structures were investigated by WAXD. In comparison, the resultant residual stress of polyimide films composed of different compositions decreased with the increasing content of PMDA unit in the chain and was about 5 Mpa in compression mode for PMDA-PDA. In this study, the synthesis of random PMDA/6FDA-PDA copolyimide could be completed and compensate for the difficulty of process due to high $T_g$ of PMDA-PDA and relatively higher stress of 6FDA-PDA. It showed that we can make a low level stress copolyimied having excellent mechanical properties by incorporating appropriate rod-like rigid structure PMDA-PDA unit into 6FDA-PDA polyimide backbone which generally shows higher stress due to rotational hinges such as bulky di(trifluoromethyl). Specially, PMDA/6FDA-PDA(0.9:0.1:1.0) satisfied excellent mechanical property and low level stress as an inter layer showing low dielectric constant.

• Polymer(Korea)
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• v.38 no.4
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• pp.510-517
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• 2014

A series of polyimide (PI) was prepared by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) as the anhydride and bis(3-aminophenyl) sulfone (APS), bis[4-(3-aminophenoxy)-phenyl] sulfone (BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane (6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FBAPP), 2,2'-bis(trifluoromethyl)benzidine (TFDB), or 1,4-phenylenediamine (PDA) as the diamine. Residual stress behaviors were detected in-situ during thermal imidization of the polyimide precursors using a thin film stress analyzer (TFSA), and interpreted with respect to their morphology. According to the molecular orientation and packing order, the residual stress varied from 23.1 to 12.5 MPa, decreased with increasing chain rigidity. The thermal properties of the PI films were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA). Their optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis), and spectrophotometry. The properties of PI films were found to be strongly dependent upon the morphological structure. However, trade-offs between residual stress and optical properties were identified.

• Korean Chemical Engineering Research
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• v.43 no.2
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• pp.305-312
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• 2005

Poly(urethane-imide)s were prepared by reaction between crosslinkable endgroup containing soluble polyimide (PI) by chemical imidization and acrylate end-capped polyurethane (PU). Poly (amic acid) was prepared from 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) and 4,4'-oxydianiline (ODA) and then end-capped with maleic anhydride (MA). The PU prepolymers were prepared by the reaction of polycaprolactone diol, tolylene 2,4-diisocyanate and end-capped with hydroxyl ethyl acrylate. The effect of PU content on the residual stress behavior, morphology and thermal property was studied. The poly(urethane-imide)s were characterized by thin film stress analyzer (TFSA), XRD, TGA and DMTA. Low residual stress and slope in cooling curve were achieved by higher PU content. Compared to typical polyurethane, these polymers exhibited better thermal stability due to the presence of the imide groups. Finally the residual stress of poly(urethane-imide)s was strongly affected by the morphological structure.

• Polymer(Korea)
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• v.38 no.6
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• pp.752-759
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• 2014

Crosslinked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the crosslinked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of crosslinked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the crosslinked PI makes them potential candidates for versatile high-density multi-layer structure applications.

• Journal of the Korean Electrochemical Society
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• v.12 no.3
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• pp.271-275
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• 2009

Five novel lithium polyelectrolyte-ionic liquid systems, using poly (lithium 2-acrylamido-2-methyl propanesulfonate; PAMPSLi) were prepared and their electrochemical properties were measured. The ionic conductivity of the PAMPSLi/1-ethyl-3-methylimidazolium tricyano methanide (emImTCM) system was exhibited high conductivity (1.28 $\times$ $10^{-3}$ $S/cm^{-1}$). The high conductivity and low viscosity of PAMPSLi/emImTCM system is due to the high flexibility of imidazolium cation and dissociation of lithium cation from the polymer chains. The PAMPSLi/N,N-dimethyl-N-propyl-Nbutylammonium tricyanomethanide ($N_{1134}TCM$) and PAMPSLi/N, N-dimethyl-N-propyl-N-butylammonium dicyanamide ($N_{1134}DCA$) systems showed fairly high conductivity (6.3 $\times$ $10^{-4}$ $S/cm^{-1}$, 6.0 $\times$ 10.4 S/cm.1). PAMPSLi/Trihexyl (tetradecyl) phosphonium bis (trifluoromethane sulfonyl) amide ($P_{66614}TFSA$) exhibited low conductivity (2.22 $\times$ $10^{-5}$ $Scm^{-1}$) and thermally stable over 400$^{\circ}C$.