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Resudual Stress Behavior and Characterization of Poly(urethane-imide) Crosslinked Networks  

Park, Mi-Hee (Department of Chemical Engineering, Yonsei University)
Yang, Seung-Jin (Department of Chemical Engineering, Yonsei University)
Jang, Wonbong (Department of Chemical Engineering, Yonsei University)
Han, Haksoo (Department of Chemical Engineering, Yonsei University)
Publication Information
Korean Chemical Engineering Research / v.43, no.2, 2005 , pp. 305-312 More about this Journal
Abstract
Poly(urethane-imide)s were prepared by reaction between crosslinkable endgroup containing soluble polyimide (PI) by chemical imidization and acrylate end-capped polyurethane (PU). Poly (amic acid) was prepared from 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) and 4,4'-oxydianiline (ODA) and then end-capped with maleic anhydride (MA). The PU prepolymers were prepared by the reaction of polycaprolactone diol, tolylene 2,4-diisocyanate and end-capped with hydroxyl ethyl acrylate. The effect of PU content on the residual stress behavior, morphology and thermal property was studied. The poly(urethane-imide)s were characterized by thin film stress analyzer (TFSA), XRD, TGA and DMTA. Low residual stress and slope in cooling curve were achieved by higher PU content. Compared to typical polyurethane, these polymers exhibited better thermal stability due to the presence of the imide groups. Finally the residual stress of poly(urethane-imide)s was strongly affected by the morphological structure.
Keywords
Soluble Polyimide; Polyurethane; Poly(urethane-imide); Residual Stress; Morphology; Thermal Property;
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